FR1522732A - Perfectionnements aux dispositifs semiconducteurs - Google Patents
Perfectionnements aux dispositifs semiconducteursInfo
- Publication number
- FR1522732A FR1522732A FR106012A FR106012A FR1522732A FR 1522732 A FR1522732 A FR 1522732A FR 106012 A FR106012 A FR 106012A FR 106012 A FR106012 A FR 106012A FR 1522732 A FR1522732 A FR 1522732A
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- device enhancements
- enhancements
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US549671A US3382419A (en) | 1966-05-12 | 1966-05-12 | Large area wafer semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1522732A true FR1522732A (fr) | 1968-04-26 |
Family
ID=24193962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR106012A Expired FR1522732A (fr) | 1966-05-12 | 1967-05-11 | Perfectionnements aux dispositifs semiconducteurs |
Country Status (4)
Country | Link |
---|---|
US (1) | US3382419A (fr) |
FR (1) | FR1522732A (fr) |
GB (1) | GB1117299A (fr) |
NL (1) | NL6706295A (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5105262A (en) * | 1988-09-19 | 1992-04-14 | Ford Motor Company | Thick film circuit housing assembly design |
US6845664B1 (en) | 2002-10-03 | 2005-01-25 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | MEMS direct chip attach packaging methodologies and apparatuses for harsh environments |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL261783A (fr) * | 1960-04-09 | 1900-01-01 | ||
DE1439062A1 (de) * | 1961-01-28 | 1969-10-23 | Siemens Ag | Halbleiterzelle mit einer gekapselten Halbleiteranordnung mit vier Schichten von abwechselnd gegensaetzlichem Leitfaehigkeitstyp und Verfahren zu ihrer Herstellung |
BE638960A (fr) * | 1962-10-23 | |||
US3296501A (en) * | 1962-11-07 | 1967-01-03 | Westinghouse Electric Corp | Metallic ceramic composite contacts for semiconductor devices |
US3273029A (en) * | 1963-08-23 | 1966-09-13 | Hoffman Electronics Corp | Method of attaching leads to a semiconductor body and the article formed thereby |
-
1966
- 1966-05-12 US US549671A patent/US3382419A/en not_active Expired - Lifetime
-
1967
- 1967-03-29 GB GB14246/67A patent/GB1117299A/en not_active Expired
- 1967-05-05 NL NL6706295A patent/NL6706295A/xx unknown
- 1967-05-11 FR FR106012A patent/FR1522732A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US3382419A (en) | 1968-05-07 |
GB1117299A (en) | 1968-06-19 |
NL6706295A (fr) | 1967-11-13 |
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