WO2005063432A1 - Dispositif pour façonner une piece a usiner au laser - Google Patents

Dispositif pour façonner une piece a usiner au laser Download PDF

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Publication number
WO2005063432A1
WO2005063432A1 PCT/EP2004/013712 EP2004013712W WO2005063432A1 WO 2005063432 A1 WO2005063432 A1 WO 2005063432A1 EP 2004013712 W EP2004013712 W EP 2004013712W WO 2005063432 A1 WO2005063432 A1 WO 2005063432A1
Authority
WO
WIPO (PCT)
Prior art keywords
lens
workpiece
laser light
mask
generating
Prior art date
Application number
PCT/EP2004/013712
Other languages
German (de)
English (en)
Inventor
Vitalij Lissotschenko
Original Assignee
Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg filed Critical Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg
Priority to DE112004002394T priority Critical patent/DE112004002394D2/de
Publication of WO2005063432A1 publication Critical patent/WO2005063432A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process

Definitions

  • the present invention relates to a device for machining a workpiece, comprising at least one laser light source for generating at least one laser light bundle and means for generating at least one lateral focus pattern of the at least one laser light bundle on a surface of the workpiece.
  • Laser technology has developed into one of the standard techniques for machining workpieces. Novel processes such as laser welding, laser cutting or laser drilling have become indispensable in the field of material processing and processing.
  • One of the special advantages of laser processing is that the thermal energy introduced into the workpiece can be adequately determined. With a short exposure time of the workpiece, only the workpiece surface is heated, whereas a longer exposure time leads to continuous heating of the workpiece.
  • Various laser beam processes are also used in microelectronics.
  • a photoresist of a wafer is specifically irradiated with laser light. Then, depending on the type of photoresist used, the irradiated or unirradiated areas are detached. The surface structured in this way is then coated, etched or doped over a large area.
  • small optical fiber elements which can optionally be bent, to be arranged side by side in such a way that a lateral focus pattern of the laser light is generated on the surface of the workpiece.
  • Such a mask which consists of a large number of optical fibers, is relatively difficult to manufacture.
  • the object of the present invention is to provide a device for machining a workpiece of the type mentioned at the outset, which is easier to manufacture and more flexible to handle.
  • the means for generating the lateral focus pattern comprise at least one lens mask which has a plurality of structured lens segments.
  • the lens segments are structured in such a way that they focus the at least one laser light beam on the surface of the workpiece in such a way that the desired lateral focus pattern is generated there.
  • the device according to the invention can be used, for example, to selectively remove material from the surface, so that the surface is structured. Only in the areas of the surface on which the at least one laser light bundle is focused is the thermal energy density so high that material can be removed from the surface in these areas.
  • the device can also be used, for example, to join two or more workpieces together in the area of a joint joint weld.
  • a lateral focus pattern is generated by means of the lens mask, which corresponds to the desired contour of the weld seam that connects the at least two workpieces.
  • Conventional laser light sources which can optionally be pulsed, can be used as the laser light source.
  • the structured lens segments have an optically functional interface, which is concavely shaped at least in sections, on a first side facing the surface of the workpiece during operation of the device. This means that these lens segments have a negative focal length.
  • the essentially parallel laser light beam striking the lens mask is consequently imaged in the further beam path as if it had its origin in a virtual focal point which lies in front of the laser light entry surface of the lens mask.
  • the lens mask in sections comprises essentially concave-cylindrical lens segments for generating a partially linear lateral focus pattern on the surface.
  • the lens mask can also have sections of essentially plano-concave cylindrical lens segments for generating the focus pattern which is essentially linear in sections include.
  • the side of the lens segments from which the laser light beam emerges is structured in sections in these concave-cylindrical or plano-concave-cylindrical lens segments in a channel-like manner.
  • Each of these individual concave-cylindrical or plano-concave-cylindrical lens segments can, in sections, produce an essentially linear lateral focus pattern on the surface of the workpiece.
  • the lens mask in sections comprises essentially concave-toroidal lens segments for generating a focus pattern that is curved in sections.
  • the lens mask can also comprise, in sections, essentially plano-concave toroidal lens segments for generating the focus pattern, which is curved in sections.
