FR2052341A5 - - Google Patents

Info

Publication number
FR2052341A5
FR2052341A5 FR7015372A FR7015372A FR2052341A5 FR 2052341 A5 FR2052341 A5 FR 2052341A5 FR 7015372 A FR7015372 A FR 7015372A FR 7015372 A FR7015372 A FR 7015372A FR 2052341 A5 FR2052341 A5 FR 2052341A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7015372A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR2052341A5 publication Critical patent/FR2052341A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
FR7015372A 1969-06-02 1970-04-28 Expired FR2052341A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82963369A 1969-06-02 1969-06-02

Publications (1)

Publication Number Publication Date
FR2052341A5 true FR2052341A5 (fr) 1971-04-09

Family

ID=25255069

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7015372A Expired FR2052341A5 (fr) 1969-06-02 1970-04-28

Country Status (5)

Country Link
US (1) US3661761A (fr)
JP (1) JPS4822901B1 (fr)
DE (1) DE2026321A1 (fr)
FR (1) FR2052341A5 (fr)
GB (1) GB1294025A (fr)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767559A (en) * 1970-06-24 1973-10-23 Eastman Kodak Co Sputtering apparatus with accordion pleated anode means
FR2119930B1 (fr) * 1970-12-31 1974-08-19 Ibm
JPS536963Y2 (fr) * 1973-05-08 1978-02-22
JPS5441522Y2 (fr) * 1973-10-25 1979-12-05
JPS50119203U (fr) * 1974-03-14 1975-09-29
US4036723A (en) * 1975-08-21 1977-07-19 International Business Machines Corporation RF bias sputtering method for producing insulating films free of surface irregularities
GB1544172A (en) * 1976-03-03 1979-04-11 Int Plasma Corp Gas plasma reactor and process
US4035276A (en) * 1976-04-29 1977-07-12 Ibm Corporation Making coplanar layers of thin films
US4029562A (en) * 1976-04-29 1977-06-14 Ibm Corporation Forming feedthrough connections for multi-level interconnections metallurgy systems
DE2705611A1 (de) * 1977-02-10 1978-08-17 Siemens Ag Verfahren zum bedecken einer auf einem substrat befindlichen ersten schicht oder schichtenfolge mit einer weiteren zweiten schicht durch aufsputtern
US4153528A (en) * 1978-06-26 1979-05-08 International Business Machines Corporation Contoured quartz anode plate
DE3165961D1 (en) * 1980-05-12 1984-10-18 Fujitsu Ltd Method and apparatus for plasma etching
US4396458A (en) * 1981-12-21 1983-08-02 International Business Machines Corporation Method for forming planar metal/insulator structures
CA1247464A (fr) * 1985-05-13 1988-12-28 Hiroaki Nakamura Methode de fabrication de couches minces planar
US6248219B1 (en) * 1986-06-23 2001-06-19 Unaxis Balzers Aktiengesellschaft Process and apparatus for sputter etching or sputter coating
CH668565A5 (de) * 1986-06-23 1989-01-13 Balzers Hochvakuum Verfahren und anordnung zum zerstaeuben eines materials mittels hochfrequenz.
US4756810A (en) * 1986-12-04 1988-07-12 Machine Technology, Inc. Deposition and planarizing methods and apparatus
US5490910A (en) * 1992-03-09 1996-02-13 Tulip Memory Systems, Inc. Circularly symmetric sputtering apparatus with hollow-cathode plasma devices
US6942764B1 (en) 1995-08-24 2005-09-13 Taiwan Semiconductor Manufacturing Company, Ltd. Arc-sprayed shield for pre-sputter etching chamber
US6342135B1 (en) 1995-11-02 2002-01-29 Taiwan Semiconductor Manufacturing Company Sputter etching chamber with improved uniformity
US6436253B1 (en) 1998-05-20 2002-08-20 Taiwan Semiconductor Manufacturing Company Sputter etching chamber with improved uniformity
US6475400B2 (en) 2001-02-26 2002-11-05 Trw Inc. Method for controlling the sheet resistance of thin film resistors
US20040226516A1 (en) * 2003-05-13 2004-11-18 Daniel Timothy J. Wafer pedestal cover
JP5648189B2 (ja) * 2008-11-24 2015-01-07 エリコン アドバンスド テクノロジーズ アーゲー 高周波スパッタリング装置
KR101641398B1 (ko) * 2008-12-23 2016-07-20 에바텍 어드벤스드 테크놀로지스 아크티엔게젤샤프트 Ｒｆ 스퍼터링 장치
TW201425615A (zh) * 2012-12-24 2014-07-01 Hon Hai Prec Ind Co Ltd 電極及鍍膜裝置
US11469085B2 (en) 2016-12-27 2022-10-11 Evatec Ag Vacuum plasma workpiece treatment apparatus

Also Published As

Publication number Publication date
US3661761A (en) 1972-05-09
DE2026321A1 (de) 1970-12-10
JPS4822901B1 (fr) 1973-07-10
GB1294025A (en) 1972-10-25

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Legal Events

Date Code Title Description
ST Notification of lapse