FI20165688A - Flerskiktig film med en ledande ytbeläggning och förfarande för tillverkning av densamma - Google Patents

Flerskiktig film med en ledande ytbeläggning och förfarande för tillverkning av densamma

Info

Publication number
FI20165688A
FI20165688A FI20165688A FI20165688A FI20165688A FI 20165688 A FI20165688 A FI 20165688A FI 20165688 A FI20165688 A FI 20165688A FI 20165688 A FI20165688 A FI 20165688A FI 20165688 A FI20165688 A FI 20165688A
Authority
FI
Finland
Prior art keywords
layer
film
conductive
conductive coating
manufacture
Prior art date
Application number
FI20165688A
Other languages
English (en)
Finnish (fi)
Other versions
FI127417B (sv
Inventor
Harri Repo
Original Assignee
Nordic Flex S L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordic Flex S L filed Critical Nordic Flex S L
Priority to FI20165688A priority Critical patent/FI127417B/sv
Priority to PCT/EP2017/073292 priority patent/WO2018050827A2/en
Priority to EP17768119.4A priority patent/EP3513412A2/en
Publication of FI20165688A publication Critical patent/FI20165688A/sv
Application granted granted Critical
Publication of FI127417B publication Critical patent/FI127417B/sv

Links

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    • H01B1/24Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546Flexural strength; Flexion stiffness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/75Printability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10037Printed or non-printed battery
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Textile Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laminated Bodies (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
FI20165688A 2016-09-16 2016-09-16 Flerskiktig film med en ledande ytbeläggning och förfarande för tillverkning av densamma FI127417B (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20165688A FI127417B (sv) 2016-09-16 2016-09-16 Flerskiktig film med en ledande ytbeläggning och förfarande för tillverkning av densamma
PCT/EP2017/073292 WO2018050827A2 (en) 2016-09-16 2017-09-15 A method for manufacturing a multi-layer film, a multi layer film, a sensor device, a sensor sheet, a sports gear, and a method for detecting movments of a target
EP17768119.4A EP3513412A2 (en) 2016-09-16 2017-09-15 A method for manufacturing a multi-layer film, a multi layer film, a sensor device, a sensor sheet, a sports gear, and a method for detecting movments of a target

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FI20165688A FI127417B (sv) 2016-09-16 2016-09-16 Flerskiktig film med en ledande ytbeläggning och förfarande för tillverkning av densamma

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DE102018117805A1 (de) * 2018-07-24 2020-01-30 Rehau Ag + Co Verfahren zur Herstellung eines mindestens eine elektronische Komponente aufweisenden Extrusionsprofils
CN108968213B (zh) * 2018-08-21 2024-02-02 黑天鹅智能科技(福建)有限公司 智能鞋的传感器配件、加工模具组和加工方法
CN112969575B (zh) 2018-11-19 2023-06-09 布莱特利特结构公司 高强度低热释放复合材料
JP7185779B2 (ja) * 2018-11-19 2022-12-07 ブライト ライト ストラクチャーズ エルエルシー sp2炭素含有材料を内部に有する樹脂層を含む熱放出性の低い高強度の部材
CN110408342B (zh) * 2019-06-10 2020-12-08 江西蓝海芯科技集团有限公司 一种碳纳米球填充的双固化导电胶带的制备方法及其在电磁屏蔽胶带中的应用
US11573102B2 (en) 2020-11-17 2023-02-07 Ford Global Technologies, Llc Method of manufacturing multi-layer electrode for a capacitive pressure sensor and multi-layer electrodes formed therefrom
CN115008591A (zh) * 2022-02-11 2022-09-06 江苏江能新材料科技有限公司 一种高冰镍回转窑用耐火浇注料的生产设备及其生产工艺
CN114679030B (zh) * 2022-04-20 2023-09-29 电子科技大学 一种基于磁弹效应的柔性微型发电机及其制备方法
EP4400645A1 (en) * 2023-01-16 2024-07-17 ETH Zurich Method for providing a conductive polymer material on fabric

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US7408263B2 (en) * 2005-05-03 2008-08-05 E.I. Du Pont De Nemours And Company Anisotropic conductive coatings and electronic devices
US20110088931A1 (en) * 2009-04-06 2011-04-21 Vorbeck Materials Corp. Multilayer Coatings and Coated Articles
US8604332B2 (en) * 2010-03-04 2013-12-10 Guardian Industries Corp. Electronic devices including transparent conductive coatings including carbon nanotubes and nanowire composites, and methods of making the same
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EP3172268A1 (de) * 2014-07-25 2017-05-31 Basf Se Beschichtungsformulierung

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CN115008779A (zh) * 2022-06-01 2022-09-06 深圳市久信达科技有限公司 一种生物降解收缩膜专用生产装置
CN115008779B (zh) * 2022-06-01 2023-11-10 深圳市久信达科技有限公司 一种生物降解收缩膜专用生产装置

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FI127417B (sv) 2018-05-31
WO2018050827A2 (en) 2018-03-22
EP3513412A2 (en) 2019-07-24

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