FR2009279A1 - - Google Patents

Info

Publication number
FR2009279A1
FR2009279A1 FR6916990A FR6916990A FR2009279A1 FR 2009279 A1 FR2009279 A1 FR 2009279A1 FR 6916990 A FR6916990 A FR 6916990A FR 6916990 A FR6916990 A FR 6916990A FR 2009279 A1 FR2009279 A1 FR 2009279A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6916990A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2009279A1 publication Critical patent/FR2009279A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
FR6916990A 1968-05-24 1969-05-23 Withdrawn FR2009279A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73189968A 1968-05-24 1968-05-24

Publications (1)

Publication Number Publication Date
FR2009279A1 true FR2009279A1 (fr) 1970-01-30

Family

ID=24941379

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6916990A Withdrawn FR2009279A1 (fr) 1968-05-24 1969-05-23

Country Status (5)

Country Link
US (1) US3617373A (fr)
BE (1) BE733446A (fr)
DE (1) DE1925760B2 (fr)
FR (1) FR2009279A1 (fr)
GB (1) GB1269973A (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3851382A (en) * 1968-12-02 1974-12-03 Telefunken Patent Method of producing a semiconductor or thick film device
US3879278A (en) * 1970-07-06 1975-04-22 Airco Inc Composite cermet thin films
US3833410A (en) * 1971-12-30 1974-09-03 Trw Inc High stability thin film alloy resistors
US3978249A (en) * 1974-04-29 1976-08-31 Asg Industries, Inc. Method for producing intricate metal designs on glass
US4164754A (en) * 1974-07-16 1979-08-14 Thomson-Brandt Method of manufacturing a die designed to duplicate a video frequency signal recording
US4062102A (en) * 1975-12-31 1977-12-13 Silicon Material, Inc. Process for manufacturing a solar cell from a reject semiconductor wafer
FR2435883A1 (fr) * 1978-06-29 1980-04-04 Materiel Telephonique Circuit integre hybride et son procede de fabrication
US4224361A (en) * 1978-09-05 1980-09-23 International Business Machines Corporation High temperature lift-off technique
US4181755A (en) * 1978-11-21 1980-01-01 Rca Corporation Thin film pattern generation by an inverse self-lifting technique
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
JPS5978987A (ja) * 1982-10-29 1984-05-08 マルイ工業株式会社 金属被膜上へのパタ−ン形成方法
JPS59167096A (ja) * 1983-03-11 1984-09-20 日本電気株式会社 回路基板
CA1250155A (fr) * 1984-07-31 1989-02-21 James A. Ruf Thermometre a resistance faite de platine
US5089293A (en) * 1984-07-31 1992-02-18 Rosemount Inc. Method for forming a platinum resistance thermometer
US5063660A (en) * 1988-05-26 1991-11-12 Siemens Aktiengesellschaft Method for manufacturing preforms coated with hard solder for repairing interconnect interruptions
US6974763B1 (en) * 1994-04-13 2005-12-13 Semiconductor Energy Laboratory Co., Ltd. Method of forming semiconductor device by crystallizing amorphous silicon and forming crystallization promoting material in the same chamber
ES2238190B1 (es) * 2004-02-12 2006-06-01 Ceramica Tres Estilos, S.L. Procedimiento para la fabricacion de piezas ceramicas, de vidrio o porcelanicas con metalizacion parcial por deposicion en fase vapor y producto asi obtenido.
US7995631B2 (en) * 2006-04-14 2011-08-09 Raytheon Company Solid-state laser with spatially-tailored active ion concentration using valence conversion with surface masking and method
JP2008030992A (ja) * 2006-07-28 2008-02-14 Canon Inc 基板の製造方法、配線基板の製造方法、配線基板、電子デバイス、電子源および画像表示装置
US20080127490A1 (en) * 2006-12-01 2008-06-05 Lotes Co., Ltd. Manufacture process of connector
US7609144B2 (en) * 2006-12-08 2009-10-27 Analog Devices, Inc. High resistivity thin film composition and fabrication method
DE102009020533C5 (de) * 2009-05-08 2015-12-17 SIOS Meßtechnik GmbH Vorrichtung zur Kraftkomponentenmessung
CN102560335A (zh) * 2010-12-15 2012-07-11 鸿富锦精密工业（深圳）有限公司 外壳的制造方法及由该方法制得的外壳
CN104333981A (zh) * 2014-10-16 2015-02-04 惠州智科实业有限公司 一种led散热基板的制作方法及使用该基板的led模组

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075860A (en) * 1958-08-12 1963-01-29 Owens Illinois Glass Co Method of adhering metal to a glass base
US3110102A (en) * 1958-10-31 1963-11-12 North American Aviation Inc Method of fusion joining employing stop-off material
US3109228A (en) * 1959-08-10 1963-11-05 Thermway Ind Inc Manufacture of electric radiant heating panels
US3262900A (en) * 1963-12-19 1966-07-26 Schreiber Guldo Masking compositions for printed circuits
US3355320A (en) * 1964-05-20 1967-11-28 Trw Inc Method of forming mesh-like structure
US3406043A (en) * 1964-11-09 1968-10-15 Western Electric Co Integrated circuit containing multilayer tantalum compounds

Also Published As

Publication number Publication date
DE1925760A1 (de) 1969-12-04
BE733446A (fr) 1969-11-03
US3617373A (en) 1971-11-02
DE1925760B2 (de) 1972-02-17
GB1269973A (en) 1972-04-12

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Legal Events

Date Code Title Description
ST Notification of lapse