FI83176B - FOERFARANDE FOER STYRNING AV ROERELSER HOS EN ROBOT OCH EN STYCKEMANIPULATOR UNDER EN ROBOTCELLS INLAERNINGSSKEDE. - Google Patents
FOERFARANDE FOER STYRNING AV ROERELSER HOS EN ROBOT OCH EN STYCKEMANIPULATOR UNDER EN ROBOTCELLS INLAERNINGSSKEDE. Download PDFInfo
- Publication number
- FI83176B FI83176B FI894306A FI894306A FI83176B FI 83176 B FI83176 B FI 83176B FI 894306 A FI894306 A FI 894306A FI 894306 A FI894306 A FI 894306A FI 83176 B FI83176 B FI 83176B
- Authority
- FI
- Finland
- Prior art keywords
- robot
- point
- tool
- piece
- coordinate system
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 7
- 230000015654 memory Effects 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 210000004027 cell Anatomy 0.000 description 10
- 239000013598 vector Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- 210000003850 cellular structure Anatomy 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003936 working memory Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
- G05B19/4182—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell manipulators and conveyor only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0096—Programme-controlled manipulators co-operating with a working support, e.g. work-table
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/42—Recording and playback systems, i.e. in which the programme is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/39—Robotics, robotics to robotics hand
- G05B2219/39101—Cooperation with one or more rotating workpiece holders, manipulators
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/39—Robotics, robotics to robotics hand
- G05B2219/39134—Teach point, move workpiece, follow point with tip, place tip on next point
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Numerical Control (AREA)
Description
1 831761 83176
Menetelmä robotin ja kappalemanipulaattorin liikkeiden ohjaamiseksi robottisolun opetusvaiheen aikana Tämän keksinnön kohteena on menetelmä robotin ja 5 kappalemanipulaattorin (kääntöpöydän) liikkeiden ohjaamiseksi synkronoidusti robottisolun opetusvaiheen aikana.The present invention relates to a method for synchronously controlling the movements of a robot and a piece manipulator (turntable) during a robot cell training phase.
Nykyisissä järjestelmissä robotti ja kääntöpöytä voidaan ajaa synkroonissa toistettaessa opetettua ohjel-marataa, jolloin aikaansaadaan hallittu rataliike suhtees-10 sa kääntöpöydällä olevaan kappaleeseen. Järjestelmät tekevät mahdolliseksi monimutkaiset liikeradat verrattuna järjestelmiin, joista synkronointi puuttuu.In current systems, the robot and turntable can be run synchronously while repeating a taught program path, providing controlled path movement relative to the turntable on the turntable. The systems allow for complex trajectories compared to systems that lack synchronization.
Yleinen ongelma tällaisen robottijärjestelmän (solun) opetuksessa on se, että robotti on ennen jokaista 15 manipulaattorin liikevaihetta yleensä ajettava riittävän kauas kääntöpöydästä törmäysvaaran välttämiseksi, jonka jälkeen kappale käännetään haluttuun asentoon kääntöpöydän avulla, jonka jälkeen työkalun kärkipiste on ajettava kohdepisteeseen ja piste talletetettava ohjausjärjestel-20 män muistiin. Vrt. esim. US-patentti 4,836,742. Tämä toistuu opetusvaiheen aikana usein, joten opetus on hidasta verrattuna järjestelmään, jossa ei ole kääntöpöytää. Opetus on myös hankalaa, jos joudutaan opettamaan pisteitä ahtaissa paikoissa. Hitsausrobottisolu, joka muodostuu 25 esim. 5..6 vapausasteen robotista sekä 1..2 vapausasteen kappalemanipulaattorista (kääntöpöytä), on tässä suhteessa tyypillinen esimerkki.A common problem in teaching such a robotic system (cell) is that the robot must generally be driven far enough from the turntable before each turn of the manipulator to avoid the risk of collision, after which the part is turned to the desired position by the turntable, then the tool tip is driven to the target memory. See. e.g., U.S. Patent 4,836,742. This is repeated frequently during the teaching phase, so teaching is slow compared to a system without a turntable. Teaching is also tricky if you have to teach points in tight spaces. A welding robot cell consisting of 25 e.g. 5..6 degree of degree robots and 1..2 degrees of freedom piece manipulator (turntable) is a typical example in this respect.
Esitettävä keksintö pyrkii ratkaisemaan ongelmat jotka liittyvät robotin ja kääntöpöydän liikkeiden hal-30 Untaan pisteopetuksen aikana. Tämän aikaansaamiseksi keksinnön mukaiselle menetelmälle on tunnusomaista seuraavat vaiheet: - ohjataan toista solun komponenttia, robottia tai kappa-lemanipulaattoria, seuraavan opetettavan pisteen edellyt-35 tämään asentoon, samalla kun toinen komponentti synkronoidusti seuraa toista siten, että robotin työkalun ja työ- 2 83176 kappaleen keskinäinen positio pysyy muuttumattomana; - ohjataan toista solun komponenttia, robottia tai kappa-lemanipulaattoria, ensimmäiseksi opetetun pisteen positiosta seuraavaan pisteeseen vastaten toisen komponentin 5 asentoa ja talletetaan ko. pisteen koordinaatit muistiin; - toistetaan näitä vaiheita kunnes opetettavien liikeratojen kaikki tarvittavat pisteet on käyty läpi.The present invention seeks to solve the problems associated with the movement of robot and turntable movements during point teaching. To achieve this, the method according to the invention is characterized by the following steps: - controlling the second cell component, robot or body manipulator, to the position required by the next point to be taught, while the second component synchronously follows the other so that the robot tool and the workpiece 2 83176 the position remains unchanged; - controlling the second cell component, robot or body manipulator, from the position of the first taught point to the next point corresponding to the position of the second component 5 and storing said point coordinates to memory; - repeat these steps until all the necessary points of the trajectories to be taught have been covered.
Keksinnön muille edullisille sovellutusmuodoille on tun-10 nusomaista se, mitä jäljempänä olevissa patenttivaatimuksissa on esitetty.Other preferred embodiments of the invention are characterized by what is set forth in the claims below.
