FI874481A - Menetelmä korttien, erityisesti muistikorttien valmistamiseksi - Google Patents
Menetelmä korttien, erityisesti muistikorttien valmistamiseksi Download PDFInfo
- Publication number
- FI874481A FI874481A FI874481A FI874481A FI874481A FI 874481 A FI874481 A FI 874481A FI 874481 A FI874481 A FI 874481A FI 874481 A FI874481 A FI 874481A FI 874481 A FI874481 A FI 874481A
- Authority
- FI
- Finland
- Prior art keywords
- cards
- making
- particular memory
- memory cards
- making cards
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K21/00—Information retrieval from punched cards designed for manual use or handling by machine; Apparatus for handling such cards, e.g. marking or correcting
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/006—Memory cards, chip cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8614231 | 1986-10-14 | ||
FR8614231A FR2605144B1 (fr) | 1986-10-14 | 1986-10-14 | Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede |
Publications (4)
Publication Number | Publication Date |
---|---|
FI874481A0 FI874481A0 (fi) | 1987-10-12 |
FI874481A true FI874481A (fi) | 1988-04-15 |
FI94000B FI94000B (fi) | 1995-03-15 |
FI94000C FI94000C (fi) | 1995-06-26 |
Family
ID=9339813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI874481A FI94000C (fi) | 1986-10-14 | 1987-10-12 | Menetelmä korttien, erityisesti muistikorttien valmistamiseksi |
Country Status (17)
Country | Link |
---|---|
US (1) | US5030309A (fi) |
EP (1) | EP0267826B1 (fi) |
JP (1) | JP2524606B2 (fi) |
KR (1) | KR950007894B1 (fi) |
AR (1) | AR243696A1 (fi) |
AT (1) | ATE73561T1 (fi) |
AU (1) | AU603142B2 (fi) |
BR (1) | BR8705434A (fi) |
DE (1) | DE3777336D1 (fi) |
DK (1) | DK537387A (fi) |
ES (1) | ES2030751T3 (fi) |
FI (1) | FI94000C (fi) |
FR (1) | FR2605144B1 (fi) |
GR (1) | GR3004726T3 (fi) |
IN (1) | IN169843B (fi) |
NO (1) | NO174605C (fi) |
ZA (1) | ZA877497B (fi) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2629236B1 (fr) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede |
US5030407A (en) * | 1988-04-28 | 1991-07-09 | Schlumberger Industries | Method of making cards having graphics elements thereon |
US5387306A (en) * | 1988-06-21 | 1995-02-07 | Gec Avery Limited | Manufacturing integrated circuit cards |
JP2730181B2 (ja) * | 1989-05-27 | 1998-03-25 | 三菱化学株式会社 | Icカード用基板の製法 |
FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
FR2668096B1 (fr) * | 1990-10-19 | 1993-01-22 | Schlumberger Ind Sa | Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue. |
DE4142410C2 (de) * | 1991-12-20 | 2000-11-09 | Gao Ges Automation Org | Vorrichtung zum Herstellen von flachen Kunststoff-Formstücken, beispielsweise Ausweiskarten durch Spritzgießen |
JPH05169885A (ja) * | 1991-12-26 | 1993-07-09 | Mitsubishi Electric Corp | 薄型icカード |
US5476629A (en) * | 1992-12-25 | 1995-12-19 | Citizen Watch Co. Ltd. | Method for manufacturing IC card substrate |
FR2702067B1 (fr) * | 1993-02-23 | 1995-04-14 | Schlumberger Ind Sa | Procédé et dispositif de fabrication de cartes à mémoire. |
US5871683A (en) * | 1994-01-18 | 1999-02-16 | First Team Sports, Inc. | Method of molding skate components |
US5475919B1 (en) * | 1994-10-07 | 2000-10-17 | Three View Technology Co Ltd | Pcmcia card manufacturing process |
DE69511359T2 (de) † | 1994-11-14 | 2000-03-02 | Mitsubishi Plastics, Inc. | Kunststoffzusammensetzungen und die daraus hergestellten Kunststoffkarten |
FR2735714B1 (fr) * | 1995-06-21 | 1997-07-25 | Schlumberger Ind Sa | Procede pour imprimer un graphisme sur une carte a memoire |
FR2756955B1 (fr) * | 1996-12-11 | 1999-01-08 | Schlumberger Ind Sa | Procede de realisation d'un circuit electronique pour une carte a memoire sans contact |
