FI855135A0 - FOERFARANDE FOER FRAMSTAELLNING AV ANSLUTNINGSLEDNINGSPLAOT. - Google Patents

FOERFARANDE FOER FRAMSTAELLNING AV ANSLUTNINGSLEDNINGSPLAOT.

Info

Publication number
FI855135A0
FI855135A0 FI855135A FI855135A FI855135A0 FI 855135 A0 FI855135 A0 FI 855135A0 FI 855135 A FI855135 A FI 855135A FI 855135 A FI855135 A FI 855135A FI 855135 A0 FI855135 A0 FI 855135A0
Authority
FI
Finland
Prior art keywords
anslutningsledningsplaot
foerfarande foer
foer framstaellning
framstaellning
foerfarande
Prior art date
Application number
FI855135A
Other languages
Finnish (fi)
Other versions
FI855135A (en
Inventor
Werner Tippelt
Walter Scharizer
Original Assignee
Voest Alpine Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Voest Alpine Ag filed Critical Voest Alpine Ag
Publication of FI855135A0 publication Critical patent/FI855135A0/en
Publication of FI855135A publication Critical patent/FI855135A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
FI855135A 1984-12-27 1985-12-23 FOERFARANDE FOER FRAMSTAELLNING AV ANSLUTNINGSLEDNINGSPLAOT. FI855135A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843447520 DE3447520A1 (en) 1984-12-27 1984-12-27 COMPOUND CIRCUIT BOARD, METHOD FOR PRODUCING A COMPOUND CIRCUIT BOARD AND USE OF ALUMINUM OXIDE AS THE INSULATING LAYER OF A COMPOUND CIRCUIT BOARD

Publications (2)

Publication Number Publication Date
FI855135A0 true FI855135A0 (en) 1985-12-23
FI855135A FI855135A (en) 1986-06-28

Family

ID=6253965

Family Applications (1)

Application Number Title Priority Date Filing Date
FI855135A FI855135A (en) 1984-12-27 1985-12-23 FOERFARANDE FOER FRAMSTAELLNING AV ANSLUTNINGSLEDNINGSPLAOT.

Country Status (3)

Country Link
EP (1) EP0186655A3 (en)
DE (1) DE3447520A1 (en)
FI (1) FI855135A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3838598A1 (en) * 1988-11-15 1990-05-23 Bosch Gmbh Robert Method for producing electronic circuits
US5290606A (en) * 1989-01-30 1994-03-01 Svein Hestevik Method for manufacturing a substrate for a printed circuit board
DE3910699A1 (en) * 1989-04-03 1990-10-04 Omt Oberflaechen Materialtech Printed circuit board for integrated circuits
FR2647294B1 (en) * 1989-05-18 1994-05-20 Applications Gles Electricite Me METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE
DE19641397A1 (en) * 1996-09-27 1998-04-02 Siemens Ag Manufacturing process for heat conducting printed circuit boards
US6180261B1 (en) * 1997-10-21 2001-01-30 Nitto Denko Corporation Low thermal expansion circuit board and multilayer wiring circuit board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3564565A (en) * 1964-05-05 1971-02-16 Texas Instruments Inc Process for adherently applying boron nitride to copper and article of manufacture
US3340264A (en) * 1964-05-06 1967-09-05 Du Pont Process for preparing n, n'-diarylperylenetetracarboxylic diimides
FR1526911A (en) * 1965-10-26 1968-05-31 English Electric Leo Marconi C Electrical connection boards, in particular for electronic calculators
AT316160B (en) * 1972-03-10 1974-06-25 Plansee Metallwerk Process for the production of wear-resistant coatings on wear parts of all kinds
CH566398A5 (en) * 1973-06-15 1975-09-15 Battelle Memorial Institute
US3900600A (en) * 1973-06-29 1975-08-19 Ibm Paraxylylene-silane dielectric films
GB2074793B (en) * 1980-04-22 1983-09-07 Ferranti Ltd Thin film circuit assembly
GB2080729A (en) * 1980-06-25 1982-02-10 Gen Electric A multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion and method for making same.
GB2080630B (en) * 1980-08-21 1985-07-10 Ingram & Glass Ltd Printed circuit panels
DE3035749A1 (en) * 1980-09-22 1982-05-06 Siemens AG, 1000 Berlin und 8000 München HEAT-DISCHARGE PCB
GB2110475A (en) * 1981-11-04 1983-06-15 Philips Electronic Associated Substrate for hybrid and printed circuits
GB2140460B (en) * 1983-05-27 1986-06-25 Dowty Electronics Ltd Insulated metal substrates

Also Published As

Publication number Publication date
FI855135A (en) 1986-06-28
DE3447520A1 (en) 1986-08-14
EP0186655A3 (en) 1986-10-22
EP0186655A2 (en) 1986-07-02
DE3447520C2 (en) 1988-05-19

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Legal Events

Date Code Title Description
FD Application lapsed

Owner name: VOEST-ALPINE AKTIENGESELLSCHAFT