Keksintöä selostetaan seuraavassa tarkemmin esimerkin avulla viittamalla oheisiin piirustuksiin, joissaThe invention will now be described in more detail by way of example with reference to the accompanying drawings, in which
Kuvio 1 esittää perspektiivikuvaa robottisolusta, 15 Kuvio 2 esittää kuvion 1 mukaisen robottisolun yk sinkertaistettua mallia.Figure 1 shows a perspective view of a robot cell. Figure 2 shows a simplified model of the robot cell of Figure 1.
Kuvio 3 esittää robottisolun ohjaujärjestelmän lohkokaaviota,Figure 3 shows a block diagram of a robot cell control system,
Kuvio 4 esittää robottisolun eri komponenttien toi-20 mintaa opetuksessa.Figure 4 shows the operation of the various components of the robot cell in teaching.
Keksinnön mukaisen menetelmän järkevä käyttö edellyttää, että robottisolu muodostuu vähintäin 3 vapausasteen robotista, vähintäin 1 vapausasteen kääntöpöydästä sekä niitä ohjaavasta ohjausyksiköstä.The rational use of the method according to the invention requires that the robot cell consists of a robot with at least 3 degrees of freedom, a turntable of at least 1 degree of freedom and a control unit controlling them.
25 Kuvio 1 esittää erästä järjestelmää, jolla keksin nön mukainen opetuksen aikainen synkronointi voidaan toteuttaa. Kuvatussa järjestelyssä työstettävä kappale kiinnitetään kääntöpöytään 1 ja tarvittava työkalu robottiin 2, tai päinvastoin. Seuraavassa esimerkissä työstettävä 30 kappale kiinnitetään kääntöpyötään ja työkalu, hitsauspol-tin 3, kiinnitetään robotin työkalulaippaan.Figure 1 shows a system with which the in-service synchronization according to the invention can be implemented. In the described arrangement, the workpiece is fixed to the turntable 1 and the necessary tool to the robot 2, or vice versa. In the following example, the workpiece 30 to be machined is attached to its turntable and the tool, the welding torch 3, is attached to the tool flange of the robot.
Robotin ja kääntöpöydän nivelet voivat olla esim. kiertotyyppisiä niveliä tai lineaariniveliä. Tässä robotti 2 on kuuden vapausasteen nivelmekanismi, jonka kaikki 35 nivelet ovat kiertoniveliä. Nivelten kiertoakselit on mer- 3 83176 kitty Jl,32,J3,34,J5, J6. Kääntöpöydässä 2 on kaksi kiertyvää niveltä, joiden akselit on merkitty J7 (kääntö) ja J8 (kierto). Jokaisessa nivelessä on tunnetun tekniikan mukaisesti moottori jota voidaan ajaa vastaavan nivelser-5 von kautta. Nivelen asennon lukemista varten moottoreissa on absoluuttienkooderit, joiden signaalit on kytketty vastaavaan nivelservoon. Näitä itsestään selviä komponentteja ei kuvioon 1 ole piirretty.The joints of the robot and the turntable can be, for example, rotary-type joints or linear joints. Here, the robot 2 is a six-degree-of-freedom joint mechanism with all 35 joints being swivel joints. The axes of rotation of the joints are 3 83176 kitty J1, 32, J3,34, J5, J6. The turntable 2 has two rotating joints, the axes of which are marked J7 (turn) and J8 (turn). According to the prior art, each joint has a motor which can be driven via a corresponding joint-5 von. To read the position of the joint, the motors have absolute encoders whose signals are connected to the corresponding joint servo. These obvious components are not drawn in Figure 1.
Kuvio 2 esittää pelkistettyä mallia kuvan 1 järjes-10 telmästä. Kääntöpöydän asentoa kuvaa suorakulmainen koordinaatisto T, robotin kiinnitysalustassa on suorakulmainen koordinaatisto W ja työkalun kärjessä suorakulmainen koordinaatisto P. Koordinatiston T asennon määräävät kääntö-pöydän akseleiden nivelkulmat.Figure 2 shows a reduced model of the system of Figure 1. The position of the turntable is described by a rectangular coordinate system T, the robot mounting base has a rectangular coordinate system W and the tool tip a rectangular coordinate system P. The position of the coordinate system T is determined by the articulation angles of the turntable axes.
15 Robotin 2 koordinaatiston W suunta on valittu si ten, että z-akseli on nivelen Jl suuntainen, y-akselin suunta on nivelen J2 suuntainen, kun Jl:n nivelkulma = 0, ja x-akseli on kohtisuorassa em. akseleita vastaan. W-koordinaatiston origo on Jl ja J2 akseleiden leikkauspis-20 teessä B.The direction W of the coordinate system of the robot 2 is selected such that the z-axis is parallel to the joint J1, the y-axis is parallel to the joint J2 when the joint angle of J1 = 0, and the x-axis is perpendicular to the above axes. The origin of the W coordinate system is at the intersection B of the axes J1 and J2.
Kääntöpöydän 1 koordinaatiston z-akseli osoittaa J8:n suuntaan (= Jl:n suunta), ja x-akseli on J7:n ja W-koordinaatiston x-akselin suuntainen silloin, kun J8 on 0-kulmassa. T-koordinaatiston origo sijaitsee J7 ja J8 ak-25 seleiden leikkauspisteessä A (vrt. kuvio 1).The z-axis of the coordinate system of the turntable 1 points in the direction of J8 (= direction of J1), and the x-axis is parallel to the x-axis of J7 and the W-coordinate system when J8 is at an angle of 0. The origin of the T-coordinate system is located at the intersection A of the J7 and J8 ak-25 selels (cf. Fig. 1).
Työkalukoordinaatiston P paikka ja orientaatio suhteessa W-koordinaatistoon riippuvat robotin nivelkulmista J1...J6, työkalukoordinaatiston origo sijaitsee työkalun kärkipisteessä.The position and orientation of the tool coordinate system P in relation to the W coordinate system depend on the joint angles J1 ... J6 of the robot, the origin of the tool coordinate system is located at the tool tip.
