WO1995026046A1 - Procede de fixation hermetique et electriquement isolante d'un conducteur electrique traversant une paroi metallique - Google Patents
Procede de fixation hermetique et electriquement isolante d'un conducteur electrique traversant une paroi metallique Download PDFInfo
- Publication number
- WO1995026046A1 WO1995026046A1 PCT/FR1995/000236 FR9500236W WO9526046A1 WO 1995026046 A1 WO1995026046 A1 WO 1995026046A1 FR 9500236 W FR9500236 W FR 9500236W WO 9526046 A1 WO9526046 A1 WO 9526046A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- intermediate element
- electrical conductor
- metal
- layer
- brazing
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 84
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 75
- 239000002184 metal Substances 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 59
- 238000005476 soldering Methods 0.000 claims abstract description 10
- 239000011810 insulating material Substances 0.000 claims abstract description 7
- 238000005219 brazing Methods 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 229910000833 kovar Inorganic materials 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 229910000531 Co alloy Inorganic materials 0.000 claims description 4
- 229910001374 Invar Inorganic materials 0.000 claims description 4
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- -1 for example Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 2
- 229910000952 Be alloy Inorganic materials 0.000 claims description 2
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 2
- 229910000863 Ferronickel Inorganic materials 0.000 claims description 2
- 229910000914 Mn alloy Inorganic materials 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 229910001080 W alloy Inorganic materials 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052878 cordierite Inorganic materials 0.000 claims description 2
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims description 2
- 229910052863 mullite Inorganic materials 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 230000000712 assembly Effects 0.000 abstract description 4
- 238000000429 assembly Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 51
- 238000007789 sealing Methods 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000005394 sealing glass Substances 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000005499 meniscus Effects 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a hermetic and electrically insulating fixing method for an electrical conductor passing through a metal wall. It applies in particular to the manufacture of hermetic enclosures intended to contain electronic components.
- the invention also relates to the junction assemblies, the electrical conductors and the intermediate elements allowing the implementation of this method, the junctions obtained by this method as well as the housings in particular for electronic components, comprising at least one junction obtained by this method. .
- the glass-to-metal seal is of the granted type, which is the most common case, for the seal to be able to be effected effectively, it is necessary that the metal conductor and the wall are covered with a layer. metal oxide before sealing.
- the layer of metal oxide present on the electrical conductor is generally removed, so that it can be coated with a thin layer of nickel intended to protect it against corrosion and possibly with a layer of to facilitate welding of the connections. It follows that the metal conductor is not coated with said layer of nickel at the places where it is in contact with the sealing glass, and in particular under the menisci. Consequently, when a meniscus breaks, a part of the metallic conductor not protected by said layer of nickel is exposed and is exposed to attack by the environment.
- the Applicant has succeeded in developing a hermetic and electrically insulating fixing method for an electrical conductor passing through a metal wall, which no longer exhibits the aforementioned drawbacks.
- This method is characterized in that the electrical conductor is fixed by means of an intermediate element consisting of a central part made of an insulating material provided with at least one through hole and at least 2 disjoint metallic layers partially covering said central part capable of giving rise to brazing, by brazing the electrical conductor on at least a part of one of said layers of the intermediate element and by brazing said intermediate element on said metal wall by at least part of a other of its layers, the two brazing operations being able to be carried out in any order or simultaneously.
- the method according to the invention allows the electrical conductor to be held firmly while allowing it to retain a certain flexibility. It is now possible, in fact, to exercise pulls along the axis of symmetry of the electrical conductor or in a different direction, without fear of harming the corrosion resistance of the conductor, of tearing off the latter or of damaging the hermeticity of the fixation. In addition, it is no longer necessary to coat the electrical conductor with a thin layer of oxide as in the tuned sealing technique, since there is no longer any need for glass-to-metal sealing techniques. Consequently, the coating of the electrical conductor with a thin protective nickel layer can be carried out before the implementation of the method according to the invention.
