FR1439326A - Contacts métalliques pour dispositifs semi-conducteurs - Google Patents

Contacts métalliques pour dispositifs semi-conducteurs

Info

Publication number
FR1439326A
FR1439326A FR14973A FR14973A FR1439326A FR 1439326 A FR1439326 A FR 1439326A FR 14973 A FR14973 A FR 14973A FR 14973 A FR14973 A FR 14973A FR 1439326 A FR1439326 A FR 1439326A
Authority
FR
France
Prior art keywords
semiconductor devices
metal contacts
contacts
metal
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR14973A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US363197A external-priority patent/US3290570A/en
Priority claimed from US405461A external-priority patent/US3341753A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of FR1439326A publication Critical patent/FR1439326A/fr
Expired legal-status Critical Current

Links

Classifications

    • H10P95/00—
    • H10W20/40—
    • H10W20/425—
    • H10W72/90—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H10W72/01938—
    • H10W72/01951—
    • H10W72/075—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/923—
    • H10W72/952—
    • H10W90/753—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
FR14973A 1964-04-28 1965-04-28 Contacts métalliques pour dispositifs semi-conducteurs Expired FR1439326A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US363197A US3290570A (en) 1964-04-28 1964-04-28 Multilevel expanded metallic contacts for semiconductor devices
US405461A US3341753A (en) 1964-10-21 1964-10-21 Metallic contacts for semiconductor devices

Publications (1)

Publication Number Publication Date
FR1439326A true FR1439326A (fr) 1966-05-20

Family

ID=27001945

Family Applications (1)

Application Number Title Priority Date Filing Date
FR14973A Expired FR1439326A (fr) 1964-04-28 1965-04-28 Contacts métalliques pour dispositifs semi-conducteurs

Country Status (4)

Country Link
FR (1) FR1439326A (enExample)
GB (1) GB1104804A (enExample)
MY (1) MY6900255A (enExample)
NL (1) NL145989B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2027664A1 (enExample) * 1969-01-02 1970-10-02 Philips Nv
FR2170846A1 (enExample) * 1972-02-03 1973-09-21 Garyainov Stanislav

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1283970B (de) * 1966-03-19 1968-11-28 Siemens Ag Metallischer Kontakt an einem Halbleiterbauelement
CN111739806B (zh) * 2020-07-01 2024-09-20 中国科学院上海技术物理研究所 一种小中心距焦平面探测器的铟球阵列制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2027664A1 (enExample) * 1969-01-02 1970-10-02 Philips Nv
FR2170846A1 (enExample) * 1972-02-03 1973-09-21 Garyainov Stanislav

Also Published As

Publication number Publication date
MY6900255A (en) 1969-12-31
NL145989B (nl) 1975-05-15
GB1104804A (en) 1968-02-28
NL6505284A (enExample) 1965-10-29

Similar Documents

Publication Publication Date Title
FR1467117A (fr) Ensemble semi-conducteur pour circuit intégré
FR1505266A (fr) Support de refroidissement pour dispositifs semiconducteurs
CH432661A (de) Halbleitervorrichtung
BR6571096D0 (pt) Dispositivos semicondutores
MY6900229A (en) Semiconductor devices
FR1427316A (fr) Procédé pour fabriquer des dispositifs à semi-conducteurs
GB1119570A (en) Semiconductor devices
CH424995A (de) Halbleitervorrichtung
FR1441009A (fr) Perfectionnements apportés aux dispositifs de contact pour interrupteurs à semiconducteur
FR1439326A (fr) Contacts métalliques pour dispositifs semi-conducteurs
FR1536321A (fr) Contacts ohmiques pour des dispositifs à semi-conducteurs
FR1459892A (fr) Dispositifs semi-conducteurs
FR1430747A (fr) Dispositif semi-conducteur pour courants intenses
FR1449089A (fr) Dispositifs semi-conducteurs
CH422168A (de) Halbleiteranordnung
FR1400150A (fr) Dispositifs semi-conducteurs perfectionnés
FR1442863A (fr) Alliage de contact pour semi-conducteurs
GB1124657A (en) Semiconductor device
BE755371A (fr) Contacts ohmiques pour dispositifs semi-conducteurs
FR1431304A (fr) Perfectionnements apportés aux organes de contact pour dispositifs semiconducteurs
FR1389203A (fr) Agencement pour dispositifs semi-conducteurs
FR1388169A (fr) Dispositifs semiconducteurs
FR1421002A (fr) Dispositifs de levage
FR1445215A (fr) Perfectionnements apportés à des dispositifs semiconducteurs
GB1121495A (en) Semiconductor device