30 Keksinnön mukainen liikeradan opetus tapahtuu piste pisteeltä ajamalla työkalun kärkipiste 4 ensin käsiohjai-mella haluttuun pisteeseen. Sen jälkeen käyttäjä voi muuttaa työkalun ja kappaleen välistä orientaatiota ajamalla kääntöpöydän niveliä synkroonissa robotin kanssa. Näin 35 voidaan hakea esim. hitsauksessa oikea poltinkulma hitsat- 4 83176 tavaan kappaleeseen nähden ilman robotin ajoa edestakaisin turvaetäisyydelle, koska työkalun orientaatio pysyy synkronoinnin takia vakiona W-koordinaatiston suhteen).The training of the trajectory according to the invention takes place point by point by first moving the tool tip point 4 to the desired point with a hand control. The user can then change the orientation between the tool and the workpiece by running the turntable joints in synchronism with the robot. In this way, for example, in welding, the correct torch angle with respect to the part to be welded can be obtained without driving the robot back and forth to the safety distance, since the orientation of the tool remains constant with respect to the W coordinate system due to synchronization.
Ajettaessa kääntöpöytää synkronoidusti robotin 5 kanssa tapahtuu liikeratalaskenta T-koordinatiston suhteen W-koordinaatiston sijaan. Ohjausjärjestelmän laskentayksikkö suorittaa tarvittavat muunnosoperaatiot W-koordinaa-tistosta T-koordinaatistoon ja päinvastoin. Ajettaessa kääntöpöydän niveliä opetusvaiheen aikana ohjausyksikkö 10 huolehtii siitä, että työkalun kärkipisteen paikka suhteessa kääntöpöydällä olevaan kappaleeseen ei muutu. Työkalun orientaatio on mahdollista pitää vakiona joko T-koordinaatiston suhteen, jolloin työkalu pysyy täsmälleen samassa asennossa kappaleeseen nähden kääntöpöydän niveliä 15 ajettaessa, tai W-koordinatiston suhteen, jolloin työkalun kärki pysyy samassa paikassa suhteessa kappaleeseen.When running the turntable in synchronism with the robot 5, the trajectory is calculated with respect to the T-coordinate system instead of the W-coordinate system. The calculation unit of the control system performs the necessary conversion operations from the W coordinate system to the T coordinate system and vice versa. When driving the turntable joints during the training phase, the control unit 10 ensures that the position of the tool tip relative to the workpiece on the turntable does not change. It is possible to keep the orientation of the tool constant either with respect to the T-coordinate system, whereby the tool remains in exactly the same position with respect to the workpiece when driving the turntable 15, or with respect to the W-coordinate system, whereby the tool tip remains in the same position with respect to the workpiece.
Synkronoitujen opetuslrikkeiden laskenta etenee laskentajakson aikana seuraavasti.The calculation of the synchronized tutorials proceeds during the calculation period as follows.
- lasketaan robotin nivelkulmien perusteella työ-20 kalun paikka Pw W-koordinaatistossa tai käytetään hyväksi edellisen laskentajakson aikana laskettua työkalun paikkaa - muunnetaan piste Pw W-koordinaatistosta T-koordinaatistoon (piste Pt) 25 - lisätään kääntöpöydän nivelkulmiin ajonopeuden edellyttämä muutoskulma - lasketaan pisteen Pt paikka W-koordinaatistossa käyttäen uusia kääntöpöydän nivelkulmia (piste Pw2) - lasketaan uudet nivelkulmat robotille pisteen Pw2 30 perusteella- calculate the position of the tool-20 in the Pw W coordinate system on the basis of the robot's articulation angles or use the tool position calculated during the previous calculation period - convert the point Pw from the W coordinate system to the T-coordinate system (point Pt) 25 - add the change angle P In the W coordinate system using new swivel table articulation angles (point Pw2) - new articulation angles for the robot are calculated based on point Pw2 30
Laskentajakson pituus on vakio ja tyypillisesti muutamia kymmeniä millisekunteja.The length of the calculation period is constant and typically a few tens of milliseconds.
Suoritettaessa synkronoituja opetusliikkeitä laskee ohjausyksikkö kunkin laskentajakson aikana työkalun sen 35 hetkisen aseman Pw W-koordinaatistossa. Piste P voidaan 5 83176 esittää transformaatiomatriisin muodossa P * ( nx ox ax px ) ( ny oy ay py ) 5 ( nz oz az pz ) ( 0 0 0 1 ) missä vektori (px,py,pz) osoittaa pisteen origon paikkaa vektori (nx,ny,nz) - työkalukoordinatiston x-akseli 10 pisteessä P, vektori (ox,oy,oz) = työkalukoordinaatiston y-akseli pisteessä P, vektori (ax,ay,az) = työkalukoordinaatiston z-akseli pisteessä P.When performing synchronized training movements, the control unit calculates the tool in its P-W coordinate system at its current position during each calculation period. The point P can be represented by the transformation matrix P * (nx ox ax px) (ny oy ay py) 5 (n 0 oz az pz) (0 0 0 1) where the vector (px, py, pz) indicates the position of the origin of the point vector ( nx, ny, nz) - x-axis of the tool coordinate system at 10 P, vector (ox, oy, oz) = y-axis of the tool coordinate system at P, vector (ax, ay, az) = z-axis of the tool coordinate system at P.
15 Pisteen Pw muunnos W koordinaatistosta T koordinaa tistoon pisteeksi Pt tapahtuu kertomalla Pw T-koodinaatis-ton paikkaa ja orientaatiota kuvaavan transformaatiomatriisin T käänteismatriisilla Τ' 20 Pt = T'*Pw T-matriisi voidaan helposti määrätä tunnettaessa T-koordi-naatiston origon sijainti W-koordinaatistossa sekä kääntö-pöydän akseleiden nivelkulmat J7,J8.15 The transformation of the point Pw from the W coordinate system T to the coordinate system Pt takes place by multiplying the transformation matrix T describing the position and orientation of the Pw T coordinate system by the inverse matrix Τ '20 Pt = T' * Pw The T matrix can be easily determined by knowing the origin in the coordinate system and the articulation angles J7, J8 of the rotary table axes.
