FR1572799A - - Google Patents

Info

Publication number
FR1572799A
FR1572799A FR1572799DA FR1572799A FR 1572799 A FR1572799 A FR 1572799A FR 1572799D A FR1572799D A FR 1572799DA FR 1572799 A FR1572799 A FR 1572799A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1572799A publication Critical patent/FR1572799A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1034Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1461Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469Circuit made after mounting or encapsulation of the components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
FR1572799D 1967-07-03 1968-07-03 Expired FR1572799A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65072967A 1967-07-03 1967-07-03

Publications (1)

Publication Number Publication Date
FR1572799A true FR1572799A (fr) 1969-06-27

Family

ID=24610048

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1572799D Expired FR1572799A (fr) 1967-07-03 1968-07-03

Country Status (4)

Country Link
US (1) US3459999A (fr)
DE (1) DE1766688B1 (fr)
FR (1) FR1572799A (fr)
GB (2) GB1201285A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3033881A1 (de) * 1980-09-09 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Gehaeuseloses schaltungsmodul und verfahren zu seiner herstellung
JPS5961152A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 半導体装置
US4674007A (en) * 1985-06-07 1987-06-16 Microscience Corporation Method and apparatus for facilitating production of electronic circuit boards
GB2204184A (en) * 1987-04-29 1988-11-02 Stanley Bracey Mounting electronic components on substrates
GB2255675B (en) * 1991-05-10 1995-09-27 Technophone Ltd Circuit assembly

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2862992A (en) * 1954-05-03 1958-12-02 Bell Telephone Labor Inc Electrical network assembly
DE1060004B (de) * 1957-11-05 1959-06-25 Standard Elek K Lorenz Ag Steckeranordnung fuer auf Isolierstoffplatten angeordnete gedruckte Leitungen
DE1171038B (de) * 1958-11-28 1964-05-27 Siemens Ag Gruppe elektrischer Bauelemente, die in einem gegebenenfalls mit einem metallischen Gehaeuse umgebenen Vergussmasseblock eingebettet ist
DE1815081U (de) * 1959-01-16 1960-07-21 Standard Elek K Lorenz Aktieng Loetoese fuer auf einer isolierplatte aufgebrachte gedruckte schaltungen.
DE1081523B (de) * 1959-04-17 1960-05-12 Standard Elektrik Lorenz Ag Anordnung fuer Loetstuetzpunkte auf Isolierstoffplatten
DE1132202B (de) * 1959-05-06 1962-06-28 Texas Instruments Inc Anordnung und Verfahren zum schaltungsmaessigen Verbinden einer Anzahl von uebereinandergestapelten Schaltplatten in Modulbauweise
US3247575A (en) * 1960-05-09 1966-04-26 Burroughs Corp Method for encapsulating electrical components
DE1116756B (de) * 1960-07-29 1961-11-09 Gottfried Neumann Verfahren zur mechanischen Halterung elektrischer Bauteile an Grundplatten und nach diesem Verfahren hergestellte elektrische Einrichtung
US3193731A (en) * 1961-08-21 1965-07-06 Automatic Elect Lab Printed matrix board assembly
DE1192716B (de) * 1961-08-28 1965-05-13 Elektro App Werke Berlin Trept Steckkontaktanordnung mit einer gedruckten oder geaetzten Leiterplatte fuer elektrische Steuerungs- und Regelungsanlagen
FR1422818A (fr) * 1962-12-29 1966-01-03 Texas Instruments Inc Dispositif de montage d'éléments électroniques modulaires
DE1947159U (de) * 1963-02-09 1966-10-06 Bbc Brown Boveri & Cie Anordnung zur herstellung elektrischer schaltungen, vorzugsweise zum aufbau elektronischer anlagen.
US3316618A (en) * 1963-12-09 1967-05-02 Rca Corp Method of making connection to stacked printed circuit boards
DE1232623B (de) * 1964-05-16 1967-01-19 Licentia Gmbh Flachbaugruppen fuer die Verschaltung von elektrischen Bauelementen
FR1455476A (fr) * 1965-10-12 1966-04-01 Corning Glass Works Enceinte pour dispositif électronique et procédé de fabrication de celle-ci
DE1657287C3 (de) * 1967-05-30 1974-01-31 Walter Dr. 4930 Detmold Kanne Mundpflegegerät

Also Published As

Publication number Publication date
GB1201285A (en) 1970-08-05
DE1766688B1 (de) 1971-01-28
US3459999A (en) 1969-08-05
GB1201284A (en) 1970-08-05

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Legal Events

Date Code Title Description
ST Notification of lapse