FR1137395A - Perfectionnement aux dispositifs de refroidissement des éléments redresseurs de grande puissance à semi-conducteurs - Google Patents

Perfectionnement aux dispositifs de refroidissement des éléments redresseurs de grande puissance à semi-conducteurs

Info

Publication number
FR1137395A
FR1137395A FR1137395DA FR1137395A FR 1137395 A FR1137395 A FR 1137395A FR 1137395D A FR1137395D A FR 1137395DA FR 1137395 A FR1137395 A FR 1137395A
Authority
FR
France
Prior art keywords
improvement
high power
power semiconductor
cooling devices
rectifier elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Application granted granted Critical
Publication of FR1137395A publication Critical patent/FR1137395A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR1137395D 1955-07-06 1955-07-06 Perfectionnement aux dispositifs de refroidissement des éléments redresseurs de grande puissance à semi-conducteurs Expired FR1137395A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1188729X 1955-07-06

Publications (1)

Publication Number Publication Date
FR1137395A true FR1137395A (fr) 1957-05-28

Family

ID=9665441

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1137395D Expired FR1137395A (fr) 1955-07-06 1955-07-06 Perfectionnement aux dispositifs de refroidissement des éléments redresseurs de grande puissance à semi-conducteurs

Country Status (5)

Country Link
BE (1) BE549283A (is")
DE (1) DE1188729B (is")
FR (1) FR1137395A (is")
GB (1) GB791491A (is")
NL (2) NL208738A (is")

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2125380A1 (is") * 1971-02-13 1972-09-29 Bbc Brown Boveri & Cie

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1106423B (de) * 1959-06-23 1961-05-10 Licentia Gmbh Kuehlkoerper fuer Halbleitergleichrichter
DE1277446B (de) * 1966-08-26 1968-09-12 Siemens Ag Verfahren zum Herstellen von Halbleiterbauelementen mit vollstaendig gekapseltem Halbleiterelement
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
DE2341097A1 (de) * 1973-08-14 1975-02-27 Siemens Ag Kuehlanordnung fuer flache halbleiterbauelemente, insbesondere fuer scheibenzellen-thyristoren
JPS5512740B2 (is") * 1974-03-15 1980-04-03
JPS5241193B2 (is") * 1974-03-16 1977-10-17
DE2417031A1 (de) * 1974-04-08 1975-10-16 Siemens Ag Thyristorsaeule
US4044396A (en) * 1975-08-14 1977-08-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe cooling of airborne phased array radar
DE3040869A1 (de) * 1980-10-30 1982-06-16 Robert Bosch Gmbh, 7000 Stuttgart Scheinwerfer fuer fahrzeuge, insbesondere kraftfahrzeug-scheinwerfer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE891425C (de) * 1938-09-28 1953-09-28 Aeg Einrichtung zum Betrieb von Trockengleichrichtern
USRE24537E (en) * 1952-07-29 1958-09-23 Unsymmetrical conductor arrangements
DE1026434B (de) * 1954-08-03 1958-03-20 Siemens Ag p-n-Flaechengleichrichter oder -transistor fuer Starkstrom

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2125380A1 (is") * 1971-02-13 1972-09-29 Bbc Brown Boveri & Cie

Also Published As

Publication number Publication date
GB791491A (en) 1958-03-05
NL208738A (is")
BE549283A (is")
NL96632C (is")
DE1188729B (de) 1965-03-11

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