FI875607A - CORROSIONBESTAENDIGA STIFT FOER MICROCRETER MED EN METALLISK FOERPACKNING. - Google Patents

CORROSIONBESTAENDIGA STIFT FOER MICROCRETER MED EN METALLISK FOERPACKNING. Download PDF

Info

Publication number
FI875607A
FI875607A FI875607A FI875607A FI875607A FI 875607 A FI875607 A FI 875607A FI 875607 A FI875607 A FI 875607A FI 875607 A FI875607 A FI 875607A FI 875607 A FI875607 A FI 875607A
Authority
FI
Finland
Prior art keywords
microcreter
metallisk
corrosionbestaendiga
foerpackning
stift
Prior art date
Application number
FI875607A
Other languages
Finnish (fi)
Other versions
FI875607A0 (en
Inventor
Jeremy D Scherer
Phillips Baird
Original Assignee
Aegis Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aegis Inc filed Critical Aegis Inc
Publication of FI875607A0 publication Critical patent/FI875607A0/en
Publication of FI875607A publication Critical patent/FI875607A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
FI875607A 1986-04-21 1987-12-18 CORROSIONBESTAENDIGA STIFT FOER MICROCRETER MED EN METALLISK FOERPACKNING. FI875607A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85412386A 1986-04-21 1986-04-21
PCT/US1987/000465 WO1987006765A1 (en) 1986-04-21 1987-03-10 Corrosion resistant pins for metal packaged microcircuits

Publications (2)

Publication Number Publication Date
FI875607A0 FI875607A0 (en) 1987-12-18
FI875607A true FI875607A (en) 1987-12-18

Family

ID=25317791

Family Applications (1)

Application Number Title Priority Date Filing Date
FI875607A FI875607A (en) 1986-04-21 1987-12-18 CORROSIONBESTAENDIGA STIFT FOER MICROCRETER MED EN METALLISK FOERPACKNING.

Country Status (6)

Country Link
EP (1) EP0266368A4 (en)
JP (1) JPS63503182A (en)
KR (1) KR880701463A (en)
AU (1) AU7207087A (en)
FI (1) FI875607A (en)
WO (1) WO1987006765A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04264758A (en) * 1991-02-20 1992-09-21 Nec Corp Semiconductor chip carrier
US5243132A (en) * 1992-01-17 1993-09-07 Cooper Industries, Inc. Drain hole core for explosion-proof drain seal fittings
FR2717981B1 (en) * 1994-03-24 1996-06-28 Egide Sa Method of hermetic and electrically insulating fixing of an electrical conductor passing through a metal wall.
CN104439784A (en) * 2014-11-17 2015-03-25 中国电子科技集团公司第四十三研究所 Butt-joint low-resistance lead for electronic packaging and manufacturing method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2291660A (en) * 1939-07-25 1942-08-04 Raytheon Production Corp Stem for electrical space discharge devices
US2292863A (en) * 1941-08-26 1942-08-11 Gen Electric Lead-in arrangement
GB567521A (en) * 1942-05-11 1945-02-19 Gen Electric Co Ltd Improvements in the sealing of electrical conductors through vitreous walls
GB629742A (en) * 1947-11-14 1949-09-27 Gen Electric Co Ltd Improvements in or relating to method of manufacturing electrical conductors provided with glass beads
FR1280332A (en) * 1960-02-09 1961-12-29 Texas Instruments Inc Improvements to the bases for connection terminals
DE1913985A1 (en) * 1969-03-19 1970-10-01 Siemens Ag Fusion of wires into glass for semi-conductor - constructional elements
US3927841A (en) * 1974-05-09 1975-12-23 Flight Connector Corp Contact
JPS5250586A (en) * 1975-10-21 1977-04-22 Nec Home Electronics Ltd Making method for gas-tight terminal
JPS57211255A (en) * 1981-06-22 1982-12-25 Nec Home Electronics Ltd Manufacture of airtight terminal
JPS59214244A (en) * 1983-05-20 1984-12-04 Nec Corp Semiconductor device
JPS60194547A (en) * 1984-03-16 1985-10-03 Nec Corp Semiconductor device
IL74296A0 (en) * 1984-03-20 1985-05-31 Isotronics Inc Corrosion resistant microcircuit package

Also Published As

Publication number Publication date
KR880701463A (en) 1988-07-27
FI875607A0 (en) 1987-12-18
AU7207087A (en) 1987-11-24
WO1987006765A1 (en) 1987-11-05
EP0266368A1 (en) 1988-05-11
JPS63503182A (en) 1988-11-17
EP0266368A4 (en) 1988-11-24

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Legal Events

Date Code Title Description
MM Patent lapsed

Owner name: AEGIS, INC.