FR1522732A - Perfectionnements aux dispositifs semiconducteurs - Google Patents

Perfectionnements aux dispositifs semiconducteurs

Info

Publication number
FR1522732A
FR1522732A FR106012A FR106012A FR1522732A FR 1522732 A FR1522732 A FR 1522732A FR 106012 A FR106012 A FR 106012A FR 106012 A FR106012 A FR 106012A FR 1522732 A FR1522732 A FR 1522732A
Authority
FR
France
Prior art keywords
semiconductor device
device enhancements
enhancements
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR106012A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Application granted granted Critical
Publication of FR1522732A publication Critical patent/FR1522732A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)
FR106012A 1966-05-12 1967-05-11 Perfectionnements aux dispositifs semiconducteurs Expired FR1522732A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US549671A US3382419A (en) 1966-05-12 1966-05-12 Large area wafer semiconductor device

Publications (1)

Publication Number Publication Date
FR1522732A true FR1522732A (fr) 1968-04-26

Family

ID=24193962

Family Applications (1)

Application Number Title Priority Date Filing Date
FR106012A Expired FR1522732A (fr) 1966-05-12 1967-05-11 Perfectionnements aux dispositifs semiconducteurs

Country Status (4)

Country Link
US (1) US3382419A (fr)
FR (1) FR1522732A (fr)
GB (1) GB1117299A (fr)
NL (1) NL6706295A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105262A (en) * 1988-09-19 1992-04-14 Ford Motor Company Thick film circuit housing assembly design
US6845664B1 (en) 2002-10-03 2005-01-25 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration MEMS direct chip attach packaging methodologies and apparatuses for harsh environments

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL261783A (fr) * 1960-04-09 1900-01-01
DE1439062A1 (de) * 1961-01-28 1969-10-23 Siemens Ag Halbleiterzelle mit einer gekapselten Halbleiteranordnung mit vier Schichten von abwechselnd gegensaetzlichem Leitfaehigkeitstyp und Verfahren zu ihrer Herstellung
BE638960A (fr) * 1962-10-23
US3296501A (en) * 1962-11-07 1967-01-03 Westinghouse Electric Corp Metallic ceramic composite contacts for semiconductor devices
US3273029A (en) * 1963-08-23 1966-09-13 Hoffman Electronics Corp Method of attaching leads to a semiconductor body and the article formed thereby

Also Published As

Publication number Publication date
US3382419A (en) 1968-05-07
GB1117299A (en) 1968-06-19
NL6706295A (fr) 1967-11-13

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