FR2647294B1 - METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE - Google Patents

METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE

Info

Publication number
FR2647294B1
FR2647294B1 FR8906483A FR8906483A FR2647294B1 FR 2647294 B1 FR2647294 B1 FR 2647294B1 FR 8906483 A FR8906483 A FR 8906483A FR 8906483 A FR8906483 A FR 8906483A FR 2647294 B1 FR2647294 B1 FR 2647294B1
Authority
FR
France
Prior art keywords
electrical components
conductive circuit
metallic substrate
circuit printed
insulated metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR8906483A
Other languages
French (fr)
Other versions
FR2647294A1 (en
Inventor
Blot Jean-Yves
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
APPLICATIONS GLES ELECTRICITE ME
Original Assignee
APPLICATIONS GLES ELECTRICITE ME
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by APPLICATIONS GLES ELECTRICITE ME filed Critical APPLICATIONS GLES ELECTRICITE ME
Priority to FR8906483A priority Critical patent/FR2647294B1/en
Publication of FR2647294A1 publication Critical patent/FR2647294A1/en
Application granted granted Critical
Publication of FR2647294B1 publication Critical patent/FR2647294B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
FR8906483A 1989-05-18 1989-05-18 METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE Expired - Lifetime FR2647294B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8906483A FR2647294B1 (en) 1989-05-18 1989-05-18 METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8906483A FR2647294B1 (en) 1989-05-18 1989-05-18 METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE

Publications (2)

Publication Number Publication Date
FR2647294A1 FR2647294A1 (en) 1990-11-23
FR2647294B1 true FR2647294B1 (en) 1994-05-20

Family

ID=9381754

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8906483A Expired - Lifetime FR2647294B1 (en) 1989-05-18 1989-05-18 METHOD OF WELDING ELECTRICAL COMPONENTS ON A CONDUCTIVE CIRCUIT PRINTED ON AN INSULATED METALLIC SUBSTRATE

Country Status (1)

Country Link
FR (1) FR2647294B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2671933B1 (en) * 1991-01-18 1996-12-13 Ramy Jean Pierre PROCESS FOR INTEGRATING BRAZING MATERIAL IN THE MANUFACTURE OF ELECTRONIC CIRCUITS AND HOUSINGS.
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2548915A1 (en) * 1975-10-31 1977-05-12 Allg Electricitaets Ges Aeg Te Soldering circuit element to plate, esp. ceramic plate - with thick or thin film circuit by infrared heating from below avoids damage by excessive heating
JPS59161056A (en) * 1983-03-03 1984-09-11 Fuji Electric Corp Res & Dev Ltd Ceramic package semiconductor device
DE3447520A1 (en) * 1984-12-27 1986-08-14 Metallwerk Plansee GmbH, Reutte, Tirol COMPOUND CIRCUIT BOARD, METHOD FOR PRODUCING A COMPOUND CIRCUIT BOARD AND USE OF ALUMINUM OXIDE AS THE INSULATING LAYER OF A COMPOUND CIRCUIT BOARD
JPS63202989A (en) * 1987-02-19 1988-08-22 株式会社日立製作所 Soldering
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus

Also Published As

Publication number Publication date
FR2647294A1 (en) 1990-11-23

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