- Figure 1 shows schematically, in section, a junction according to the invention.
- Figures 2 and 3 schematically show, in bottom view and in perspective, intermediate elements that can be used to implement the method according to the invention.
- FIGS 4 and 5 show schematically, in section, junction assemblies according to the invention.
- FIGS 6, 7 and 8 schematically represent electrical conductors according to the invention.
- Figures 9 and 10 show schematically, in section, junction assemblies according to the invention.
- the intermediate element 1 comprising at least one through hole 2 consists of a central part 3 made of an insulating material and of at least two metallic layers 4 and 5 suitable for giving rise to soldering.
- Said through hole 2 is intended to allow the electrical conductor 6 to pass. It can be circular, or polygonal.
- Said metal layers 4 and 5 of the intermediate element 1 are located on two different faces, preferably planar, of the intermediate element 1 which they partially or completely cover.
- the metal layers 4 and 5 are generally flat. Of course, as they must be electrically isolated, they cannot be in contact with each other.
- a first of these layers, layer 4, is intended to perform soldering with the electrical conductor 6 and a second, layer 5, to unite the intermediate element with the metal wall 7 which must be crossed by the electrical conductor 6.
- the layer 4 generally has at least one part which is located near or around the through hole 2.
- intermediate element 1 comprising at least one through hole 2 to allow the electrical conductor 6 to be held at least essentially perpendicular to the metal wall 7 that said electrical conductor 6 must pass through.
- the face 13 of the intermediate element 1 coated with the layer 5 intended to perform the brazing with the metal wall 7 may not be completely covered by said layer 5.
- the distance between the electrical conductor 6 and said layer 5 of the intermediate element 1 is increased, and it follows that the electrical insulation resistance between the electrical conductor 6 and the wall 7 to be crossed is increased.
- the risk of making a false contact between said layer 5 and said electrical conductor 6 is reduced, if the latter is twisted, that is to say displaced in a direction not parallel to its axis of symmetry.
- another layer or metallic ring 4bis is provided on the face 13 of the intermediate element 1, around the through hole 2.
- This ring 4bis is electrically isolated from the layer 5 by a space 15.
- the conductor 6 can thus be maintained both by brazing on the layer 4, as well as by brazing on the ring 4bis.
- the layer 5 can then be in the form of a ring which can extend from the periphery 16 of the intermediate element 1 towards the through hole 2, over a limited distance so as to allow the existence of said space 15.
- the metal layer 4 covers, in addition to part of one of the faces of the intermediate element 1, at least part of the wall of the through hole 2 and can extend over the face 13 by another layer or metal ring 17.
- This variant makes it possible to solder between the conductor 6 and the walls of the through hole 2 and optionally between the conductor 6 and the ring 17, which ensures a distribution of the stresses generated by the differences in thermal expansion between the conductor 6 and the intermediate element 1 over a larger surface.
- a single intermediate element 1 can possibly be used to hold several electrical conductors 6, when it has several through holes 2. It is however desirable for the intermediate element 1 to maintain only one or a reduced number of electrical conductors 6, that is to say that it has only one or only a reduced number (for example three or five) through holes 2.
- the dimensions of the intermediate element 1 can then be sufficiently small so that, during its brazing against the wall, the stresses generated by the differences in thermal expansion between the material constituting the intermediate element 1 and the material constituting the metal wall 7 remain very limited and are not likely to affect the hermeticity of the junction between the intermediate element 1 and the metal wall 7.
- the intermediate element 1 may have at least essentially the shape of a disc, as illustrated in FIG. 2, or of a parallelepiped, as illustrated in FIG. 3.
- the insulating material from which the central part 3 of the intermediate element 1 is made is generally an insulating ceramic at least essentially consisting of a material such as, for example, alumina, mullite, cordierite, zirconia or l beryllium oxide.
