FR1599998A - - Google Patents
Info
- Publication number
- FR1599998A FR1599998A FR1599998DA FR1599998A FR 1599998 A FR1599998 A FR 1599998A FR 1599998D A FR1599998D A FR 1599998DA FR 1599998 A FR1599998 A FR 1599998A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/50—Alloying conductive materials with semiconductor bodies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/02—Contacts, special
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46867 | 1967-12-28 | ||
| JP468 | 1967-12-28 | ||
| JP467 | 1967-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1599998A true FR1599998A (https=) | 1970-07-20 |
Family
ID=27274263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1599998D Expired FR1599998A (https=) | 1967-12-28 | 1968-12-27 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3591838A (https=) |
| DE (1) | DE1816748C3 (https=) |
| FR (1) | FR1599998A (https=) |
| GB (1) | GB1258580A (https=) |
| NL (1) | NL151845B (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3909319A (en) * | 1971-02-23 | 1975-09-30 | Shohei Fujiwara | Planar structure semiconductor device and method of making the same |
| JPS5950212B2 (ja) * | 1978-07-28 | 1984-12-07 | 富士電機株式会社 | 半導体素子の電極の製造方法 |
| US5422513A (en) * | 1992-10-16 | 1995-06-06 | Martin Marietta Corporation | Integrated circuit chip placement in a high density interconnect structure |
| JPH10509025A (ja) * | 1994-08-26 | 1998-09-08 | アイジェン， インコーポレイテッド | 固体表面に吸着された核酸の電気的に発生した化学ルミネッセンス性検出のためのバイオセンサーおよび方法 |
| WO1997030480A1 (en) * | 1996-02-16 | 1997-08-21 | Alliedsignal Inc. | Low resistivity thin film conductor for high temperature integrated circuit electronics |
| US6150262A (en) * | 1996-03-27 | 2000-11-21 | Texas Instruments Incorporated | Silver-gold wire for wire bonding |
| US6873020B2 (en) * | 2002-02-22 | 2005-03-29 | North Carolina State University | High/low work function metal alloys for integrated circuit electrodes |
| JP7271166B2 (ja) * | 2018-12-21 | 2023-05-11 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE637621A (https=) * | 1962-05-25 | 1900-01-01 | ||
| NL297607A (https=) * | 1962-09-07 | |||
| US3432913A (en) * | 1962-12-26 | 1969-03-18 | Philips Corp | Method of joining a semi-conductor to a base |
| US3324357A (en) * | 1964-01-29 | 1967-06-06 | Int Standard Electric Corp | Multi-terminal semiconductor device having active element directly mounted on terminal leads |
-
1968
- 1968-12-17 GB GB1258580D patent/GB1258580A/en not_active Expired
- 1968-12-23 DE DE1816748A patent/DE1816748C3/de not_active Expired
- 1968-12-23 US US786005A patent/US3591838A/en not_active Expired - Lifetime
- 1968-12-27 FR FR1599998D patent/FR1599998A/fr not_active Expired
- 1968-12-27 NL NL686818715A patent/NL151845B/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE1816748C3 (de) | 1979-02-22 |
| US3591838A (en) | 1971-07-06 |
| DE1816748B2 (de) | 1972-01-27 |
| NL151845B (nl) | 1976-12-15 |
| GB1258580A (https=) | 1971-12-30 |
| NL6818715A (https=) | 1969-07-01 |
| DE1816748A1 (de) | 1969-07-24 |