FR1559706A - - Google Patents

Info

Publication number
FR1559706A
FR1559706A FR1559706DA FR1559706A FR 1559706 A FR1559706 A FR 1559706A FR 1559706D A FR1559706D A FR 1559706DA FR 1559706 A FR1559706 A FR 1559706A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1559706A publication Critical patent/FR1559706A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/08—Removing material, e.g. by cutting, by hole drilling
    • B23K15/085—Boring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Physical Vapour Deposition (AREA)
FR1559706D 1967-02-14 1967-12-15 Expired FR1559706A (enEXAMPLES)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61596867A 1967-02-14 1967-02-14

Publications (1)

Publication Number Publication Date
FR1559706A true FR1559706A (enEXAMPLES) 1969-03-14

Family

ID=24467503

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1559706D Expired FR1559706A (enEXAMPLES) 1967-02-14 1967-12-15

Country Status (4)

Country Link
US (1) US3562009A (enEXAMPLES)
BE (1) BE708352A (enEXAMPLES)
FR (1) FR1559706A (enEXAMPLES)
NL (1) NL6801963A (enEXAMPLES)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996012830A1 (en) * 1994-10-20 1996-05-02 Electro Scientific Industries, Inc. Laser method for plating vias

Families Citing this family (49)

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US3656988A (en) * 1969-02-27 1972-04-18 Watch Stones Co Ltd Method for the fabrication of holes in a workpiece by means of laser-beams and apparatus for the performance of the aforesaid method
US3804667A (en) * 1969-09-30 1974-04-16 Techni Tool Inc Method for opening eyelet holes in printed circuit boards
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
DE2230578A1 (de) * 1972-06-22 1974-01-17 Dynamit Nobel Ag Antistatischer und/oder elektrisch leitfaehiger bodenbelag sowie verfahren zu seiner herstellung
US3934109A (en) * 1972-06-23 1976-01-20 The Torrington Company Latch pivot for latch needle
US4042006A (en) * 1973-01-05 1977-08-16 Siemens Aktiengesellschaft Pyrolytic process for producing a band-shaped metal layer on a substrate
US4059707A (en) * 1975-08-29 1977-11-22 Rca Corporation Method of filling apertures with crystalline material
US4074616A (en) * 1975-09-02 1978-02-21 Caterpillar Tractor Co. Aluminum piston with steel reinforced piston ring grooves
US4030190A (en) * 1976-03-30 1977-06-21 International Business Machines Corporation Method for forming a multilayer printed circuit board
US4071932A (en) * 1976-10-28 1978-02-07 Standaart Adrian W Method of making electron guns for cathode ray tubes and the like
US4183137A (en) * 1977-02-15 1980-01-15 Lomerson Robert B Method for metalizing holes in insulation material
US4341942A (en) * 1978-10-31 1982-07-27 International Business Machines Corporation Method of bonding wires to passivated chip microcircuit conductors
US4258468A (en) * 1978-12-14 1981-03-31 Western Electric Company, Inc. Forming vias through multilayer circuit boards
US4224493A (en) * 1978-12-22 1980-09-23 Siegfried Pretzsch Contact switch arrangement
JPS6351398B2 (enEXAMPLES) * 1979-11-16 1988-10-13 Rabato Bogadasu Romasun
US4348253A (en) * 1981-11-12 1982-09-07 Rca Corporation Method for fabricating via holes in a semiconductor wafer
US4627565A (en) * 1982-03-18 1986-12-09 Lomerson Robert B Mechanical bonding of surface conductive layers
US4458134A (en) * 1982-06-30 1984-07-03 Burroughs Corporation Method and apparatus for drilling holes with a laser
US4445978A (en) * 1983-03-09 1984-05-01 Rca Corporation Method for fabricating via connectors through semiconductor wafers
US4628174A (en) * 1984-09-17 1986-12-09 General Electric Company Forming electrical conductors in long microdiameter holes