25 T * ( C8 -S8 0 px ) ( C7*S8 C7*C8 -S7 py ) ( S7*S8 S7*C8 C7 pz ) 30 missä C7 = cos(J7) C8 * cos(J8) 57 = sin(J7) 58 * sin(J8) vektori (px,py,pz) = T-koordinaatiston origon si-35 jainti W-koordinaatistossa.25 T * (C8 -S8 0 px) (C7 * S8 C7 * C8 -S7 py) (S7 * S8 S7 * C8 C7 pz) 30 where C7 = cos (J7) C8 * cos (J8) 57 = sin (J7 ) 58 * sin (J8) vector (px, py, pz) = position si-35 of the origin of the T coordinate system in the W coordinate system.
6 831766 83176
Pisteen Pt muunnos takaisin W-koordinaatistoon saadaan seuraavastiThe transformation of the point Pt back into the W coordinate system is obtained as follows
Pw2 = T*Pt 5Pw2 = T * Pt 5
Jos työkalun orientaatio halutaan pitää vakiona W-koordinaatistoon nähden käytetään lasketun pisteen Pw2 paikka-vektoria (px,py,pz), ja pisteeseen Pw orientaatiovektorei-ta laskettaessa robotin nivelkulmia J1...J6. Jos työkalun 10 orientaatio halutaan pitää vakiona T-koordinaatiston suhteen voidaan robotin nivelkulmat J1..J6 laskea suoraan Pw2 pisteestä.If the orientation of the tool is to be kept constant with respect to the W coordinate system, the position vector of the calculated point Pw2 (px, py, pz) is used, and for the point Pw the orientation vectors J1 ... J6 are calculated when calculating the orientation vectors. If the orientation of the tool 10 is to be kept constant with respect to the T-coordinate system, the joint angles J1..J6 of the robot can be calculated directly from the point Pw2.
Kuvio 3 esittää robottisolun ohjausjärjestelmää, jolla pystytään ajamaan sekä robottia että kääntöpöytää 15 samanaikaisesti. Se muodostuu laskentayksiköstä 5 ja sen työmuistista 6, jotka yhdessä muodostavat katkoviivoin rajatun tietokonelaitteiston 4, käsiohjauspaneelista 7 sekä nivelservoista 8, jotka on kytketty robotin ja käänt-öpöydän vastaaviin moottoreihin 9 sekä enkoodereihin 10. 20 Nivelservot 8 ohjaavat kukin omaa niveltään J1 ... J8 laskentayksiköltä 5 tulevien ohjeiden mukaan. Laskentayksikkö voi esim. käskeä tiettyä nivelservoa 8 ajamaan haluttuun enkooderilukemaan.Figure 3 shows a robot cell control system capable of driving both the robot and the turntable 15 simultaneously. It consists of a computing unit 5 and its working memory 6, which together form a dashed computer hardware 4, a manual control panel 7 and articulated servos 8 connected to the respective motors 9 and encoders 10 of the robot and the turntable. according to the instructions from unit 5. The calculation unit can, for example, instruct a certain articulated servo 8 to drive to the desired encoder reading.
Kuvio 4 esittää tilannetta käytännössä. Siinä on 25 vasemmalla esitetty robotin 2 varsi, johon on kiinnitetty hitsauspoltin 3. Kääntöpöytään 1 on jigillä tms. avulla kiinnitetty mielivaltainen työkappale, jota ei ole piirretty. Työkappaleen piste P1 on juuri opetettu robottiso-lulle ajamalla käsin hitsauspoltin 3 sopivaan asemaan 30 kääntöpöytään 1 nähden. Oikealla on tilanne, jossa kääntö-pöytä 1 on käännetty kuvion 2 J7-akselin suhteen tietyn määrän seuraavaksi opetettavaa pistettä varten. Tällöin robotin 2 varsi seuraa keksinnön mukaisen synkronoinnin takia kääntöpöydän 1 liikettä automaattisesti pisteeseen 35 P2, jossa hitsauspolttimen 3 kärjen asema on muuttumaton 7 83176 työkappaleeseen (ei piirretty) nähden. Kuten yllä on todettu, voidaan opetukseen myös sisällyttää sen, että myös työkalun orientaatio työkappaleeseen nähden pysyy vakiona. Nyt uusi piste P3 voidaan opettaa järjestelmälle ajamalla 5 robotilla hitsauspoltinta 3 uuteen kohteeseen, mahdollisesti polttimen 3 asentoa muuttaen, kuviossa esitettyyn pisteeseen P3. Näin jatketaan, kunnes halutun liikeradan aikaansaamiseksi kaikki tarvittavat pisteet P1 ... Pn on opetettu.Figure 4 shows the situation in practice. It has 25 the arms of a robot 2 shown on the left, to which a welding torch 3 is attached. An arbitrary workpiece, which is not drawn, is attached to the turntable 1 by means of a jig or the like. The workpiece point P1 has just been taught to the robot cell by manually driving the welding torch 3 to a suitable position 30 relative to the turntable 1. On the right is a situation where the turntable 1 is turned relative to the J7 axis of Fig. 2 for a certain number of points to be taught next. In this case, due to the synchronization according to the invention, the arm of the robot 2 automatically follows the movement of the turntable 1 to the point 35 P2, where the position of the tip of the welding torch 3 is unchanged with respect to the workpiece (not drawn). As stated above, it can also be included in the teaching that the orientation of the tool relative to the workpiece also remains constant. Now the new point P3 can be taught to the system by driving the robot 5 the welding torch 3 to a new target, possibly changing the position of the torch 3, to the point P3 shown in the figure. This is continued until all the necessary points P1 ... Pn to achieve the desired trajectory have been taught.
10 Alan ammattimiehelle on selvää, että keksinnön eri sovellutusmuodot eivät rajoitu yllä esitettyihin esimerkkeihin, vaan että ne voivat vaihdella jäljempänä olevien patenttivaatimusten puitteissa.It will be apparent to those skilled in the art that the various embodiments of the invention are not limited to the examples set forth above, but may vary within the scope of the claims below.
