FI873643A - Foerfarande och anlaeggning foer galvanisering av kopparfilm. - Google Patents

Foerfarande och anlaeggning foer galvanisering av kopparfilm. Download PDF

Info

Publication number
FI873643A
FI873643A FI873643A FI873643A FI873643A FI 873643 A FI873643 A FI 873643A FI 873643 A FI873643 A FI 873643A FI 873643 A FI873643 A FI 873643A FI 873643 A FI873643 A FI 873643A
Authority
FI
Finland
Prior art keywords
current density
electrolyte
kopparfilm
galvanisering
pulsed
Prior art date
Application number
FI873643A
Other languages
English (en)
Other versions
FI873643A0 (fi
Inventor
Betty L Luce
Betty L Berdan
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of FI873643A0 publication Critical patent/FI873643A0/fi
Publication of FI873643A publication Critical patent/FI873643A/fi

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Control Of El Displays (AREA)
  • Spinning Or Twisting Of Yarns (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Laminated Bodies (AREA)
FI873643A 1985-12-24 1987-08-24 Foerfarande och anlaeggning foer galvanisering av kopparfilm. FI873643A (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81309785A 1985-12-24 1985-12-24
PCT/US1986/002797 WO1987003915A1 (en) 1985-12-24 1986-12-23 A process and apparatus for electroplating copper foil

Publications (2)

Publication Number Publication Date
FI873643A0 FI873643A0 (fi) 1987-08-24
FI873643A true FI873643A (fi) 1987-08-24

Family

ID=25211440

Family Applications (1)

Application Number Title Priority Date Filing Date
FI873643A FI873643A (fi) 1985-12-24 1987-08-24 Foerfarande och anlaeggning foer galvanisering av kopparfilm.

Country Status (13)

Country Link
US (1) US4898647A (fi)
EP (1) EP0252139B1 (fi)
JP (1) JPS63241193A (fi)
AT (1) ATE92544T1 (fi)
AU (1) AU602673B2 (fi)
BR (1) BR8607061A (fi)
DE (1) DE3688840T2 (fi)
DK (1) DK439887D0 (fi)
FI (1) FI873643A (fi)
HU (1) HU208556B (fi)
IN (1) IN166842B (fi)
NO (1) NO873533L (fi)
WO (1) WO1987003915A1 (fi)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4661213A (en) * 1986-02-13 1987-04-28 Dorsett Terry E Electroplate to moving metal
US5215645A (en) * 1989-09-13 1993-06-01 Gould Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5393396A (en) * 1990-10-30 1995-02-28 Gould Inc. Apparatus for electrodepositing metal
US5228965A (en) * 1990-10-30 1993-07-20 Gould Inc. Method and apparatus for applying surface treatment to metal foil
JP3207909B2 (ja) * 1992-02-07 2001-09-10 ティーディーケイ株式会社 電気めっき方法および電気めっき用分割型不溶性電極
US5215646A (en) * 1992-05-06 1993-06-01 Circuit Foil Usa, Inc. Low profile copper foil and process and apparatus for making bondable metal foils
US5685970A (en) * 1992-07-01 1997-11-11 Gould Electronics Inc. Method and apparatus for sequentially metalized polymeric films and products made thereby
US5646814A (en) 1994-07-15 1997-07-08 Applied Materials, Inc. Multi-electrode electrostatic chuck
US5592358A (en) 1994-07-18 1997-01-07 Applied Materials, Inc. Electrostatic chuck for magnetic flux processing
JP3281783B2 (ja) * 1995-12-06 2002-05-13 三井金属鉱業株式会社 プリント配線板用銅箔、その製造法及び電解装置
US6730387B2 (en) 1996-04-24 2004-05-04 The Procter & Gamble Company Absorbent materials having improved structural stability in dry and wet states and making methods therefor
JPH10195689A (ja) * 1996-12-27 1998-07-28 Fukuda Metal Foil & Powder Co Ltd 微細孔明き金属箔の製造方法
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
CA2320278C (en) * 1998-02-12 2006-01-03 Acm Research, Inc. Plating apparatus and method
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
CN1184359C (zh) * 1998-09-14 2005-01-12 三井金属鉱业株式会社 多孔铜箔及其用途和制造方法
US6309969B1 (en) 1998-11-03 2001-10-30 The John Hopkins University Copper metallization structure and method of construction
AU1298299A (en) * 1998-11-03 2000-05-22 Johns Hopkins University, The Copper metallization structure and method of construction
CN1217034C (zh) * 1999-04-13 2005-08-31 塞米用具公司 具有改进的处理流体流的处理腔的工件处理装置
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
KR19990064747A (ko) 1999-05-06 1999-08-05 이종구 Ｎｉ-Ｆｅ 합금 박판 제조방법 및 그 장치
US6183607B1 (en) * 1999-06-22 2001-02-06 Ga-Tek Inc. Anode structure for manufacture of metallic foil
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
EP1337693A2 (en) * 2000-05-23 2003-08-27 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
WO2001090434A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
EP1470268A2 (en) * 2000-10-03 2004-10-27 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
WO2003018874A2 (en) 2001-08-31 2003-03-06 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US20040108212A1 (en) * 2002-12-06 2004-06-10 Lyndon Graham Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
CN102321895B (zh) * 2011-09-01 2013-10-23 西安航天动力机械厂 一种整体式阳极槽
CN104099652A (zh) * 2014-07-09 2014-10-15 山东金宝电子股份有限公司 一种电子铜箔的表面处理粗化工艺
KR102029139B1 (ko) * 2015-11-09 2019-10-07 케이씨에프테크놀로지스 주식회사 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4318794A (en) * 1980-11-17 1982-03-09 Edward Adler Anode for production of electrodeposited foil
US4490218A (en) * 1983-11-07 1984-12-25 Olin Corporation Process and apparatus for producing surface treated metal foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
IT1182818B (it) * 1985-08-12 1987-10-05 Centro Speriment Metallurg Dispositivo a cella radiale per elettrodeposizione

Also Published As

Publication number Publication date
FI873643A0 (fi) 1987-08-24
EP0252139A1 (en) 1988-01-13
EP0252139B1 (en) 1993-08-04
AU6898187A (en) 1987-07-15
NO873533D0 (no) 1987-08-21
DK439887A (da) 1987-08-24
EP0252139A4 (en) 1988-03-22
AU602673B2 (en) 1990-10-25
BR8607061A (pt) 1988-02-23
US4898647A (en) 1990-02-06
JPS63241193A (ja) 1988-10-06
DE3688840D1 (de) 1993-09-09
JPH031391B2 (fi) 1991-01-10
WO1987003915A1 (en) 1987-07-02
NO873533L (no) 1987-08-21
DK439887D0 (da) 1987-08-24
HUT46083A (en) 1988-09-28
HU208556B (en) 1993-11-29
IN166842B (fi) 1990-07-28
DE3688840T2 (de) 1993-11-25
ATE92544T1 (de) 1993-08-15

Similar Documents

Publication Publication Date Title
FI873643A0 (fi) Foerfarande och anlaeggning foer galvanisering av kopparfilm.
MY111485A (en) Electrodeposited copper foil and process for making same.
KR890002623B1 (en) Method for electroplating non-metallic surfaces
FI834649A0 (fi) Katod foer elektrolytisk framstaellning av vaete och dess anvaendning
DE3569583D1 (en) Method of depositing a metal on spaced regions of a workpiece
ATE32532T1 (de) Verfahren und vorrichtung zum galvanoplastischen herstellen von sieben, sowie damit hergestellte siebe.
GB1447056A (en) Electrolytic treatment of articles
DE59504068D1 (de) Verfahren und vorrichtung zum elektrolytischen metallisieren oder ätzen von behandlungsgut
AU5309379A (en) Processing the surface of workpieces
ATE76906T1 (de) Kryo-elektroplattieren.
US3374159A (en) Marking of steel strip electrolytically using electrolyte adhering to the strip
ATE50802T1 (de) Vorrichtung zum galvanischen abscheiden einer dispersionsschicht.
ATE135417T1 (de) Verfahren und vorrichtung zum elektrolytischen austragen von metallen aus einer metallionen enthaltenden lösung sowie elektrode zur durchführung des verfahrens
KR850001311A (ko) 화성처리가 대단히 쉬운 냉간압연 강스트립의 제조공정
ES2163265T3 (es) Procedimiento y dispositivo para la produccion de una capa para un electrodo.
ES450982A1 (es) Perfeccionamientos introducidos en un procedimiento y en un aparato para la produccion de una longitud continua de chapametalica perforada.
ES2012606A6 (es) Metodo de eliminar una configuracion denditrica durante la galvanoplastia de cinta metalica:
KR890005304A (ko) 구리박막을 전기도금하는 방법 및 장치
IT208589Z2 (it) Apparecchiatura per la depurazione elettrolitica in continuo delle soluzioni utilizzate in procedimenti di elettrodeposizione e simili.
SE7706497L (sv) Elektrolytiskt utfellningsforfarande
GB1416511A (en) Method of manufacturing a continuous magnetic foil by electrodeposition
Leroy Method and Apparatus for Electroless Plating
DE3881022D1 (de) Elektroplattierungsbad und verfahren zum stabilhalten der zusammensetzung der plattierten legierung.
IT8222323V0 (it) Vasca per il trattamento chimico superficiale in continuo di fili, particolarmente di fili metallici.
JPS6423542A (en) Wiring structure

Legal Events

Date Code Title Description
FC Application refused

Owner name: GOULD INC.