- Said central part 3 can be in one piece or made up of a stack of layers obtained according to the well-known technique known as multilayer, as illustrated in FIG. 5.
- the through hole 2 is produced in a known manner, for example by punching the central part 3 before passing the raw material constituting said central part to the furnace 3, by laser cutting after passing said raw material into the furnace or as soon as it is pressed. or molding.
- the metal layers 4,5 of the intermediate element 1 are made of a metal which can be tungsten, molybdenum or a molybdenum / manganese alloy. Their thickness is generally of the order of 5 to 30 ⁇ (microns or micrometers). Said metallic layers 4,5 must adhere strongly to the central part 3 so that they cannot be separated from the latter under the normal conditions for implementing the method according to the invention and using the junction obtained by this same process. Said metal layers 4,5 are obtained in a known manner, for example by screen printing, during the production of the central part 3. They may also each comprise one or more other layers of equal or different thicknesses preferably situated on the side opposite to the central part 3 and which may consist for example of an alloy such as nickel / boron, gold, tin or silver.
- the metal layers 4.5 are each composed of a tungsten layer 5 to 30 ⁇ thick and a nickel / boron layer 0.5 to 2.5 ⁇ , the latter being located on the face outside of the metal layer 4 or 5, that is to say on the face opposite to the central part 3.
- the intermediate element 1 is designed to hold an electrical conductor 6 passing through it and passing through the metal wall 7.
- Said electrical conductor 6 is generally in the form of a wire of any cross section, in particular circular or polygonal, or in shape of hollow or full tube with closed ends, comprising a part 8 having any shape and intended to come at least partially into abutment against at least part of the layer 4 of the intermediate element 1 and to allow soldering between a portion 9 of the total surface of said part 8 and at least part of the layer 4 of the intermediate element 1.
- Said part 8 can, for example, take the form of a collar (FIG. 1), of a trunk cone ( Figure 4), a shoulder ( Figure 5), a parallelepiped ( Figures 6 or 7), a truncated cone ( Figure 8) or a hemisphere.
- the shape of said part 8 and the shape of the intermediate element 1 must be adapted to one another, so that said portion 9 of the total surface of said part 8 is at least essentially parallel to said layer. 4 of the intermediate element 1 when the electrical conductor 6 passes through the metal wall 7.
- Said portion 9 and said layer 4 can be perpendicular to the axis of the electrical conductor 6 ( Figure 1), or form an angle with this axis ( Figure 4).
- said portion 9 and the axis of said electrical conductor 6 are arranged so that they are at least approximately at right angles to one another.
- said electrical conductor 6 can resist very high pulls in the direction of its axis.
- the cross section of the electrical conductor 6 is at least essentially circular.
- Said portion 9 preferably has a high area, so as to maintain the electrical conductor 6 very mechanically resistant and to ensure good hermeticity.
- the electrical conductor 6 it is advantageous for the electrical conductor 6 to be provided with a part 10 in the form of a truncated cone (FIGS. 1, 4, 5 or 8) or a truncated pyramid.
- This part 10 in the form of a truncated cone or pyramid can be confused with said part 8 (FIG. 4) or be separate therefrom (FIG. 1, 5, 7 or 8).
- the electrical conductor 6 may be in one piece or composed of several parts assembled in a known manner, for example by welding. It can therefore be made of a single metal or of several metals, said metal or metals possibly being copper, copper alloys such as, for example, copper / beryllium alloys, ferro-nickel alloys such as, for example, iron / nickel alloy known under the trade name INVAR or other alloys such as, for example, the iron / cobalt / nickel alloy known under the trade name KOVAR.
- the metal wall 7 to be traversed can be provided with a housing 11 at the place where the intermediate element 1 is to be brazed.
- This housing 11 (FIG. 5) has dimensions suitable for receiving, the intermediate element 1. Preferably , its dimensions are such that they also allow it to position the intermediate element 1, that is to say to receive the intermediate element 1 with little play.