Claims (3)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI894306A FI83176C (en) | 1989-09-12 | 1989-09-12 | A method for controlling the movements of a robot and a piece manipulator during the learning phase of a robot cell |
PCT/FI1990/000192 WO1991004522A1 (en) | 1989-09-12 | 1990-08-09 | Synchronized teaching of a robot cell |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI894306 | 1989-09-12 | ||
FI894306A FI83176C (en) | 1989-09-12 | 1989-09-12 | A method for controlling the movements of a robot and a piece manipulator during the learning phase of a robot cell |
Publications (3)
Publication Number | Publication Date |
---|---|
FI894306A0 FI894306A0 (en) | 1989-09-12 |
FI83176B true FI83176B (en) | 1991-02-28 |
FI83176C FI83176C (en) | 1991-06-10 |
Family
ID=8528974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI894306A FI83176C (en) | 1989-09-12 | 1989-09-12 | A method for controlling the movements of a robot and a piece manipulator during the learning phase of a robot cell |
Country Status (2)
Country | Link |
---|---|
FI (1) | FI83176C (en) |
WO (1) | WO1991004522A1 (en) |
Families Citing this family (250)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5197846A (en) * | 1989-12-22 | 1993-03-30 | Hitachi, Ltd. | Six-degree-of-freedom articulated robot mechanism and assembling and working apparatus using same |
JP2514490B2 (en) * | 1991-07-05 | 1996-07-10 | 株式会社ダイヘン | Teaching control method by interlocking manual operation of industrial robot |
DE69216167T2 (en) * | 1991-07-06 | 1997-07-10 | Daihen Corp | Device for controlling an industrial robot to carry out coordinated operations using a playback teaching method and related method |
JP3306781B2 (en) * | 1992-12-31 | 2002-07-24 | 株式会社ダイヘン | Teaching control device and teaching method by manual operation of industrial robot |
US7085623B2 (en) * | 2002-08-15 | 2006-08-01 | Asm International Nv | Method and system for using short ranged wireless enabled computers as a service tool |
EP1763421A1 (en) * | 2004-03-16 | 2007-03-21 | Abb Ab | System of manupulators and method for controlling such a system |
DE202007002364U1 (en) | 2007-02-14 | 2008-06-19 | Kuka Systems Gmbh | positioning |
DE102008031487A1 (en) | 2008-07-03 | 2010-01-07 | Ex-Cell-O Gmbh | Processing plant for workpieces |
DE102008032259B4 (en) * | 2008-07-09 | 2010-08-12 | Dürr Systems GmbH | Method and system for applying a coating material with a programmable robot and programming frame |
US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
ITBO20100412A1 (en) * | 2010-06-28 | 2011-12-29 | Ferri Srl | ATTACHMENT DEVICE TO AN ARTICULATED ARM OF A TOOL |
US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
US20160376700A1 (en) | 2013-02-01 | 2016-12-29 | Asm Ip Holding B.V. | System for treatment of deposition reactor |
US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
CN105058382A (en) * | 2015-08-04 | 2015-11-18 | 汕头大学 | Novel series-parallel five-axis-linkage intelligent welding platform |
US10211308B2 (en) | 2015-10-21 | 2019-02-19 | Asm Ip Holding B.V. | NbMC layers |
US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
US10190213B2 (en) | 2016-04-21 | 2019-01-29 | Asm Ip Holding B.V. | Deposition of metal borides |
US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
US9859151B1 (en) | 2016-07-08 | 2018-01-02 | Asm Ip Holding B.V. | Selective film deposition method to form air gaps |
US9812320B1 (en) | 2016-07-28 | 2017-11-07 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US9887082B1 (en) | 2016-07-28 | 2018-02-06 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
KR102532607B1 (en) | 2016-07-28 | 2023-05-15 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and method of operating the same |
US10643826B2 (en) | 2016-10-26 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for thermally calibrating reaction chambers |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
US10714350B2 (en) | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
KR102546317B1 (en) | 2016-11-15 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | Gas supply unit and substrate processing apparatus including the same |
KR20180068582A (en) | 2016-12-14 | 2018-06-22 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
KR20180070971A (en) | 2016-12-19 | 2018-06-27 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10867788B2 (en) | 2016-12-28 | 2020-12-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
KR102457289B1 (en) | 2017-04-25 | 2022-10-21 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing a thin film and manufacturing a semiconductor device |
US10892156B2 (en) | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US10886123B2 (en) | 2017-06-02 | 2021-01-05 | Asm Ip Holding B.V. | Methods for forming low temperature semiconductor layers and related semiconductor device structures |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
KR20190009245A (en) | 2017-07-18 | 2019-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Methods for forming a semiconductor device structure and related semiconductor device structures |
US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
KR102491945B1 (en) | 2017-08-30 | 2023-01-26 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
KR102401446B1 (en) | 2017-08-31 | 2022-05-24 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
KR102630301B1 (en) | 2017-09-21 | 2024-01-29 | 에이에스엠 아이피 홀딩 비.브이. | Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same |
US10844484B2 (en) | 2017-09-22 | 2020-11-24 | Asm Ip Holding B.V. | Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
US10910262B2 (en) | 2017-11-16 | 2021-02-02 | Asm Ip Holding B.V. | Method of selectively depositing a capping layer structure on a semiconductor device structure |
US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
TWI779134B (en) | 2017-11-27 | 2022-10-01 | 荷蘭商Asm智慧財產控股私人有限公司 | A storage device for storing wafer cassettes and a batch furnace assembly |
JP7206265B2 (en) | 2017-11-27 | 2023-01-17 | エーエスエム アイピー ホールディング ビー.ブイ. | Equipment with a clean mini-environment |
US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
CN111630203A (en) | 2018-01-19 | 2020-09-04 | Asm Ip私人控股有限公司 | Method for depositing gap filling layer by plasma auxiliary deposition |
TWI799494B (en) | 2018-01-19 | 2023-04-21 | 荷蘭商Asm 智慧財產控股公司 | Deposition method |
US11018047B2 (en) | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
