FI883156A7 - Piirimoduuli, jossa on levymäinen lasia tai keramiikkaa oleva piirialusta. - Google Patents

Piirimoduuli, jossa on levymäinen lasia tai keramiikkaa oleva piirialusta. Download PDF

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Publication number
FI883156A7
FI883156A7 FI883156A FI883156A FI883156A7 FI 883156 A7 FI883156 A7 FI 883156A7 FI 883156 A FI883156 A FI 883156A FI 883156 A FI883156 A FI 883156A FI 883156 A7 FI883156 A7 FI 883156A7
Authority
FI
Finland
Prior art keywords
ceramic
glass
plate
substrate made
circuit
Prior art date
Application number
FI883156A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI883156L (fi
FI883156A0 (fi
Inventor
Gerhard Winter
Karl Gerd Drekmeier
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI883156A0 publication Critical patent/FI883156A0/fi
Publication of FI883156L publication Critical patent/FI883156L/fi
Publication of FI883156A7 publication Critical patent/FI883156A7/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI883156A 1987-07-03 1988-07-01 Piirimoduuli, jossa on levymäinen lasia tai keramiikkaa oleva piirialusta. FI883156A7 (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873722119 DE3722119A1 (de) 1987-07-03 1987-07-03 Schaltungsmodul mit einem plattenfoermigen schaltungstraeger aus glas oder keramik

Publications (3)

Publication Number Publication Date
FI883156A0 FI883156A0 (fi) 1988-07-01
FI883156L FI883156L (fi) 1989-01-04
FI883156A7 true FI883156A7 (fi) 1989-01-04

Family

ID=6330898

Family Applications (1)

Application Number Title Priority Date Filing Date
FI883156A FI883156A7 (fi) 1987-07-03 1988-07-01 Piirimoduuli, jossa on levymäinen lasia tai keramiikkaa oleva piirialusta.

Country Status (5)

Country Link
US (1) US4907125A (OSRAM)
CH (1) CH676531A5 (OSRAM)
DE (1) DE3722119A1 (OSRAM)
FI (1) FI883156A7 (OSRAM)
ZA (1) ZA884726B (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
JP2777464B2 (ja) * 1990-07-18 1998-07-16 株式会社日立製作所 電子装置と、これを用いたエンジンの点火装置
DE4344193C2 (de) * 1993-12-23 1996-09-05 Foerster Inst Dr Friedrich Verfahren zur Anbringung einer Schutzschicht und Schutzelement
US5469329A (en) * 1994-08-08 1995-11-21 Ford Motor Company Printed circuit board with bi-metallic heat spreader

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1407201A (en) * 1971-06-23 1975-09-24 Lucas Electrical Co Ltd Printed electric wiring arrangements
US4025997A (en) * 1975-12-23 1977-05-31 International Telephone & Telegraph Corporation Ceramic mounting and heat sink device
GB1598174A (en) * 1977-05-31 1981-09-16 Ibm Cooling electrical apparatus
US4689719A (en) * 1980-09-25 1987-08-25 Siemens Aktiengesellschaft Housing-free vertically insertable single-in-line circuit module
LU83439A1 (de) * 1980-09-25 1981-10-29 Siemens Ag Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul
JPS6038867B2 (ja) * 1981-06-05 1985-09-03 株式会社日立製作所 絶縁型半導体装置
FR2511193A1 (fr) * 1981-08-07 1983-02-11 Thomson Csf Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique
DE3147789A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
JPS58135658A (ja) * 1982-02-08 1983-08-12 Hitachi Ltd 半導体装置
FR2567324B1 (fr) * 1984-07-06 1986-11-28 Telemecanique Electrique Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique
DE3605692A1 (de) * 1986-02-21 1986-11-06 Siemens AG, 1000 Berlin und 8000 München Temperaturaenderungen ausgesetzte anordnung

Also Published As

Publication number Publication date
DE3722119A1 (de) 1989-01-12
CH676531A5 (OSRAM) 1991-01-31
FI883156L (fi) 1989-01-04
US4907125A (en) 1990-03-06
FI883156A0 (fi) 1988-07-01
ZA884726B (en) 1989-03-29

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Legal Events

Date Code Title Description
MM Patent lapsed

Owner name: SIEMENS AKTIENGESELLSCHAFT