FR2025718A1 - - Google Patents

Info

Publication number
FR2025718A1
FR2025718A1 FR6942566A FR6942566A FR2025718A1 FR 2025718 A1 FR2025718 A1 FR 2025718A1 FR 6942566 A FR6942566 A FR 6942566A FR 6942566 A FR6942566 A FR 6942566A FR 2025718 A1 FR2025718 A1 FR 2025718A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR6942566A
Other languages
French (fr)
Other versions
FR2025718B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2025718A1 publication Critical patent/FR2025718A1/fr
Application granted granted Critical
Publication of FR2025718B1 publication Critical patent/FR2025718B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13034—Silicon Controlled Rectifier [SCR]
FR6942566A 1968-12-09 1969-12-09 Expired FR2025718B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78209368A 1968-12-09 1968-12-09

Publications (2)

Publication Number Publication Date
FR2025718A1 true FR2025718A1 (en) 1970-09-11
FR2025718B1 FR2025718B1 (en) 1974-05-24

Family

ID=25124923

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6942566A Expired FR2025718B1 (en) 1968-12-09 1969-12-09

Country Status (6)

Country Link
BE (1) BE742700A (en)
DE (1) DE1961230C3 (en)
FR (1) FR2025718B1 (en)
GB (1) GB1293807A (en)
IE (1) IE33405B1 (en)
SE (1) SE367281B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3247938A1 (en) * 1982-12-24 1984-07-05 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device having high reverse-voltage handling capacity

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7500492A (en) * 1975-01-16 1976-07-20 Philips Nv PROCESS FOR THE MANUFACTURE OF SEMI-GUIDE DEVICES, IN WHICH A GLASS COVER IS APPLIED, AND SEMI-GUIDE DEVICES MANUFACTURED ACCORDING TO THIS PROCESS.
JPS5776860A (en) * 1980-10-31 1982-05-14 Toshiba Corp Semiconductor device and its manufacture
US4822757A (en) * 1987-11-10 1989-04-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR827094A (en) * 1936-09-26 1938-04-15 Philips Nv Process for obtaining a vitreous layer on a support and objects obtained by this process
FR1347043A (en) * 1961-09-29 1963-12-27 Ibm Coated articles and processes for producing their protective coatings
FR1450268A (en) * 1964-10-19 1966-05-06 Siemens Ag Electrical component, in particular semiconductor component provided with an envelope of insulating substance
FR1499490A (en) * 1965-09-30 1967-10-27 Gen Electric Glass compositions, electrical devices coated with these compositions and method of manufacture thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR827094A (en) * 1936-09-26 1938-04-15 Philips Nv Process for obtaining a vitreous layer on a support and objects obtained by this process
FR1347043A (en) * 1961-09-29 1963-12-27 Ibm Coated articles and processes for producing their protective coatings
FR1450268A (en) * 1964-10-19 1966-05-06 Siemens Ag Electrical component, in particular semiconductor component provided with an envelope of insulating substance
FR1499490A (en) * 1965-09-30 1967-10-27 Gen Electric Glass compositions, electrical devices coated with these compositions and method of manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3247938A1 (en) * 1982-12-24 1984-07-05 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device having high reverse-voltage handling capacity

Also Published As

Publication number Publication date
DE1961230C3 (en) 1974-09-26
SE367281B (en) 1974-05-20
BE742700A (en) 1970-06-05
IE33405B1 (en) 1974-06-12
FR2025718B1 (en) 1974-05-24
DE1961230B2 (en) 1974-02-21
IE33405L (en) 1970-06-09
DE1961230A1 (en) 1970-06-25
GB1293807A (en) 1972-10-25

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