FI875607A - Korrosionsbestaendiga stift foer mikrokretsar med en metallisk foerpackning. - Google Patents

Korrosionsbestaendiga stift foer mikrokretsar med en metallisk foerpackning. Download PDF

Info

Publication number
FI875607A
FI875607A FI875607A FI875607A FI875607A FI 875607 A FI875607 A FI 875607A FI 875607 A FI875607 A FI 875607A FI 875607 A FI875607 A FI 875607A FI 875607 A FI875607 A FI 875607A
Authority
FI
Finland
Prior art keywords
microcreter
metallisk
corrosionbestaendiga
foerpackning
stift
Prior art date
Application number
FI875607A
Other languages
English (en)
Other versions
FI875607A0 (fi
Inventor
Jeremy D Scherer
Phillips Baird
Original Assignee
Aegis Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aegis Inc filed Critical Aegis Inc
Publication of FI875607A publication Critical patent/FI875607A/fi
Publication of FI875607A0 publication Critical patent/FI875607A0/fi

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/10Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01027Cobalt [Co]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01057Lanthanum [La]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FI875607A 1986-04-21 1987-12-18 Korrosionsbestaendiga stift foer mikrokretsar med en metallisk foerpackning. FI875607A0 (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85412386A 1986-04-21 1986-04-21
PCT/US1987/000465 WO1987006765A1 (en) 1986-04-21 1987-03-10 Corrosion resistant pins for metal packaged microcircuits

Publications (2)

Publication Number Publication Date
FI875607A true FI875607A (fi) 1987-12-18
FI875607A0 FI875607A0 (fi) 1987-12-18

Family

ID=25317791

Family Applications (1)

Application Number Title Priority Date Filing Date
FI875607A FI875607A0 (fi) 1986-04-21 1987-12-18 Korrosionsbestaendiga stift foer mikrokretsar med en metallisk foerpackning.

Country Status (6)

Country Link
EP (1) EP0266368A4 (fi)
JP (1) JPS63503182A (fi)
KR (1) KR880701463A (fi)
AU (1) AU7207087A (fi)
FI (1) FI875607A0 (fi)
WO (1) WO1987006765A1 (fi)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04264758A (ja) * 1991-02-20 1992-09-21 Nec Corp 半導体チップキャリア
US5243132A (en) * 1992-01-17 1993-09-07 Cooper Industries, Inc. Drain hole core for explosion-proof drain seal fittings
FR2717981B1 (fr) * 1994-03-24 1996-06-28 Egide Sa Procédé de fixation hermétique et électriquement isolante d'un conducteur électrique traversant une paroi métallique .
CN104439784A (zh) * 2014-11-17 2015-03-25 中国电子科技集团公司第四十三研究所 一种电子封装用对接式低阻引线及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2291660A (en) * 1939-07-25 1942-08-04 Raytheon Production Corp Stem for electrical space discharge devices
US2292863A (en) * 1941-08-26 1942-08-11 Gen Electric Lead-in arrangement
GB567521A (en) * 1942-05-11 1945-02-19 Gen Electric Co Ltd Improvements in the sealing of electrical conductors through vitreous walls
GB629742A (en) * 1947-11-14 1949-09-27 Gen Electric Co Ltd Improvements in or relating to method of manufacturing electrical conductors provided with glass beads
FR1280332A (fr) * 1960-02-09 1961-12-29 Texas Instruments Inc Perfectionnements aux embases pour bornes de connexion
DE1913985A1 (de) * 1969-03-19 1970-10-01 Siemens Ag Einschmelzungen mit Draehten in Glas fuer Halbleiterbauelemente
US3927841A (en) * 1974-05-09 1975-12-23 Flight Connector Corp Contact
JPS5250586A (en) * 1975-10-21 1977-04-22 Nec Home Electronics Ltd Making method for gas-tight terminal
JPS57211255A (en) * 1981-06-22 1982-12-25 Nec Home Electronics Ltd Manufacture of airtight terminal
JPS59214244A (ja) * 1983-05-20 1984-12-04 Nec Corp 半導体装置
JPS60194547A (ja) * 1984-03-16 1985-10-03 Nec Corp 半導体装置
IL74296A0 (en) * 1984-03-20 1985-05-31 Isotronics Inc Corrosion resistant microcircuit package

Also Published As

Publication number Publication date
JPS63503182A (ja) 1988-11-17
WO1987006765A1 (en) 1987-11-05
FI875607A0 (fi) 1987-12-18
KR880701463A (ko) 1988-07-27
EP0266368A1 (en) 1988-05-11
AU7207087A (en) 1987-11-24
EP0266368A4 (en) 1988-11-24

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Legal Events

Date Code Title Description
MM Patent lapsed

Owner name: AEGIS, INC.