  • the lens mask is composed of a plurality of lens segments in the manner of a mosaic. These can be lens segments that are used to generate a linear lateral focus pattern and / or are used to generate a curved lateral focus pattern.
  • the mosaic-like structure of the lens mask from a plurality of lens segments, which in sections produce curved and / or linear focus patterns on the surface is suitable for generating any desired lateral focus patterns within certain limits, for example, in a targeted and well-defined manner and way material from the To remove the surface of the workpiece or to join two or more workpieces along a joint seam.
  • the device can have at least one homogenizer for homogenizing the at least one laser light bundle, which is arranged between the laser light source and the lens mask.
  • the means for generating the lateral focus pattern have at least one first, at least sectionally convex lens means, which is arranged between the lens mask and the workpiece.
  • the means for generating the lateral focus pattern have at least a second, at least sectionally convex lens means, which is arranged between the first lens means and the workpiece.
  • the focal length of the first lens means is greater than the focal length of the second lens means, so that the arrangement of the lens mask and the first and second lens means essentially corresponds to a conventional telescope arrangement.
  • the beam path of the device according to the invention thus forms the desired structure to be produced on the surface in the form of a reduced lateral focus pattern on the surface of the workpiece or in the region of a joint seam of two or more workpieces to be connected to one another.
  • the present invention provides a device for machining a workpiece that is simple can be produced and adapted to any lateral focus pattern within certain limits.
  • Figure 1 is a schematic representation of the beam path of an inventive device for machining a workpiece.
  • FIG. 2 shows a view of the surface of the workpiece in the direction of arrow II of FIG. 1 with a representation of lateral focus patterns and a section of a lens mask of the device according to the invention
  • Fig. 3 is a view of the lens mask in the direction of arrow I I I of Figure 1, which is constructed in sections from plano-concave-cylindrical lens segments and plano-concave-toroidal lens segments.
  • FIG. 4a is a view of a plano-concave cylindrical lens segment in the direction of arrow IVa of FIG. 4b;
  • FIG. 4b shows a plan view of the plano-concave cylindrical lens segment according to FIG. 4a;
  • FIG. 5a shows a view of a plano-concave-toroidal lens segment in the direction of the arrow Va from FIG. 5b;
  • FIG. 5b shows a plan view of the plano-concave-toroidal lens segment according to FIG. 5a.
  • the device 1 comprises a laser light source 3, which is not explicitly shown here, for generating laser light bundles 30, 31.
  • a laser light source 3 which is not explicitly shown here, for generating laser light bundles 30, 31.
  • the homogenizer can comprise, for example, an array of crossed cylindrical lenses.
  • the laser light bundles 30, 31 then strike the lens mask 10, which has a plurality of structured lens segments 100, 101, 102, 103, 104, 105, which will be discussed in more detail later.
  • the lens segments 100, 101, 102, 103, 104, 105 of the lens mask 10 have partially concave-shaped optically functional interfaces 1000 on their exit side, that is to say on their side facing the surface 20 of the workpiece 2.
  • the entry surfaces 1001 of the lens segments 100, 101, 102, 103, 104, 105, through which the laser light bundles 30, 31 enter the lens mask 10, on the other hand, are essentially planar in this exemplary embodiment.
  • the further optical structure of the device 1 essentially corresponds to that of a conventional telescope arrangement.
  • a first lens means 11 which has at least one convexly shaped optically functional interface 110
  • a second lens means 12 which also has at least one convexly shaped optically functional interface 120
  • both the first lens 11 and the second lens 12 are made plano-convex.
  • the diameter of the first lens means 1 1 is larger than that of the second lens means 12.
  • the focal length of the first lens means 1 1 is larger than that of the second lens means 12.
  • the first lens means 1 1 thus acts like a lens and the second lens means 12 like an eyepiece of a conventional telescope arrangement.
  • the laser light bundles 30, 31 are focused on the surface 20 of the workpiece 2 by means of the lens mask 10 and the first lens means 11 and the second lens means 12.
  • a lateral focus pattern 21 is generated on the surface 20 of the workpiece 2.
  • the energy density of the laser light bundles 30, 31 striking the surface 20 of the workpiece 2 is so great that material can be removed from the surface 20 of the workpiece 2 there.
  • the surface 20 of the workpiece 2 can comprise, for example, a layer that can be removed in a targeted manner by means of the device 1 according to the invention, in order to structure the surface 20 before further processing.
