FR1236322A - Perfectionnements au refroidissement des dispositifs semi-conducteurs - Google Patents

Perfectionnements au refroidissement des dispositifs semi-conducteurs

Info

Publication number
FR1236322A
FR1236322A FR805644A FR805644A FR1236322A FR 1236322 A FR1236322 A FR 1236322A FR 805644 A FR805644 A FR 805644A FR 805644 A FR805644 A FR 805644A FR 1236322 A FR1236322 A FR 1236322A
Authority
FR
France
Prior art keywords
semiconductor device
device cooling
cooling improvements
semiconductor
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR805644A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stone J and Co Ltd
Original Assignee
Stone J and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stone J and Co Ltd filed Critical Stone J and Co Ltd
Application granted granted Critical
Publication of FR1236322A publication Critical patent/FR1236322A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
FR805644A 1958-09-25 1959-09-21 Perfectionnements au refroidissement des dispositifs semi-conducteurs Expired FR1236322A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3074258A GB881571A (en) 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices

Publications (1)

Publication Number Publication Date
FR1236322A true FR1236322A (fr) 1960-07-15

Family

ID=10312426

Family Applications (1)

Application Number Title Priority Date Filing Date
FR805644A Expired FR1236322A (fr) 1958-09-25 1959-09-21 Perfectionnements au refroidissement des dispositifs semi-conducteurs

Country Status (6)

Country Link
BE (1) BE583030A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE1205196B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ES (1) ES251880A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR1236322A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB881571A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (2) NL293350A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2236272A1 (en) * 1973-07-06 1975-01-31 Siemens Ag Power semiconductor metal heat sink - uses intermediate metal block for semiconductor and heat sink connection

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
FR2495846A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de connexion electrique a haute densite de contacts
EP0198378A3 (en) * 1985-04-08 1986-12-30 Otis Elevator Company Apparatus for removing heat from electrical components, and method of manufacturing such apparatus
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
EP1691595A3 (de) * 2005-02-10 2012-01-18 Behr-Hella Thermocontrol GmbH Gebläseregler für ein Fahrzeug

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB321299A (en) * 1952-01-22 1929-11-07 William Charles King Improvements in or relating to heating buildings by electricity
BE565471A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1957-03-08
DE1751741U (de) * 1957-05-17 1957-09-05 Telefunken Gmbh Gehaeuseanordnung zur kuehlung von leistungskristalloden.
DE1768720U (de) * 1957-12-16 1958-06-19 Licentia Gmbh Einrichtung zur kuehlung von transistoren.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2236272A1 (en) * 1973-07-06 1975-01-31 Siemens Ag Power semiconductor metal heat sink - uses intermediate metal block for semiconductor and heat sink connection

Also Published As

Publication number Publication date
BE583030A (fr) 1960-01-18
ES251880A1 (es) 1960-03-16
NL293350A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL243350A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE1205196B (de) 1965-11-18
GB881571A (en) 1961-11-08

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