KR102657269B1 (en) | 2018-02-14 | 2024-04-16 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing a ruthenium-containing film on a substrate by a cyclic deposition process |
US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
KR102636427B1 (en) | 2018-02-20 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing method and apparatus |
US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
JP2019147236A (en) * | 2018-02-28 | 2019-09-05 | 株式会社アイエイアイ | Robot system |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
KR102646467B1 (en) | 2018-03-27 | 2024-03-11 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102501472B1 (en) | 2018-03-30 | 2023-02-20 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing method |
US12025484B2 (en) | 2018-05-08 | 2024-07-02 | Asm Ip Holding B.V. | Thin film forming method |
KR20190128558A (en) | 2018-05-08 | 2019-11-18 | 에이에스엠 아이피 홀딩 비.브이. | Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures |
KR20190129718A (en) | 2018-05-11 | 2019-11-20 | 에이에스엠 아이피 홀딩 비.브이. | Methods for forming a doped metal carbide film on a substrate and related semiconductor device structures |
KR102596988B1 (en) | 2018-05-28 | 2023-10-31 | 에이에스엠 아이피 홀딩 비.브이. | Method of processing a substrate and a device manufactured by the same |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
US11270899B2 (en) | 2018-06-04 | 2022-03-08 | Asm Ip Holding B.V. | Wafer handling chamber with moisture reduction |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
KR102568797B1 (en) | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing system |
US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
TWI819010B (en) | 2018-06-27 | 2023-10-21 | 荷蘭商Asm Ip私人控股有限公司 | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
WO2020003000A1 (en) | 2018-06-27 | 2020-01-02 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
TWI751420B (en) | 2018-06-29 | 2022-01-01 | 荷蘭商Asm知識產權私人控股有限公司 | Thin-film deposition method |
US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
KR20200030162A (en) | 2018-09-11 | 2020-03-20 | 에이에스엠 아이피 홀딩 비.브이. | Method for deposition of a thin film |
US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
CN110970344A (en) | 2018-10-01 | 2020-04-07 | Asm Ip控股有限公司 | Substrate holding apparatus, system including the same, and method of using the same |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102592699B1 (en) | 2018-10-08 | 2023-10-23 | 에이에스엠 아이피 홀딩 비.브이. | Substrate support unit and apparatuses for depositing thin film and processing the substrate including the same |
KR102605121B1 (en) | 2018-10-19 | 2023-11-23 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and substrate processing method |
KR102546322B1 (en) | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and substrate processing method |
USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
KR20200051105A (en) | 2018-11-02 | 2020-05-13 | 에이에스엠 아이피 홀딩 비.브이. | Substrate support unit and substrate processing apparatus including the same |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
KR102636428B1 (en) | 2018-12-04 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | A method for cleaning a substrate processing apparatus |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
JP7504584B2 (en) | 2018-12-14 | 2024-06-24 | エーエスエム・アイピー・ホールディング・ベー・フェー | Method and system for forming device structures using selective deposition of gallium nitride - Patents.com |
TWI819180B (en) | 2019-01-17 | 2023-10-21 | 荷蘭商Asm 智慧財產控股公司 | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
KR20200091543A (en) | 2019-01-22 | 2020-07-31 | 에이에스엠 아이피 홀딩 비.브이. | Semiconductor processing device |
CN111524788B (en) | 2019-02-01 | 2023-11-24 | Asm Ip私人控股有限公司 | Method for topologically selective film formation of silicon oxide |
JP7509548B2 (en) | 2019-02-20 | 2024-07-02 | エーエスエム・アイピー・ホールディング・ベー・フェー | Cyclic deposition method and apparatus for filling recesses formed in a substrate surface - Patents.com |
US11482533B2 (en) | 2019-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Apparatus and methods for plug fill deposition in 3-D NAND applications |
KR102626263B1 (en) | 2019-02-20 | 2024-01-16 | 에이에스엠 아이피 홀딩 비.브이. | Cyclical deposition method including treatment step and apparatus for same |
JP2020136678A (en) | 2019-02-20 | 2020-08-31 | エーエスエム・アイピー・ホールディング・ベー・フェー | Method for filing concave part formed inside front surface of base material, and device |
JP2020133004A (en) | 2019-02-22 | 2020-08-31 | エーエスエム・アイピー・ホールディング・ベー・フェー | Base material processing apparatus and method for processing base material |
KR20200108248A (en) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME |
KR20200108243A (en) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | Structure Including SiOC Layer and Method of Forming Same |
KR20200108242A (en) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | Method for Selective Deposition of Silicon Nitride Layer and Structure Including Selectively-Deposited Silicon Nitride Layer |
JP2020167398A (en) | 2019-03-28 | 2020-10-08 | エーエスエム・アイピー・ホールディング・ベー・フェー | Door opener and substrate processing apparatus provided therewith |
KR20200116855A (en) | 2019-04-01 | 2020-10-13 | 에이에스엠 아이피 홀딩 비.브이. | Method of manufacturing semiconductor device |
KR20200123380A (en) | 2019-04-19 | 2020-10-29 | 에이에스엠 아이피 홀딩 비.브이. | Layer forming method and apparatus |
KR20200125453A (en) | 2019-04-24 | 2020-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Gas-phase reactor system and method of using same |
KR20200130121A (en) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | Chemical source vessel with dip tube |
KR20200130118A (en) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | Method for Reforming Amorphous Carbon Polymer Film |
KR20200130652A (en) | 2019-05-10 | 2020-11-19 | 에이에스엠 아이피 홀딩 비.브이. | Method of depositing material onto a surface and structure formed according to the method |
JP2020188254A (en) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | Wafer boat handling device, vertical batch furnace, and method |
JP2020188255A (en) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | Wafer boat handling device, vertical batch furnace, and method |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
KR20200141002A (en) | 2019-06-06 | 2020-12-17 | 에이에스엠 아이피 홀딩 비.브이. | Method of using a gas-phase reactor system including analyzing exhausted gas |