  • the macroscopic geometric structure of the lens mask 10 from individual, differently structured lens segments 100, 101, 102, 103, 104, 105 corresponds to the lateral focus pattern 21 to be generated on the surface 20.
  • the beam path of the device 1 according to the invention thus depicts the desired structure to be produced on the surface 20 in the form of a reduced lateral focus pattern 21 on the surface 20 of the workpiece 2.
  • FIG. 2 shows an example of a top view of the surface 20 of the workpiece 2 after processing by means of the device 1 according to the invention. Furthermore, several lateral focus patterns 21, 22, 23, 24, 25 generated on the surface 20 are shown. An essentially oval lateral focus pattern 21, two circular lateral focus patterns 22 and two multiply curved lateral focus patterns 23, 24, which consist of straight and curved sections, are shown here by way of example.
  • a lens mask 10 is used, which is composed of a total of six individual structured lens segments 100, 101, 102, 103, 104, 105.
  • two lens segments 100, 101 are essentially plano-concave cylindrical in order to produce sections of essentially linear focus patterns on the surface 20 of the workpiece.
  • the remaining lens segments are plano-concave-toroidal lens segments 102, 103, 104, 105, which produce sections that are curved and thus curve-like focus patterns on the surface 20 of the workpiece 2.
  • the circular lateral focus patterns 22 likewise shown in FIG. 2 can each be generated with the aid of a lens mask 10 which has a total of four plano-concave-toroidal lens segments 102, 103, 104, 105.
  • any other focus patterns within certain limits such as the lateral focus patterns 23, 24 consisting of sections of straight and curved areas, can consequently be generated by means of a lens mask, which is built up in sections from plano-concave-toroidal and plano-concave cylindrical lens segments.
  • a section of the lens mask 10, which is used to generate the oval focus pattern 21, is shown again in FIG. 3 in a view in the direction of the arrow I M in FIG. 1.
  • Two plano-concave-toroidal lens segments 102, 104 can be seen, between which a plano-concave-cylindrical lens segment 100 is arranged.
  • Plano-concave-toroidal lens segments 103, 105 in turn, adjoin the two plano-concave-toroidal lens segments 102, 104, between which a plano-concave-cylindrical lens means is arranged.
  • lens mask 10 which has sections of plano-concave cylindrical and / or plano-concave toroidal lens segments, largely arbitrarily shaped lateral focus patterns 21, 22, 23, 24 can be produced on the surface 20 of the workpiece 2.
  • the device according to the invention can be used, for example, for laser lithography or also for welding or soldering two or more different workpieces.
  • the lateral contour of a weld seam for example, can be predetermined.
  • Laser light sources which provide a sufficiently high energy density on the surface 20 in order to remove or melt material there can be used as the laser light source 3.
  • pulsed or continuously operated laser light sources can be used.
  • FIGS. 4a, 4b or 5a and 5b show an example of a plano-concave-cylindrical lens segment 100, 101 and a plano-concave-toroidal lens segment 102 in a side view (FIGS. 4a, 5a) or in a top view (FIGS. 4b and 5b).
  • plano-concave-cylindrical lens segment 100, 101 has an essentially concave-shaped optically functional interface 1000 on one side, whereas the optically functional interface 1001 opposite this side is essentially planar. With the aid of this plano-concave-cylindrical lens segment 100, 101, essentially linear lateral focus patterns can be generated in sections on the surface 20 of the workpiece 2.
  • the plano-concave-toroidal lens segment 102 has a curvature extending to the right, so that when in use this lens segment 102 in the lens mask 10 on the surface 20 of the workpiece 2 a leftward, curved section of a focus pattern is generated.
  • the lens mask 10 can be exchanged very simply by another lens mask, by means of which a different focus pattern can be generated on the surface.
  • a lens mask is considerably more flexible than those which have hitherto become known from the prior art, so that the device according to the invention can be used in a particularly advantageous manner, in particular in laser lithography or in laser welding.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un dispositif (1) pour façonner une pièce à usiner (2), ce dispositif comprenant au moins une source de lumière laser (3) pour générer au moins un faisceau laser (30,31), ainsi que des dispositifs pour générer au moins un modèle focal latéral (21, 22, 23, 24) du faisceau laser (30,31) sur une surface (20) de la pièce à usiner (2). L'invention est caractérisée en ce que les moyens servant à la génération du modèle focal latéral (21, 22, 23, 24) comportent au moins un masque de lentille (10) doté d'une pluralité de segments de lentilles structurés (100, 101, 102, 103, 104, 105).
PCT/EP2004/013712 2003-12-20 2004-12-02 Dispositif pour façonner une piece a usiner au laser WO2005063432A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112004002394T DE112004002394D2 (de) 2003-12-20 2004-12-02 Vorrichtung zum Bearbeiten eines Werkstücks mit Laserlicht