DE271426T1 (de) * 1986-11-07 1989-01-05 United Technologies Corp., Hartford, Conn. Verfahren zur herstellung eines multimetallischen gegenstandes.
US4808273A (en) * 1988-05-10 1989-02-28 Avantek, Inc. Method of forming completely metallized via holes in semiconductors
US4842699A (en) * 1988-05-10 1989-06-27 Avantek, Inc. Method of selective via-hole and heat sink plating using a metal mask
US4925723A (en) * 1988-09-29 1990-05-15 Microwave Power, Inc. Microwave integrated circuit substrate including metal filled via holes and method of manufacture
US4978639A (en) * 1989-01-10 1990-12-18 Avantek, Inc. Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips
US5189261A (en) * 1990-10-09 1993-02-23 Ibm Corporation Electrical and/or thermal interconnections and methods for obtaining such
US5483100A (en) * 1992-06-02 1996-01-09 Amkor Electronics, Inc. Integrated circuit package with via interconnections formed in a substrate
US5584956A (en) * 1992-12-09 1996-12-17 University Of Iowa Research Foundation Method for producing conductive or insulating feedthroughs in a substrate
US5871868A (en) * 1993-02-26 1999-02-16 General Dynamics Information Systems, Inc. Apparatus and method for machining conductive structures on substrates
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
KR100764582B1 (ko) * 1999-08-11 2007-10-09 테세라, 인코포레이티드 기상 접속 기술
US6675469B1 (en) 1999-08-11 2004-01-13 Tessera, Inc. Vapor phase connection techniques
US6848177B2 (en) * 2002-03-28 2005-02-01 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US6908845B2 (en) * 2002-03-28 2005-06-21 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US20030183943A1 (en) * 2002-03-28 2003-10-02 Swan Johanna M. Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
JP2004243404A (ja) * 2003-02-17 2004-09-02 Internatl Business Mach Corp <Ibm> 穴形成方法および穴形成装置
CN1961621A (zh) * 2004-04-29 2007-05-09 西门子公司 用于在印刷电路板构造上制造通孔的方法
WO2006003097A1 (de) * 2004-06-30 2006-01-12 Siemens Aktiengesellschaft Verfahren zur herstellung von durchkontaktierungen aufweisenden leiterplattengebilden, elektronische geräteeinheit und verwendung einer flexiblen leiterbahnenfolie in einer solchen geräteeinheit
US8569632B2 (en) * 2006-10-16 2013-10-29 Napra Co., Ltd. Wiring board having through hole or non-through hole, and method for producing the same
US7674997B2 (en) * 2006-10-17 2010-03-09 Johns Manville Spinner for fiberizing glass and method
US20090057282A1 (en) * 2007-08-15 2009-03-05 Chunfu Huang Laser machining method utilizing variable inclination angle
US8609512B2 (en) * 2009-03-27 2013-12-17 Electro Scientific Industries, Inc. Method for laser singulation of chip scale packages on glass substrates
DE102010025966B4 (de) 2010-07-02 2012-03-08 Schott Ag Interposer und Verfahren zum Herstellen von Löchern in einem Interposer
DE102010025967B4 (de) * 2010-07-02 2015-12-10 Schott Ag Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer
JP5587219B2 (ja) * 2011-01-28 2014-09-10 サンコール株式会社 ステンレス鋼への導電材料の接合方法
US8951350B2 (en) * 2011-05-03 2015-02-10 United Technologies Corporation Coating methods and apparatus
US9951420B2 (en) * 2014-11-10 2018-04-24 Sol Voltaics Ab Nanowire growth system having nanoparticles aerosol generator
CN104661450B (zh) * 2015-02-16 2018-05-04 珠海元盛电子科技股份有限公司 一种基于激光钻孔直接孔金属化的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996012830A1 (en) * 1994-10-20 1996-05-02 Electro Scientific Industries, Inc. Laser method for plating vias

Also Published As

Publication number Publication date
NL6801963A (enEXAMPLES) 1968-08-15
US3562009A (en) 1971-02-09
BE708352A (enEXAMPLES) 1968-05-02

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Legal Events

Date Code Title Description
ST Notification of lapse