- the existence of the housing 11 may not be recommended in the event that its depth excessively reduces the thickness of the wall 7 and therefore risks weakening it.
- the metal wall 7 may be made of an iron / cobalt / nickel alloy known under the trade name KOVAR, of steel, of molybdenum, of aluminum, of a copper alloy such as the copper / tungsten, copper / molybdenum alloys, of a composite material.
- KOVAR iron / cobalt / nickel alloy
- steel of molybdenum
- aluminum of a copper alloy such as the copper / tungsten, copper / molybdenum alloys, of a composite material.
- aluminum matrix composites such as aluminum / silicon carbide, or a colaminate such as copper / invar / copper.
- the brazing of the electrical conductor 6 on the intermediate element 1 and the brazing of the intermediate element 1 on the metal wall 7 can be carried out in two stages and in any order, or else simultaneously.
- the method according to the invention is implemented, by first preparing a junction assembly comprising the electrical conductor 6, the intermediate element 1 and the metal wall 7, then performing the two solderings.
- intermediate element 1 can be soldered either inside or outside the housing.
- brazing operations are carried out in a known manner, that is to say by placing, according to any suitable method, a brazing material called brazing between the parts to be brazed maintained by an appropriate tool in the position which they are called upon to maintain, then by passing through an oven under the usual conditions of brazing known to those skilled in the art and determined by the brazing used.
- the latter are generally copper or alloys such as silver / copper alloys (Ag / Cu 72/28), gold / tin (Au / Sn), silver / copper / indium (Ag / Cu / In), gold / germanium (Au / Ge), or any eutectic alloy used for the manufacture of commercial solders.
- brazing at the level of layers 4bis or 17 can be carried out by adding Ag / Cu brazing.
- a small solder washer can thus be positioned at the level of layers 4bis or 17. It will solder, after passage through the oven, the conductor 6 to the intermediate element 1.
- the temperatures at which brazing is carried out are generally lower than those necessary for glass-to-metal sealing. It follows that the implementation of the method according to the invention allows energy savings compared to glass-metal sealing techniques.
- the method according to the invention makes it possible to reduce the thickness of the metal wall 7 compared to the wall thicknesses 7 necessary for the implementation of the glass-metal sealing techniques of the prior art.
- glass-metal seals require, to guarantee satisfactory hermeticity, a relatively large thickness of said metal wall 7.
- the intermediate element 1 as shown in FIG. 1, had an external diameter of approximately 1.89 mm, a through hole 2 of approximately 0.68 mm, a layer 5 of external diameter equal to approximately 1 , 89 mm and an internal diameter (greater than that of the through hole 2) equal to approximately 1 mm, a total thickness (central part 3 plus layers 4 and 5) of approximately 0.5 mm,
- the conductor 6 in KOVAR had a diameter of approximately 0.46 mm, a shoulder 8 of approximately 0.9 mm in diameter and approximately 0.2 mm in thickness, a frustoconical part 10 inclined at approximately 45 degrees and whose diameter at the contact with the shoulder 8 was approximately 0.65 mm, the length of the conductor 6 measured between the face of the shoulder 8 opposite the frustoconical part 10 and the end of the conductor 6 situated on the side of said frustoconical part 10 was approximately 5 mm, and the length of the conductor 6 measured between said face of the shoulder 8 opposite said frustoconical part 10 and the other end of the conductor 6 was approximately 5 mm in some cases, 3.49 mm and 2.60 mm in other cases.
- the forces (twists) exerted on the electrical conductor 6 in a direction not parallel to its axis of symmetry are reflected in the form of shear stresses between the portion 9 of the part 8 of the electrical conductor 6 and layer 4 of the intermediate element 1. These shear stresses have no effect on the junction obtained by the implementation of the method according to the invention. On the contrary, in glass-metal sealing junctions according to the prior art, these same efforts risk breaking or cracking a meniscus, and therefore entail the consequences mentioned above.
