FR1542072A - Perfectionnements aux dispositifs semiconducteurs, à montage par pression - Google Patents

Perfectionnements aux dispositifs semiconducteurs, à montage par pression

Info

Publication number
FR1542072A
FR1542072A FR126325A FR126325A FR1542072A FR 1542072 A FR1542072 A FR 1542072A FR 126325 A FR126325 A FR 126325A FR 126325 A FR126325 A FR 126325A FR 1542072 A FR1542072 A FR 1542072A
Authority
FR
France
Prior art keywords
snap
semiconductor
fit device
device enhancements
enhancements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR126325A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US590758A external-priority patent/US3401315A/en
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Priority to FR126325A priority Critical patent/FR1542072A/fr
Application granted granted Critical
Publication of FR1542072A publication Critical patent/FR1542072A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
FR126325A 1966-10-31 1967-10-30 Perfectionnements aux dispositifs semiconducteurs, à montage par pression Expired FR1542072A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR126325A FR1542072A (fr) 1966-10-31 1967-10-30 Perfectionnements aux dispositifs semiconducteurs, à montage par pression

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US590758A US3401315A (en) 1966-10-31 1966-10-31 Compression assembled semiconductor device using spherical force transmitting member
FR126325A FR1542072A (fr) 1966-10-31 1967-10-30 Perfectionnements aux dispositifs semiconducteurs, à montage par pression

Publications (1)

Publication Number Publication Date
FR1542072A true FR1542072A (fr) 1968-10-11

Family

ID=26180395

Family Applications (1)

Application Number Title Priority Date Filing Date
FR126325A Expired FR1542072A (fr) 1966-10-31 1967-10-30 Perfectionnements aux dispositifs semiconducteurs, à montage par pression

Country Status (1)

Country Link
FR (1) FR1542072A (fr)

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