KR20200143254A (en) | 2019-06-11 | 2020-12-23 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming an electronic structure using an reforming gas, system for performing the method, and structure formed using the method |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
KR20210005515A (en) | 2019-07-03 | 2021-01-14 | 에이에스엠 아이피 홀딩 비.브이. | Temperature control assembly for substrate processing apparatus and method of using same |
JP7499079B2 (en) | 2019-07-09 | 2024-06-13 | エーエスエム・アイピー・ホールディング・ベー・フェー | Plasma device using coaxial waveguide and substrate processing method |
CN112216646A (en) | 2019-07-10 | 2021-01-12 | Asm Ip私人控股有限公司 | Substrate supporting assembly and substrate processing device comprising same |
KR20210010307A (en) | 2019-07-16 | 2021-01-27 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
KR20210010820A (en) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Methods of forming silicon germanium structures |
KR20210010816A (en) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Radical assist ignition plasma system and method |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
TWI839544B (en) | 2019-07-19 | 2024-04-21 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming topology-controlled amorphous carbon polymer film |
TW202113936A (en) | 2019-07-29 | 2021-04-01 | 荷蘭商Asm Ip私人控股有限公司 | Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation |
CN112309899A (en) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
CN112309900A (en) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
KR20210018759A (en) | 2019-08-05 | 2021-02-18 | 에이에스엠 아이피 홀딩 비.브이. | Liquid level sensor for a chemical source vessel |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
JP2021031769A (en) | 2019-08-21 | 2021-03-01 | エーエスエム アイピー ホールディング ビー.ブイ. | Production apparatus of mixed gas of film deposition raw material and film deposition apparatus |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
KR20210024423A (en) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | Method for forming a structure with a hole |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
KR20210024420A (en) | 2019-08-23 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
KR20210029090A (en) | 2019-09-04 | 2021-03-15 | 에이에스엠 아이피 홀딩 비.브이. | Methods for selective deposition using a sacrificial capping layer |
KR20210029663A (en) | 2019-09-05 | 2021-03-16 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
CN112593212B (en) | 2019-10-02 | 2023-12-22 | Asm Ip私人控股有限公司 | Method for forming topologically selective silicon oxide film by cyclic plasma enhanced deposition process |
KR20210042810A (en) | 2019-10-08 | 2021-04-20 | 에이에스엠 아이피 홀딩 비.브이. | Reactor system including a gas distribution assembly for use with activated species and method of using same |
CN112635282A (en) | 2019-10-08 | 2021-04-09 | Asm Ip私人控股有限公司 | Substrate processing apparatus having connection plate and substrate processing method |
KR20210043460A (en) | 2019-10-10 | 2021-04-21 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming a photoresist underlayer and structure including same |
US12009241B2 (en) | 2019-10-14 | 2024-06-11 | Asm Ip Holding B.V. | Vertical batch furnace assembly with detector to detect cassette |
TWI834919B (en) | 2019-10-16 | 2024-03-11 | 荷蘭商Asm Ip私人控股有限公司 | Method of topology-selective film formation of silicon oxide |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
KR20210047808A (en) | 2019-10-21 | 2021-04-30 | 에이에스엠 아이피 홀딩 비.브이. | Apparatus and methods for selectively etching films |
KR20210050453A (en) | 2019-10-25 | 2021-05-07 | 에이에스엠 아이피 홀딩 비.브이. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
KR20210054983A (en) | 2019-11-05 | 2021-05-14 | 에이에스엠 아이피 홀딩 비.브이. | Structures with doped semiconductor layers and methods and systems for forming same |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
KR20210062561A (en) | 2019-11-20 | 2021-05-31 | 에이에스엠 아이피 홀딩 비.브이. | Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure |
CN112951697A (en) | 2019-11-26 | 2021-06-11 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
US11450529B2 (en) | 2019-11-26 | 2022-09-20 | Asm Ip Holding B.V. | Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
CN112885693A (en) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
CN112885692A (en) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
JP2021090042A (en) | 2019-12-02 | 2021-06-10 | エーエスエム アイピー ホールディング ビー.ブイ. | Substrate processing apparatus and substrate processing method |
KR20210070898A (en) | 2019-12-04 | 2021-06-15 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
CN112992667A (en) | 2019-12-17 | 2021-06-18 | Asm Ip私人控股有限公司 | Method of forming vanadium nitride layer and structure including vanadium nitride layer |
US11527403B2 (en) | 2019-12-19 | 2022-12-13 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
TW202140135A (en) | 2020-01-06 | 2021-11-01 | 荷蘭商Asm Ip私人控股有限公司 | Gas supply assembly and valve plate assembly |
US11993847B2 (en) | 2020-01-08 | 2024-05-28 | Asm Ip Holding B.V. | Injector |
KR102675856B1 (en) | 2020-01-20 | 2024-06-17 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming thin film and method of modifying surface of thin film |
TW202130846A (en) | 2020-02-03 | 2021-08-16 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming structures including a vanadium or indium layer |
KR20210100010A (en) | 2020-02-04 | 2021-08-13 | 에이에스엠 아이피 홀딩 비.브이. | Method and apparatus for transmittance measurements of large articles |
US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
TW202146715A (en) | 2020-02-17 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | Method for growing phosphorous-doped silicon layer and system of the same |
TW202203344A (en) | 2020-02-28 | 2022-01-16 | 荷蘭商Asm Ip控股公司 | System dedicated for parts cleaning |
KR20210116240A (en) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | Substrate handling device with adjustable joints |
KR20210116249A (en) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | lockout tagout assembly and system and method of using same |
CN113394086A (en) | 2020-03-12 | 2021-09-14 | Asm Ip私人控股有限公司 | Method for producing a layer structure having a target topological profile |
KR20210124042A (en) | 2020-04-02 | 2021-10-14 | 에이에스엠 아이피 홀딩 비.브이. | Thin film forming method |
TW202146689A (en) | 2020-04-03 | 2021-12-16 | 荷蘭商Asm Ip控股公司 | Method for forming barrier layer and method for manufacturing semiconductor device |
