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DE1204939B
(de)
*
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1964-03-07 |
1965-11-11 |
Eltro G M B H & Co Ges Fuer St |
Verfahren und Vorrichtung zur Herstellung von Spektral-Filtern in gekruemmter, vorzugsweise in sphaerisch gekruemmter Form
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JPS4947713B1
(enExample)
*
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1970-04-27 |
1974-12-17 |
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DE2203892C3
(de)
*
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1971-02-08 |
1982-05-27 |
TRW Inc., Los Angeles, Calif. |
Transistoranordnung mit mehreren zur Leistungserhöhung bei hohen Frequenzen parallel geschalteten Transistorelementen
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US3767979A
(en)
*
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1971-03-05 |
1973-10-23 |
Communications Transistor Corp |
Microwave hermetic transistor package
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GB1327352A
(en)
*
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1971-10-02 |
1973-08-22 |
Kyoto Ceramic |
Semiconductor device
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DE2250918C2
(de)
*
|
1971-10-27 |
1982-02-04 |
Westinghouse Electric Corp., 15222 Pittsburgh, Pa. |
Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung
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US3748544A
(en)
*
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1972-02-14 |
1973-07-24 |
Plessey Inc |
Laminated ceramic high-frequency semiconductor package
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US3733525A
(en)
*
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1972-03-20 |
1973-05-15 |
Collins Radio Co |
Rf microwave amplifier and carrier
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US3801938A
(en)
*
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1972-05-31 |
1974-04-02 |
Trw Inc |
Package for microwave semiconductor device
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US4396971A
(en)
*
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1972-07-10 |
1983-08-02 |
Amdahl Corporation |
LSI Chip package and method
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JPS5228547B2
(enExample)
*
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1972-07-10 |
1977-07-27 |
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JPS5758783B2
(enExample)
*
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1973-02-22 |
1982-12-11 |
Nippon Electric Co |
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US3936864A
(en)
*
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1973-05-18 |
1976-02-03 |
Raytheon Company |
Microwave transistor package
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US3946428A
(en)
*
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1973-09-19 |
1976-03-23 |
Nippon Electric Company, Limited |
Encapsulation package for a semiconductor element
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US3898594A
(en)
*
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1973-11-02 |
1975-08-05 |
Trw Inc |
Microwave semiconductor device package
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US3908185A
(en)
*
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1974-03-06 |
1975-09-23 |
Rca Corp |
High frequency semiconductor device having improved metallized patterns
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EP0001890B1
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*
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1977-10-12 |
1981-07-22 |
The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and |
Improvements in or relating to microwave integrated circuit packages
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JPS5834755Y2
(ja)
*
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1978-09-18 |
1983-08-04 |
富士通株式会社 |
半導体装置
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US4276522A
(en)
*
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1979-12-17 |
1981-06-30 |
General Dynamics |
Circulator in a stripline microwave transmission line circuit
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US4320438A
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*
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1980-05-15 |
1982-03-16 |
Cts Corporation |
Multi-layer ceramic package
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US4417392A
(en)
*
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1980-05-15 |
1983-11-29 |
Cts Corporation |
Process of making multi-layer ceramic package
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DE3201296C2
(de)
*
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1982-01-18 |
1986-06-12 |
Institut elektrodinamiki Akademii Nauk Ukrainskoj SSR, Kiev |
Transistoranordnung
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DE3409146A1
(de)
*
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1984-03-13 |
1985-09-19 |
Siemens AG, 1000 Berlin und 8000 München |
Optoelektronisches mudul
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US4611398A
(en)
*
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1984-10-09 |
1986-09-16 |
Gte Products Corporation |
Integrated circuit package
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DE3567771D1
(en)
*
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1984-11-02 |
1989-02-23 |
Siemens Ag |
Wave resistance-adapted chip support for a microwave semiconductor
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US4610032A
(en)
*
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1985-01-16 |
1986-09-02 |
At&T Bell Laboratories |
Sis mixer having thin film wrap around edge contact
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US4626805A
(en)
*
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1985-04-26 |
1986-12-02 |
Tektronix, Inc. |
Surface mountable microwave IC package
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US5014115A
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*
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1987-11-16 |
1991-05-07 |
Motorola, Inc. |
Coplanar waveguide semiconductor package
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US4897601A
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*
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1988-03-02 |
1990-01-30 |
Ball Corporation |
Test fixture for integrated circuit chips
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GB2228618B
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*
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1989-02-27 |
1993-04-14 |
Philips Electronic Associated |
Radiation detector
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US5105260A
(en)
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1989-10-31 |
1992-04-14 |
Sgs-Thomson Microelectronics, Inc. |
Rf transistor package with nickel oxide barrier
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US5109268A
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*
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1989-12-29 |
1992-04-28 |
Sgs-Thomson Microelectronics, Inc. |
Rf transistor package and mounting pad
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1991-01-17 |
1992-06-30 |
Avantek, Inc. |
Semiconductor chip header having particular surface metallization
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*
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1992-03-05 |
1994-02-01 |
Westinghouse Electric Corp. |
High power self commutating semiconductor switch
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DE69307983T2
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*
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1992-09-03 |
1997-05-28 |
Sgs Thomson Microelectronics |
Vertikal isolierter, monolithischer Hochleistungsbipolartransistor mit Topkollektor
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1993-01-29 |
1996-09-17 |
Anadigics, Inc. |
Plastic packages for microwave frequency applications
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1993-10-08 |
1995-11-07 |
Stratedge Corporation |
Ceramic microelectronics package
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*
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1993-10-08 |
1998-04-07 |
Stratedge Corporation. |
High frequency microelectronics package
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*
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1993-10-08 |
2001-01-09 |
Stratedge Corporation |
High frequency microelectronics package
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(en)
*
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1993-10-08 |
1998-05-19 |
Stratedge Corporation |
Microelectronics package
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(en)
*
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1997-03-18 |
1999-11-16 |
Raytheon Company |
Circular stripline package incorporating a MMIC low noise amplifier
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(en)
*
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1998-07-31 |
2002-06-11 |
I-Xys Corporation |
Electrically isolated power semiconductor package
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1999-03-01 |
2003-04-01 |
Micron Technology, Inc. |
Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices
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2000-07-28 |
2002-06-11 |
William T. Storey |
Capacitor with wide foil leads
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US6521972B1
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*
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2000-09-28 |
2003-02-18 |
Eic Corporation |
RF power transistor having low parasitic impedance input feed structure
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(en)
*
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2001-05-04 |
2004-05-04 |
Ixys Corporation |
High frequency power device with a plastic molded package and direct bonded substrate
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US6727585B2
(en)
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2001-05-04 |
2004-04-27 |
Ixys Corporation |
Power device with a plastic molded package and direct bonded substrate
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(en)
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2011-10-13 |
2013-07-16 |
Infineon Technologies Ag |
Low impedance gate control method and apparatus
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*
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2016-03-24 |
2017-10-03 |
Qorvo Us, Inc. |
Hermetic package with improved RF stability and performance
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