FR2014706A1 - - Google Patents

Info

Publication number
FR2014706A1
FR2014706A1 FR6921196A FR6921196A FR2014706A1 FR 2014706 A1 FR2014706 A1 FR 2014706A1 FR 6921196 A FR6921196 A FR 6921196A FR 6921196 A FR6921196 A FR 6921196A FR 2014706 A1 FR2014706 A1 FR 2014706A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6921196A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Optical Corp
Original Assignee
American Optical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Optical Corp filed Critical American Optical Corp
Publication of FR2014706A1 publication Critical patent/FR2014706A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
FR6921196A 1968-07-25 1969-06-25 Withdrawn FR2014706A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74756268A 1968-07-25 1968-07-25

Publications (1)

Publication Number Publication Date
FR2014706A1 true FR2014706A1 (fr) 1970-04-17

Family

ID=25005641

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6921196A Withdrawn FR2014706A1 (fr) 1968-07-25 1969-06-25

Country Status (6)

Country Link
US (1) US3586816A (fr)
AT (1) AT288120B (fr)
DE (1) DE1920880A1 (fr)
FR (1) FR2014706A1 (fr)
GB (1) GB1267377A (fr)
NL (1) NL6907823A (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154506A (en) * 1976-08-12 1979-05-15 Izon Corporation Projection lens plate for microfiche
US4252606A (en) * 1978-06-06 1981-02-24 Nicholas Sclufer Method and apparatus for confining a plasma
EP0008827B1 (fr) * 1978-08-21 1982-04-28 E.I. Du Pont De Nemours And Company Connexion électrique
CH645208A5 (de) * 1978-10-31 1984-09-14 Bbc Brown Boveri & Cie Verfahren zur herstellung von elektrischen kontakten an halbleiterbauelementen.
DE3325715A1 (de) * 1983-07-16 1985-01-24 Otto 6762 Alsenz Gampper Jun. Durchflussarmatur mit hubbegrenzung
US4758705A (en) * 1985-08-06 1988-07-19 Eastman Kodak Company Method and apparatus for texturing a roller
US4734729A (en) * 1985-08-06 1988-03-29 Eastman Kodak Company Studded squeegee roller
US4658115A (en) * 1986-01-23 1987-04-14 Vernon Heath Laser fired steam boiler
US5216543A (en) * 1987-03-04 1993-06-01 Minnesota Mining And Manufacturing Company Apparatus and method for patterning a film
DE3854564T2 (de) * 1987-07-20 1996-03-28 Mitsubishi Electric Corp Laserbearbeitungsvorrichtung.
US4914272A (en) * 1987-09-14 1990-04-03 Sony Corporation Laser beam soldering apparatus and soldering method using the same
DE3831743A1 (de) * 1988-09-17 1990-03-29 Philips Patentverwaltung Vorrichtung zur bearbeitung eines werkstueckes mit laserlicht und verwendung dieser vorrichtung
JP2663560B2 (ja) * 1988-10-12 1997-10-15 日本電気株式会社 レーザ加工装置
US5144535A (en) * 1989-04-20 1992-09-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components of a printed circuit board
US5170029A (en) * 1990-04-19 1992-12-08 Matsushita Electric Works, Ltd. Energy-beam welding method
JP2657957B2 (ja) * 1990-04-27 1997-09-30 キヤノン株式会社 投影装置及び光照射方法
JPH0770824B2 (ja) * 1991-03-04 1995-07-31 松下電器産業株式会社 電子部品接続方法
JP2658809B2 (ja) * 1992-08-27 1997-09-30 三菱電機株式会社 レーザ加工装置
US5463200A (en) * 1993-02-11 1995-10-31 Lumonics Inc. Marking of a workpiece by light energy
US5768022A (en) * 1995-03-08 1998-06-16 Brown University Research Foundation Laser diode having in-situ fabricated lens element
US5604635A (en) * 1995-03-08 1997-02-18 Brown University Research Foundation Microlenses and other optical elements fabricated by laser heating of semiconductor doped and other absorbing glasses
US5861602A (en) * 1995-07-24 1999-01-19 International Business Machines Corporation Snap together PCMCIA cards with laser tack welded seams
US5919607A (en) * 1995-10-26 1999-07-06 Brown University Research Foundation Photo-encoded selective etching for glass based microtechnology applications
GB9601049D0 (en) 1996-01-18 1996-03-20 Xaar Ltd Methods of and apparatus for forming nozzles
JP3229834B2 (ja) * 1997-04-07 2001-11-19 本田技研工業株式会社 溶接方法およびその装置
DE19961918C2 (de) * 1999-12-21 2002-01-31 Highyag Lasertechnologie Gmbh Variables Doppelfokusformungsmodul und Verfahren zu seiner Anwendung
TW586022B (en) * 2002-02-26 2004-05-01 Slight Opto Electronics Co Ltd Moire lens
JP3572404B2 (ja) * 2002-03-04 2004-10-06 日産自動車株式会社 組電池
WO2005063432A1 (fr) * 2003-12-20 2005-07-14 Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg Dispositif pour façonner une piece a usiner au laser
FR2897503B1 (fr) * 2006-02-16 2014-06-06 Valeo Sys Controle Moteur Sas Procede de fabrication d'un module electronique par fixation sequentielle des composants et ligne de production correspondante
US8334478B2 (en) * 2007-01-15 2012-12-18 Japan Unix Co., Ltd. Laser type soldering apparatus
US8344282B2 (en) * 2008-09-24 2013-01-01 Avx Corporation Laser welding of electrolytic capacitors
US8986062B2 (en) * 2013-01-18 2015-03-24 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for repairing white defect of liquid crystal display panel

Also Published As

Publication number Publication date
AT288120B (de) 1971-02-25
US3586816A (en) 1971-06-22
GB1267377A (en) 1972-03-15
DE1920880A1 (de) 1970-04-02
NL6907823A (fr) 1970-01-27

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Legal Events

Date Code Title Description
ST Notification of lapse