FR2717981B1 - Procédé de fixation hermétique et électriquement isolante d'un conducteur électrique traversant une paroi métallique . - Google Patents
Procédé de fixation hermétique et électriquement isolante d'un conducteur électrique traversant une paroi métallique .Info
- Publication number
- FR2717981B1 FR2717981B1 FR9403578A FR9403578A FR2717981B1 FR 2717981 B1 FR2717981 B1 FR 2717981B1 FR 9403578 A FR9403578 A FR 9403578A FR 9403578 A FR9403578 A FR 9403578A FR 2717981 B1 FR2717981 B1 FR 2717981B1
- Authority
- FR
- France
- Prior art keywords
- hermetic
- electrically insulating
- electrical conductor
- metal wall
- insulating fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9403578A FR2717981B1 (fr) | 1994-03-24 | 1994-03-24 | Procédé de fixation hermétique et électriquement isolante d'un conducteur électrique traversant une paroi métallique . |
PCT/FR1995/000236 WO1995026046A1 (fr) | 1994-03-24 | 1995-02-28 | Procede de fixation hermetique et electriquement isolante d'un conducteur electrique traversant une paroi metallique |
EP95911357A EP0752160A1 (fr) | 1994-03-24 | 1995-02-28 | Procede de fixation hermetique et electriquement isolante d'un conducteur electrique traversant une paroi metallique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9403578A FR2717981B1 (fr) | 1994-03-24 | 1994-03-24 | Procédé de fixation hermétique et électriquement isolante d'un conducteur électrique traversant une paroi métallique . |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2717981A1 FR2717981A1 (fr) | 1995-09-29 |
FR2717981B1 true FR2717981B1 (fr) | 1996-06-28 |
Family
ID=9461463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9403578A Expired - Fee Related FR2717981B1 (fr) | 1994-03-24 | 1994-03-24 | Procédé de fixation hermétique et électriquement isolante d'un conducteur électrique traversant une paroi métallique . |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0752160A1 (fr) |
FR (1) | FR2717981B1 (fr) |
WO (1) | WO1995026046A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10031407A1 (de) | 2000-06-28 | 2002-01-10 | Daimler Chrysler Ag | Hermetisches Hochfrequenzmodul und Verfahren zur Herstellung |
KR20120093943A (ko) * | 2009-10-09 | 2012-08-23 | 마퍼 리쏘그라피 아이피 비.브이. | 고전압 차폐 장치 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3418156A1 (de) * | 1984-05-16 | 1985-11-28 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Elektrische durchfuehrung durch eine metallplatte |
WO1987006765A1 (fr) * | 1986-04-21 | 1987-11-05 | Aegis, Inc. | Broches resistantes a la corrosion pour des microcircuits a boitier metallique |
FR2669176B1 (fr) * | 1990-11-13 | 1996-07-12 | Sept Doloy Sa | Boitier ceramique dont les sorties hermetiques sont scellees au moyen d'un verre et destine aux circuits integres. |
DE69218122T2 (de) * | 1991-11-27 | 1997-06-19 | Fujitsu Ltd | Anordnung für eine Koaxialleitung |
-
1994
- 1994-03-24 FR FR9403578A patent/FR2717981B1/fr not_active Expired - Fee Related
-
1995
- 1995-02-28 WO PCT/FR1995/000236 patent/WO1995026046A1/fr not_active Application Discontinuation
- 1995-02-28 EP EP95911357A patent/EP0752160A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2717981A1 (fr) | 1995-09-29 |
EP0752160A1 (fr) | 1997-01-08 |
WO1995026046A1 (fr) | 1995-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |