FI870414A0 - Foerbaettrat sammanbindningsband foer anvaendning vid automatisk bindning av band. - Google Patents

Foerbaettrat sammanbindningsband foer anvaendning vid automatisk bindning av band.

Info

Publication number
FI870414A0
FI870414A0 FI870414A FI870414A FI870414A0 FI 870414 A0 FI870414 A0 FI 870414A0 FI 870414 A FI870414 A FI 870414A FI 870414 A FI870414 A FI 870414A FI 870414 A0 FI870414 A0 FI 870414A0
Authority
FI
Finland
Prior art keywords
sammanbindningsband
foerbaettrat
bindning
automatisk
band
Prior art date
Application number
FI870414A
Other languages
English (en)
Other versions
FI870414A (fi
Inventor
Jackie Allen Walter
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of FI870414A0 publication Critical patent/FI870414A0/fi
Publication of FI870414A publication Critical patent/FI870414A/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FI870414A 1986-01-31 1987-01-30 Foerbaettrat sammanbindningsband foer anvaendning vid automatisk bindning av band. FI870414A (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/824,894 US4721993A (en) 1986-01-31 1986-01-31 Interconnect tape for use in tape automated bonding

Publications (2)

Publication Number Publication Date
FI870414A0 true FI870414A0 (fi) 1987-01-30
FI870414A FI870414A (fi) 1987-08-01

Family

ID=25242591

Family Applications (1)

Application Number Title Priority Date Filing Date
FI870414A FI870414A (fi) 1986-01-31 1987-01-30 Foerbaettrat sammanbindningsband foer anvaendning vid automatisk bindning av band.

Country Status (5)

Country Link
US (1) US4721993A (fi)
EP (1) EP0233029A3 (fi)
JP (1) JPS62229850A (fi)
KR (1) KR870007569A (fi)
FI (1) FI870414A (fi)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4721992A (en) * 1986-06-26 1988-01-26 National Semiconductor Corporation Hinge tape
US4979663A (en) * 1986-08-27 1990-12-25 Digital Equipment Corporation Outer lead tape automated bonding system
IN171404B (fi) * 1986-08-27 1992-10-03 Digital Equipment Corp
US4899207A (en) * 1986-08-27 1990-02-06 Digital Equipment Corporation Outer lead tape automated bonding
US4761880A (en) * 1986-12-08 1988-08-09 International Business Machines Corporation Method of obtaining surface mount component planarity
JPS63148670A (ja) * 1986-12-12 1988-06-21 Texas Instr Japan Ltd リ−ドフレ−ム材
US4806409A (en) * 1987-05-20 1989-02-21 Olin Corporation Process for providing an improved electroplated tape automated bonding tape and the product produced thereby
JPH0526746Y2 (fi) * 1987-07-14 1993-07-07
US4849857A (en) * 1987-10-05 1989-07-18 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
JPH01161743A (ja) * 1987-12-17 1989-06-26 Toshiba Corp 半導体装置
JPH0828455B2 (ja) * 1988-02-24 1996-03-21 富士通株式会社 リードフレーム及びそれを用いた電子部品の製造方法
US5025114A (en) * 1989-10-30 1991-06-18 Olin Corporation Multi-layer lead frames for integrated circuit packages
US5073521A (en) * 1989-11-15 1991-12-17 Olin Corporation Method for housing a tape-bonded electronic device and the package employed
US5103292A (en) * 1989-11-29 1992-04-07 Olin Corporation Metal pin grid array package
US4997517A (en) * 1990-01-09 1991-03-05 Olin Corporation Multi-metal layer interconnect tape for tape automated bonding
JP3033227B2 (ja) * 1990-05-08 2000-04-17 セイコーエプソン株式会社 半導体装置
GB9018763D0 (en) * 1990-08-28 1990-10-10 Lsi Logic Europ Mounting of electronic devices
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US20010030370A1 (en) * 1990-09-24 2001-10-18 Khandros Igor Y. Microelectronic assembly having encapsulated wire bonding leads
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5072279A (en) * 1990-10-29 1991-12-10 Delco Electronics Corporation Electrical interconnection having angular lead design
US5289032A (en) * 1991-08-16 1994-02-22 Motorola, Inc. Tape automated bonding(tab)semiconductor device and method for making the same
US5550323A (en) * 1991-08-28 1996-08-27 Lsi Logic Corporation Mounting of electronic devices
US5471077A (en) * 1991-10-10 1995-11-28 Hughes Aircraft Company High electron mobility transistor and methode of making
US7073254B2 (en) * 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
JP3384901B2 (ja) * 1995-02-02 2003-03-10 三菱電機株式会社 リードフレーム
KR0148203B1 (ko) * 1995-06-05 1998-08-01 이대원 리드 프레임의 내부 리드 설계 방법
JPH09213855A (ja) * 1996-01-30 1997-08-15 Nec Corp 中空プラスチックパッケージ用リードフレーム
US8033838B2 (en) * 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5937276A (en) 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
US20040105244A1 (en) * 2002-08-06 2004-06-03 Ilyas Mohammed Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions
US7132734B2 (en) * 2003-01-06 2006-11-07 Micron Technology, Inc. Microelectronic component assemblies and microelectronic component lead frame structures
US7183485B2 (en) * 2003-03-11 2007-02-27 Micron Technology, Inc. Microelectronic component assemblies having lead frames adapted to reduce package bow

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519890A (en) * 1968-04-01 1970-07-07 North American Rockwell Low stress lead
US3902148A (en) * 1970-11-27 1975-08-26 Signetics Corp Semiconductor lead structure and assembly and method for fabricating same
DE2315711B2 (de) * 1973-03-29 1980-07-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer integrierten Schaltungsanordnung
FR2299724A1 (fr) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres
US4234666A (en) * 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS5651850A (en) * 1979-10-05 1981-05-09 Nec Corp Lead frame
US4331740A (en) * 1980-04-14 1982-05-25 National Semiconductor Corporation Gang bonding interconnect tape process and structure for semiconductor device automatic assembly
US4400714A (en) * 1980-11-06 1983-08-23 Jade Corporation Lead frame for semiconductor chip
US4380042A (en) * 1981-02-23 1983-04-12 Angelucci Sr Thomas L Printed circuit lead carrier tape
US4496965A (en) * 1981-05-18 1985-01-29 Texas Instruments Incorporated Stacked interdigitated lead frame assembly
US4390598A (en) * 1982-04-05 1983-06-28 Fairchild Camera & Instrument Corp. Lead format for tape automated bonding

Also Published As

Publication number Publication date
US4721993A (en) 1988-01-26
JPS62229850A (ja) 1987-10-08
KR870007569A (ko) 1987-08-20
EP0233029A2 (en) 1987-08-19
FI870414A (fi) 1987-08-01
EP0233029A3 (en) 1988-03-02

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Legal Events

Date Code Title Description
FA Application withdrawn

Owner name: OLIN CORPORATION