FI40237B - - Google Patents
Info
- Publication number
- FI40237B FI40237B FI1175/66A FI117566A FI40237B FI 40237 B FI40237 B FI 40237B FI 1175/66 A FI1175/66 A FI 1175/66A FI 117566 A FI117566 A FI 117566A FI 40237 B FI40237 B FI 40237B
- Authority
- FI
- Finland
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0026—Pyrometallurgy
- C22B15/006—Pyrometallurgy working up of molten copper, e.g. refining
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Manufacture And Refinement Of Metals (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI1175/66A FI40237B (xx) | 1966-05-04 | 1966-05-04 | |
| DE19671558625 DE1558625C (de) | 1966-05-04 | 1967-04-29 | Verfahren zur Herabsetzung der Er weichungstemperatur von sauerstoff freiem, schwefelhaltigem Leitkupfer und Verbesserung seiner elektrischen Leit fähigkeit |
| US634911A US3525605A (en) | 1966-05-04 | 1967-05-01 | Method for decreasing the softening temperature and improving the electrical conductivity of high conductivity oxygen-free copper |
| SE06309/67A SE337483B (xx) | 1966-05-04 | 1967-05-03 | |
| BE697951D BE697951A (xx) | 1966-05-04 | 1967-05-03 | |
| YU0886/67A YU31437B (en) | 1966-05-04 | 1967-05-03 | Postupak za snizavanje temperature omeksavanja provodnickog bakra oslobodenog od kiseonika i poboljsanje njegove elektricne provodljivosti |
| CH627267A CH503113A (de) | 1966-05-04 | 1967-05-03 | Verfahren zum Erniedrigen der Erweichungstemperatur und Verbessern der elektrischen Leitfähigkeit von sauerstofffreiem Kupfer |
| FR105062A FR1536237A (fr) | 1966-05-04 | 1967-05-03 | Procédé pour abaisser la température de recuit et améliorer la conductivité du cuivre exempt d'oxygène |
| GB20616/67A GB1137809A (en) | 1966-05-04 | 1967-05-03 | Improvements relating to oxygen-free copper |
| JP42028585A JPS494127B1 (xx) | 1966-05-04 | 1967-05-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI1175/66A FI40237B (xx) | 1966-05-04 | 1966-05-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FI40237B true FI40237B (xx) | 1968-07-31 |
Family
ID=8505221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI1175/66A FI40237B (xx) | 1966-05-04 | 1966-05-04 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3525605A (xx) |
| JP (1) | JPS494127B1 (xx) |
| BE (1) | BE697951A (xx) |
| CH (1) | CH503113A (xx) |
| FI (1) | FI40237B (xx) |
| GB (1) | GB1137809A (xx) |
| SE (1) | SE337483B (xx) |
| YU (1) | YU31437B (xx) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3976477A (en) * | 1974-12-23 | 1976-08-24 | Olin Corporation | High conductivity high temperature copper alloy |
| US4202688A (en) * | 1975-02-05 | 1980-05-13 | Olin Corporation | High conductivity high temperature copper alloy |
| GB2175009B (en) * | 1985-03-27 | 1990-02-07 | Mitsubishi Metal Corp | Wire for bonding a semiconductor device and process for producing the same |
| FI113061B (fi) * | 2001-03-09 | 2004-02-27 | Outokumpu Oy | Kupariseos |
| CN103146943B (zh) * | 2013-01-14 | 2017-03-22 | 中南大学 | 一种紫杂铜精炼剂及其制备方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE464343A (xx) * | 1945-07-11 | |||
| US2879159A (en) * | 1955-04-26 | 1959-03-24 | American Metallurg Products Co | Copper and copper base alloys and methods of making the same |
-
1966
- 1966-05-04 FI FI1175/66A patent/FI40237B/fi active
-
1967
- 1967-05-01 US US634911A patent/US3525605A/en not_active Expired - Lifetime
- 1967-05-03 CH CH627267A patent/CH503113A/de not_active IP Right Cessation
- 1967-05-03 SE SE06309/67A patent/SE337483B/xx unknown
- 1967-05-03 BE BE697951D patent/BE697951A/xx unknown
- 1967-05-03 GB GB20616/67A patent/GB1137809A/en not_active Expired
- 1967-05-03 YU YU0886/67A patent/YU31437B/xx unknown
- 1967-05-04 JP JP42028585A patent/JPS494127B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| BE697951A (xx) | 1967-10-16 |
| GB1137809A (en) | 1968-12-27 |
| DE1558625A1 (de) | 1972-03-30 |
| US3525605A (en) | 1970-08-25 |
| JPS494127B1 (xx) | 1974-01-30 |
| SE337483B (xx) | 1971-08-09 |
| YU31437B (en) | 1973-06-30 |
| DE1558625B2 (de) | 1972-09-28 |
| CH503113A (de) | 1971-02-15 |