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10360222 2003-12-20
DE10360222.4 2003-12-20

Publications (1)

Publication Number Publication Date
WO2005063432A1 true WO2005063432A1 (fr) 2005-07-14

Family

ID=34716184

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/013712 WO2005063432A1 (fr) 2003-12-20 2004-12-02 Dispositif pour façonner une piece a usiner au laser

Country Status (2)

Country Link
DE (1) DE112004002394D2 (fr)
WO (1) WO2005063432A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090277885A1 (en) * 2008-05-12 2009-11-12 Sumitomo Electric Industries, Ltd. Laser processing apparatus and laser processing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586816A (en) * 1968-07-25 1971-06-22 American Optical Corp Spot welding system and method
WO1997034171A2 (fr) * 1996-02-28 1997-09-18 Johnson Kenneth C Scanner a microlentilles pour la microlithographie et la microscopie confocale a champ large
US5922224A (en) * 1996-02-09 1999-07-13 U.S. Philips Corporation Laser separation of semiconductor elements formed in a wafer of semiconductor material
US5932118A (en) * 1994-05-16 1999-08-03 Sanyo Electric Co., Ltd. Photoprocessing method
US6239913B1 (en) * 1997-03-10 2001-05-29 Semiconductor Energy Laboratory Co., Ltd. Laser optical apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586816A (en) * 1968-07-25 1971-06-22 American Optical Corp Spot welding system and method
US5932118A (en) * 1994-05-16 1999-08-03 Sanyo Electric Co., Ltd. Photoprocessing method
US5922224A (en) * 1996-02-09 1999-07-13 U.S. Philips Corporation Laser separation of semiconductor elements formed in a wafer of semiconductor material
WO1997034171A2 (fr) * 1996-02-28 1997-09-18 Johnson Kenneth C Scanner a microlentilles pour la microlithographie et la microscopie confocale a champ large
US6239913B1 (en) * 1997-03-10 2001-05-29 Semiconductor Energy Laboratory Co., Ltd. Laser optical apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090277885A1 (en) * 2008-05-12 2009-11-12 Sumitomo Electric Industries, Ltd. Laser processing apparatus and laser processing method

Also Published As

Publication number Publication date
DE112004002394D2 (de) 2006-11-16

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