- junctions obtained by the process according to the invention can be used for the production of housings such as, for example, housings for electronic components.
- housings can include one or more of these junctions, thanks to which they have very good corrosion resistance and high hermeticity and long-term reliability.
- the method according to the invention also offers the advantage of being able to be automated. It can also be used to fix several electrical conductors using a single intermediate element. It goes without saying that in this case, each electrical conductor individually crosses a through hole and its soldering on the intermediate element is done individually on a layer 4. There are therefore at least as many through holes (electrically insulated the from each other) and at least as many layers 4 (electrically insulated from each other) as there are conductors to be attached because to each through hole corresponds a single electrical conductor and a single layer 4; there may be a single layer 5 or a number of layers 5 lower than the number of electrical conductors to be fixed.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP95911357A EP0752160A1 (fr) | 1994-03-24 | 1995-02-28 | Procede de fixation hermetique et electriquement isolante d'un conducteur electrique traversant une paroi metallique |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR94/03578 | 1994-03-24 | ||
FR9403578A FR2717981B1 (fr) | 1994-03-24 | 1994-03-24 | Procédé de fixation hermétique et électriquement isolante d'un conducteur électrique traversant une paroi métallique . |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1995026046A1 true WO1995026046A1 (fr) | 1995-09-28 |
Family
ID=9461463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR1995/000236 WO1995026046A1 (fr) | 1994-03-24 | 1995-02-28 | Procede de fixation hermetique et electriquement isolante d'un conducteur electrique traversant une paroi metallique |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0752160A1 (fr) |
FR (1) | FR2717981B1 (fr) |
WO (1) | WO1995026046A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10031407A1 (de) | 2000-06-28 | 2002-01-10 | Daimler Chrysler Ag | Hermetisches Hochfrequenzmodul und Verfahren zur Herstellung |
JP5599889B2 (ja) * | 2009-10-09 | 2014-10-01 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | 高電圧遮蔽配置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3418156A1 (de) * | 1984-05-16 | 1985-11-28 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Elektrische durchfuehrung durch eine metallplatte |
WO1987006765A1 (fr) * | 1986-04-21 | 1987-11-05 | Aegis, Inc. | Broches resistantes a la corrosion pour des microcircuits a boitier metallique |
FR2669176A1 (fr) * | 1990-11-13 | 1992-05-15 | Sept Doloy Sa | Boitier ceramique dont les sorties hermetiques sont scellees au moyen d'un verre et destine aux circuits integres. |
EP0544538A2 (fr) * | 1991-11-27 | 1993-06-02 | Shinko Electric Industries Co. Ltd. | Assemblage pour une ligne coaxiale |
-
1994
- 1994-03-24 FR FR9403578A patent/FR2717981B1/fr not_active Expired - Fee Related
-
1995
- 1995-02-28 WO PCT/FR1995/000236 patent/WO1995026046A1/fr not_active Application Discontinuation
- 1995-02-28 EP EP95911357A patent/EP0752160A1/fr not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3418156A1 (de) * | 1984-05-16 | 1985-11-28 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Elektrische durchfuehrung durch eine metallplatte |
WO1987006765A1 (fr) * | 1986-04-21 | 1987-11-05 | Aegis, Inc. | Broches resistantes a la corrosion pour des microcircuits a boitier metallique |
FR2669176A1 (fr) * | 1990-11-13 | 1992-05-15 | Sept Doloy Sa | Boitier ceramique dont les sorties hermetiques sont scellees au moyen d'un verre et destine aux circuits integres. |
EP0544538A2 (fr) * | 1991-11-27 | 1993-06-02 | Shinko Electric Industries Co. Ltd. | Assemblage pour une ligne coaxiale |
Also Published As
Publication number | Publication date |
---|---|
FR2717981B1 (fr) | 1996-06-28 |
EP0752160A1 (fr) | 1997-01-08 |
FR2717981A1 (fr) | 1995-09-29 |
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