FI853363L - Foerfarande foer aendring av en elektrisk planartad byggenhet. - Google Patents

Foerfarande foer aendring av en elektrisk planartad byggenhet.

Info

Publication number
FI853363L
FI853363L FI853363A FI853363A FI853363L FI 853363 L FI853363 L FI 853363L FI 853363 A FI853363 A FI 853363A FI 853363 A FI853363 A FI 853363A FI 853363 L FI853363 L FI 853363L
Authority
FI
Finland
Prior art keywords
planartad
byggenhet
aendring
elektrisk
foerfarande foer
Prior art date
Application number
FI853363A
Other languages
English (en)
Finnish (fi)
Other versions
FI853363A0 (fi
Inventor
Anton Lochner
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI853363A0 publication Critical patent/FI853363A0/fi
Publication of FI853363L publication Critical patent/FI853363L/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
FI853363A 1984-09-03 1985-09-02 Foerfarande foer aendring av en elektrisk planartad byggenhet. FI853363L (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843432360 DE3432360A1 (de) 1984-09-03 1984-09-03 Verfahren zum aendern einer elektrischen flachbaugruppe

Publications (2)

Publication Number Publication Date
FI853363A0 FI853363A0 (fi) 1985-09-02
FI853363L true FI853363L (fi) 1986-03-04

Family

ID=6244541

Family Applications (1)

Application Number Title Priority Date Filing Date
FI853363A FI853363L (fi) 1984-09-03 1985-09-02 Foerfarande foer aendring av en elektrisk planartad byggenhet.

Country Status (9)

Country Link
US (1) US4731704A (de)
AR (1) AR242330A1 (de)
AT (1) AT388835B (de)
BR (1) BR8504238A (de)
CH (1) CH667562A5 (de)
DE (1) DE3432360A1 (de)
FI (1) FI853363L (de)
GR (1) GR852124B (de)
ZA (1) ZA856693B (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224022A (en) * 1990-05-15 1993-06-29 Microelectronics And Computer Technology Corporation Reroute strategy for high density substrates
US5220490A (en) * 1990-10-25 1993-06-15 Microelectronics And Computer Technology Corporation Substrate interconnect allowing personalization using spot surface links
US5184284A (en) * 1991-09-03 1993-02-02 International Business Machines Corporation Method and apparatus for implementing engineering changes for integrated circuit module
US5214250A (en) * 1991-09-19 1993-05-25 International Business Machines Corporation Method of reworking circuit panels, and circuit panels reworked thereby
JP2856240B2 (ja) * 1992-10-30 1999-02-10 インターナショナル・ビジネス・マシーンズ・コーポレイション プリント回路基板を再加工する方法
DE4302196C2 (de) * 1993-01-27 1996-02-22 Telefunken Microelectron Verfahren zum Ändern einer Teilfunktion einer elektrischen Baugruppe
US5307241A (en) * 1993-03-25 1994-04-26 Northern Telecom Limited Electronic circuit board arrangements including main auxiliary circuit boards
US5834824A (en) * 1994-02-08 1998-11-10 Prolinx Labs Corporation Use of conductive particles in a nonconductive body as an integrated circuit antifuse
US5726482A (en) * 1994-02-08 1998-03-10 Prolinx Labs Corporation Device-under-test card for a burn-in board
US5808351A (en) * 1994-02-08 1998-09-15 Prolinx Labs Corporation Programmable/reprogramable structure using fuses and antifuses
US5572409A (en) * 1994-02-08 1996-11-05 Prolinx Labs Corporation Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board
US5537108A (en) * 1994-02-08 1996-07-16 Prolinx Labs Corporation Method and structure for programming fuses
US5917229A (en) * 1994-02-08 1999-06-29 Prolinx Labs Corporation Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect
US5813881A (en) * 1994-02-08 1998-09-29 Prolinx Labs Corporation Programmable cable and cable adapter using fuses and antifuses
US5834705A (en) * 1994-03-04 1998-11-10 Silicon Graphics, Inc. Arrangement for modifying eletrical printed circuit boards
US5962815A (en) * 1995-01-18 1999-10-05 Prolinx Labs Corporation Antifuse interconnect between two conducting layers of a printed circuit board
US6091608A (en) * 1995-02-08 2000-07-18 Compaq Computer Corporation Method and apparatus for simplified and compact component addition to a printed circuit board
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
US5767575A (en) * 1995-10-17 1998-06-16 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US5872338A (en) * 1996-04-10 1999-02-16 Prolinx Labs Corporation Multilayer board having insulating isolation rings
DE19752938C2 (de) * 1997-11-28 2000-05-31 Pelikan Produktions Ag Egg Umkodierung von Tintendruckköpfen
US6034427A (en) * 1998-01-28 2000-03-07 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
JP2007059803A (ja) * 2005-08-26 2007-03-08 Fuji Xerox Co Ltd プリント基板、電子基板及び電子機器
US7351115B1 (en) 2007-01-17 2008-04-01 International Business Machines Corporation Method for modifying an electrical connector

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB842670A (en) * 1958-04-03 1960-07-27 Marconi Wireless Telegraph Co Improvements in or relating to printed circuit arrangements
DE1439642A1 (de) * 1963-08-08 1969-01-23 Telefunken Patent Elektrisches Bauelement
FR1464288A (fr) * 1965-01-15 1966-12-30 Telefonbau & Normalzeit Gmbh Circuits imprimés à plusieurs couches
DE2343581A1 (de) * 1973-08-29 1975-03-06 Roederstein Kondensatoren Vorrichtung zur befestigung und kontaktierung von elektrischen bauteilen an platinen
DE2650348A1 (de) * 1976-11-03 1978-05-11 Bosch Gmbh Robert Elektrische schaltungsanordnung
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
FR2402996A1 (fr) * 1977-09-12 1979-04-06 Labo Electronique Physique Procede de realisation de bulles metalliques sur un substrat perce, substrat ainsi traite et utilisation
DE2900838A1 (de) * 1979-01-11 1980-07-24 Bruno M Hess Leiterplatte
JPS5649178U (de) * 1979-09-21 1981-05-01
NL8202285A (nl) * 1982-06-07 1984-01-02 Philips Nv Inrichting met een electrische schakeling op een printplaat.
JPS6052084A (ja) * 1983-08-31 1985-03-23 株式会社東芝 印刷配線基板

Also Published As

Publication number Publication date
ZA856693B (en) 1986-04-30
DE3432360A1 (de) 1986-03-13
AT388835B (de) 1989-09-11
FI853363A0 (fi) 1985-09-02
US4731704A (en) 1988-03-15
GR852124B (de) 1986-01-03
CH667562A5 (de) 1988-10-14
BR8504238A (pt) 1986-07-01
AR242330A1 (es) 1993-03-31
ATA216585A (de) 1989-01-15

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Legal Events

Date Code Title Description
FD Application lapsed

Owner name: SIEMENS AKTIENGESELLSCHAFT