DE19750344C2 (de) * | 1997-11-13 | 2000-05-18 | Ods Landis & Gyr Gmbh & Co Kg | Verfahren zum Herstellen eines flachen Kartengrundkörpers für eine Chipkarte |
DE19824699B4 (de) * | 1998-06-03 | 2004-01-15 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Kunststoffkarte |
FR2785072B1 (fr) * | 1998-10-23 | 2001-01-19 | St Microelectronics Sa | Circuit electronique autocollant |
US10335985B2 (en) * | 2015-10-14 | 2019-07-02 | Capital One Services, Llc | Molded pocket in transaction card construction |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3553787A (en) * | 1968-07-18 | 1971-01-12 | Moore Business Forms Inc | Apparatus for embossing alpha-numeric characters |
NL7511123A (nl) * | 1975-09-19 | 1977-03-22 | Picanol Nv | Verbeterde lade voor weefmachines. |
US4500777A (en) * | 1981-02-27 | 1985-02-19 | Drexler Technology Corporation | High data capacity, scratch and dust resistant, infrared, read-write data card for automatic teller machines |
FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
JPS6115289A (ja) * | 1984-06-29 | 1986-01-23 | Mitsubishi Plastics Ind Ltd | メモリ−カ−ド |
JPS61133489A (ja) * | 1984-12-03 | 1986-06-20 | Mitsubishi Plastics Ind Ltd | メモリ−カ−ド |
DE3446412C2 (de) * | 1984-12-20 | 1995-08-10 | Hartmann Gmbh Co Kg Georg | Identkarte zum Lesen unter Verwendung eines magnetischen Systems |
JPS61183791A (ja) * | 1985-02-08 | 1986-08-16 | Mitsubishi Plastics Ind Ltd | メモリ−カ−ド |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
JPH0662026B2 (ja) * | 1985-04-22 | 1994-08-17 | 三菱樹脂株式会社 | Icメモリ−カ−ド |
-
1986
- 1986-10-14 FR FR8614231A patent/FR2605144B1/fr not_active Expired
-
1987
- 1987-10-06 ZA ZA877497A patent/ZA877497B/xx unknown
- 1987-10-06 AU AU79380/87A patent/AU603142B2/en not_active Expired
- 1987-10-07 IN IN722/MAS/87A patent/IN169843B/en unknown
- 1987-10-09 BR BR8705434A patent/BR8705434A/pt not_active IP Right Cessation
- 1987-10-12 FI FI874481A patent/FI94000C/fi not_active IP Right Cessation
- 1987-10-13 AT AT87402286T patent/ATE73561T1/de not_active IP Right Cessation
- 1987-10-13 NO NO874273A patent/NO174605C/no unknown
- 1987-10-13 DE DE8787402286T patent/DE3777336D1/de not_active Revoked
- 1987-10-13 ES ES198787402286T patent/ES2030751T3/es not_active Expired - Lifetime
- 1987-10-13 EP EP87402286A patent/EP0267826B1/fr not_active Revoked
- 1987-10-14 AR AR87308960A patent/AR243696A1/es active
- 1987-10-14 DK DK537387A patent/DK537387A/da not_active Application Discontinuation
- 1987-10-14 JP JP62259411A patent/JP2524606B2/ja not_active Expired - Lifetime
- 1987-10-14 KR KR1019870011406A patent/KR950007894B1/ko not_active IP Right Cessation
-
1989
- 1989-07-14 US US07/382,057 patent/US5030309A/en not_active Expired - Lifetime
-
1992
- 1992-05-26 GR GR920401075T patent/GR3004726T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
EP0267826B1 (fr) | 1992-03-11 |
FI94000B (fi) | 1995-03-15 |
FR2605144B1 (fr) | 1989-02-24 |
GR3004726T3 (fi) | 1993-04-28 |
JPS63183893A (ja) | 1988-07-29 |
JP2524606B2 (ja) | 1996-08-14 |
ATE73561T1 (de) | 1992-03-15 |
IN169843B (fi) | 1991-12-28 |
AU603142B2 (en) | 1990-11-08 |
DK537387D0 (da) | 1987-10-14 |
AR243696A1 (es) | 1993-08-31 |
DE3777336D1 (de) | 1992-04-16 |
EP0267826A1 (fr) | 1988-05-18 |
NO874273L (no) | 1988-04-15 |
US5030309A (en) | 1991-07-09 |
AU7938087A (en) | 1988-04-21 |
FI94000C (fi) | 1995-06-26 |
ES2030751T3 (es) | 1992-11-16 |
NO174605B (no) | 1994-02-21 |
ZA877497B (en) | 1988-04-14 |
BR8705434A (pt) | 1988-05-24 |
DK537387A (da) | 1988-04-15 |
FI874481A0 (fi) | 1987-10-12 |
NO174605C (no) | 1994-06-08 |
FR2605144A1 (fr) | 1988-04-15 |
NO874273D0 (no) | 1987-10-13 |
KR880005541A (ko) | 1988-06-29 |
KR950007894B1 (ko) | 1995-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BB | Publication of examined application | ||
MM | Patent lapsed |
Owner name: SCHLUMBERGER INDUSTRIES |