FR1229501A - Culot de montage d'un dispositif semi-conducteur sur un support - Google Patents

Culot de montage d'un dispositif semi-conducteur sur un support

Info

Publication number
FR1229501A
FR1229501A FR799775A FR799775A FR1229501A FR 1229501 A FR1229501 A FR 1229501A FR 799775 A FR799775 A FR 799775A FR 799775 A FR799775 A FR 799775A FR 1229501 A FR1229501 A FR 1229501A
Authority
FR
France
Prior art keywords
mounting
support
base
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR799775A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of FR1229501A publication Critical patent/FR1229501A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
FR799775A 1958-07-10 1959-07-09 Culot de montage d'un dispositif semi-conducteur sur un support Expired FR1229501A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US747706A US2990501A (en) 1958-07-10 1958-07-10 Novel header of semiconductor devices

Publications (1)

Publication Number Publication Date
FR1229501A true FR1229501A (fr) 1960-09-07

Family

ID=25006280

Family Applications (1)

Application Number Title Priority Date Filing Date
FR799775A Expired FR1229501A (fr) 1958-07-10 1959-07-09 Culot de montage d'un dispositif semi-conducteur sur un support

Country Status (5)

Country Link
US (1) US2990501A (fr)
CH (1) CH344333A (fr)
DE (1) DE1188211B (fr)
FR (1) FR1229501A (fr)
GB (1) GB920001A (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3122679A (en) * 1959-10-05 1964-02-25 Hubert H Hoeltje Jr Transistor mounting pad
US3249826A (en) * 1961-04-05 1966-05-03 Gen Electric Semiconductor device mounting having one portion of the semiconductor secured to a lead
US3284675A (en) * 1961-04-05 1966-11-08 Gen Electric Semiconductor device including contact and housing structures
NL280224A (fr) * 1961-06-28
US3195026A (en) * 1962-09-21 1965-07-13 Westinghouse Electric Corp Hermetically enclosed semiconductor device
US3335365A (en) * 1963-01-18 1967-08-08 Amp Inc Method of measuring interface resistance in electrical connections
US3239596A (en) * 1963-02-25 1966-03-08 Sylvania Electric Prod Support for electrical elements having separate conductive segments for connecting the elements to support leads
DE3217017A1 (de) * 1982-05-06 1983-11-10 Siemens AG, 1000 Berlin und 8000 München Leiterplatte mit bauelementen
US4606120A (en) * 1983-10-26 1986-08-19 General Electric Company Process for mounting components on a printed circuit board
US5148264A (en) * 1990-05-02 1992-09-15 Harris Semiconductor Patents, Inc. High current hermetic package
DE4436903C2 (de) * 1994-10-15 2003-10-30 Daimler Chrysler Ag Anordnung zur elektromagnetischen Abschirmung von elektronischen Schaltungen und Verfahren zur Herstellung einer solchen Anordnung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1454997A (en) * 1922-04-18 1923-05-15 Greco Gaetano Crystal detector
US1794037A (en) * 1928-12-31 1931-02-24 Mallory & Co Inc P R Electric-current rectifier
US2734102A (en) * 1949-03-31 1956-02-07 Jacques i
USB134657I5 (fr) * 1949-12-23
GB753488A (en) * 1953-07-10 1956-07-25 Standard Telephones Cables Ltd Improvements in or relating to electrical couplings to semiconductor elements
DE950491C (de) * 1951-09-15 1956-10-11 Gen Electric Gleichrichterelement
FR1178183A (fr) * 1956-08-28 1959-05-05 Licentia Gmbh Socle de fixation d'éléments de construction électriques

Also Published As

Publication number Publication date
GB920001A (en) 1963-03-06
US2990501A (en) 1961-06-27
DE1188211B (de) 1965-03-04
CH344333A (fr) 1960-01-31

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