TW202145344A (en) | 2020-04-08 | 2021-12-01 | 荷蘭商Asm Ip私人控股有限公司 | Apparatus and methods for selectively etching silcon oxide films |
US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
US11996289B2 (en) | 2020-04-16 | 2024-05-28 | Asm Ip Holding B.V. | Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods |
TW202146831A (en) | 2020-04-24 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | Vertical batch furnace assembly, and method for cooling vertical batch furnace |
KR20210132600A (en) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element |
TW202140831A (en) | 2020-04-24 | 2021-11-01 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming vanadium nitride–containing layer and structure comprising the same |
KR20210134226A (en) | 2020-04-29 | 2021-11-09 | 에이에스엠 아이피 홀딩 비.브이. | Solid source precursor vessel |
KR20210134869A (en) | 2020-05-01 | 2021-11-11 | 에이에스엠 아이피 홀딩 비.브이. | Fast FOUP swapping with a FOUP handler |
KR20210141379A (en) | 2020-05-13 | 2021-11-23 | 에이에스엠 아이피 홀딩 비.브이. | Laser alignment fixture for a reactor system |
TW202147383A (en) | 2020-05-19 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing apparatus |
KR20210145078A (en) | 2020-05-21 | 2021-12-01 | 에이에스엠 아이피 홀딩 비.브이. | Structures including multiple carbon layers and methods of forming and using same |
TW202200837A (en) | 2020-05-22 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | Reaction system for forming thin film on substrate |
TW202201602A (en) | 2020-05-29 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing device |
TW202218133A (en) | 2020-06-24 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | Method for forming a layer provided with silicon |
TW202217953A (en) | 2020-06-30 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing method |
KR20220006455A (en) | 2020-07-08 | 2022-01-17 | 에이에스엠 아이피 홀딩 비.브이. | Method for processing a substrate |
TW202219628A (en) | 2020-07-17 | 2022-05-16 | 荷蘭商Asm Ip私人控股有限公司 | Structures and methods for use in photolithography |
TW202204662A (en) | 2020-07-20 | 2022-02-01 | 荷蘭商Asm Ip私人控股有限公司 | Method and system for depositing molybdenum layers |
KR20220027026A (en) | 2020-08-26 | 2022-03-07 | 에이에스엠 아이피 홀딩 비.브이. | Method and system for forming metal silicon oxide and metal silicon oxynitride |
USD990534S1 (en) | 2020-09-11 | 2023-06-27 | Asm Ip Holding B.V. | Weighted lift pin |
USD1012873S1 (en) | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
US12009224B2 (en) | 2020-09-29 | 2024-06-11 | Asm Ip Holding B.V. | Apparatus and method for etching metal nitrides |
TW202229613A (en) | 2020-10-14 | 2022-08-01 | 荷蘭商Asm Ip私人控股有限公司 | Method of depositing material on stepped structure |
TW202217037A (en) | 2020-10-22 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | Method of depositing vanadium metal, structure, device and a deposition assembly |
TW202223136A (en) | 2020-10-28 | 2022-06-16 | 荷蘭商Asm Ip私人控股有限公司 | Method for forming layer on substrate, and semiconductor processing system |
TW202235649A (en) | 2020-11-24 | 2022-09-16 | 荷蘭商Asm Ip私人控股有限公司 | Methods for filling a gap and related systems and devices |
KR20220076343A (en) | 2020-11-30 | 2022-06-08 | 에이에스엠 아이피 홀딩 비.브이. | an injector configured for arrangement within a reaction chamber of a substrate processing apparatus |
CN114639631A (en) | 2020-12-16 | 2022-06-17 | Asm Ip私人控股有限公司 | Fixing device for measuring jumping and swinging |
TW202231903A (en) | 2020-12-22 | 2022-08-16 | 荷蘭商Asm Ip私人控股有限公司 | Transition metal deposition method, transition metal layer, and deposition assembly for depositing transition metal on substrate |
USD981973S1 (en) | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
USD980813S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD980814S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60193016A (en) * | 1984-03-14 | 1985-10-01 | Toyota Motor Corp | Robot device |
US4598380A (en) * | 1984-08-13 | 1986-07-01 | Cincinnati Milacron Inc. | Method and apparatus for controlling manipulator and workpiece positioner |
DE3774090D1 (en) * | 1986-11-17 | 1991-11-28 | Siemens Ag | METHOD FOR CONTROLLING THE THREE-DIMENSIONAL RELATIVE MOVEMENT OF A ROBOT AGAINST A WORKPIECE ATTACHED TO A WORKPIECE CARRIER. |
JP2652789B2 (en) * | 1987-12-05 | 1997-09-10 | ファナック 株式会社 | Arc tracking control method |
-
1989
- 1989-09-12 FI FI894306A patent/FI83176C/en not_active IP Right Cessation
-
1990
- 1990-08-09 WO PCT/FI1990/000192 patent/WO1991004522A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO1991004522A1 (en) | 1991-04-04 |
FI83176C (en) | 1991-06-10 |
FI894306A0 (en) | 1989-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FI83176B (en) | FOERFARANDE FOER STYRNING AV ROERELSER HOS EN ROBOT OCH EN STYCKEMANIPULATOR UNDER EN ROBOTCELLS INLAERNINGSSKEDE. | |
US4945493A (en) | Method and system for correcting a robot path | |
US5020001A (en) | Robot controller | |
US4836742A (en) | System for controlling a robot in association with a rotary table | |
JPS59218513A (en) | Arc control method of industrial robot | |
KR950000814B1 (en) | Position teaching method and control apparatus for robot | |
Bolmsjö et al. | Robotic arc welding–trends and developments for higher autonomy | |
JPH08505091A (en) | System and method for tracking features on an object using redundant axes | |
JP2728399B2 (en) | Robot control method | |
Khosla et al. | An algorithm for seam tracking applications | |
JP3070329B2 (en) | Industrial robot system | |
FI83175C (en) | Procedure for path control of a robotic cell | |
JPH0712597B2 (en) | Interlocking control system for industrial robot and positioner | |
JPS62251901A (en) | Course controller for multiaxis robot | |
JP2000194409A (en) | Program converting device for robot | |
JPH0310781A (en) | Articulated type robot | |
JP2914719B2 (en) | Industrial robot | |
JP3644551B2 (en) | Robot control method | |
JPH06259126A (en) | Robot operation simulating device | |
JP2804474B2 (en) | Teaching method for industrial robots | |
JP2723570B2 (en) | Three-dimensional laser nozzle control method | |
JPS61177509A (en) | Control system for position and attitude of robot arm | |
JPH0643917A (en) | Robot group control method | |
JPH05261546A (en) | Control method for welding robot | |
JPH04308903A (en) | Interpolation control method for industrial robot |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM | Patent lapsed | ||
MM | Patent lapsed |
Owner name: AITEC OY |