FI20165688A - Monikerroksinen johtavalla pinnoitteella varustettu kalvo ja menetelmä sen valmistamiseksi - Google Patents

Monikerroksinen johtavalla pinnoitteella varustettu kalvo ja menetelmä sen valmistamiseksi

Info

Publication number
FI20165688A
FI20165688A FI20165688A FI20165688A FI20165688A FI 20165688 A FI20165688 A FI 20165688A FI 20165688 A FI20165688 A FI 20165688A FI 20165688 A FI20165688 A FI 20165688A FI 20165688 A FI20165688 A FI 20165688A
Authority
FI
Finland
Prior art keywords
layer
film
conductive
conductive coating
manufacture
Prior art date
Application number
FI20165688A
Other languages
English (en)
Swedish (sv)
Other versions
FI127417B (fi
Inventor
Harri Repo
Original Assignee
Nordic Flex S L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordic Flex S L filed Critical Nordic Flex S L
Priority to FI20165688A priority Critical patent/FI127417B/fi
Priority to PCT/EP2017/073292 priority patent/WO2018050827A2/en
Priority to EP17768119.4A priority patent/EP3513412A2/en
Publication of FI20165688A publication Critical patent/FI20165688A/fi
Application granted granted Critical
Publication of FI127417B publication Critical patent/FI127417B/fi

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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/75—Printability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Textile Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
FI20165688A 2016-09-16 2016-09-16 Monikerroksinen johtavalla pinnoitteella varustettu kalvo ja menetelmä sen valmistamiseksi FI127417B (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20165688A FI127417B (fi) 2016-09-16 2016-09-16 Monikerroksinen johtavalla pinnoitteella varustettu kalvo ja menetelmä sen valmistamiseksi
PCT/EP2017/073292 WO2018050827A2 (en) 2016-09-16 2017-09-15 A method for manufacturing a multi-layer film, a multi layer film, a sensor device, a sensor sheet, a sports gear, and a method for detecting movments of a target
EP17768119.4A EP3513412A2 (en) 2016-09-16 2017-09-15 A method for manufacturing a multi-layer film, a multi layer film, a sensor device, a sensor sheet, a sports gear, and a method for detecting movments of a target

Applications Claiming Priority (1)

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FI20165688A FI127417B (fi) 2016-09-16 2016-09-16 Monikerroksinen johtavalla pinnoitteella varustettu kalvo ja menetelmä sen valmistamiseksi

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DE102018117805A1 (de) * 2018-07-24 2020-01-30 Rehau Ag + Co Verfahren zur Herstellung eines mindestens eine elektronische Komponente aufweisenden Extrusionsprofils
CN108968213B (zh) * 2018-08-21 2024-02-02 黑天鹅智能科技（福建）有限公司 智能鞋的传感器配件、加工模具组和加工方法
CN112955314B (zh) * 2018-11-19 2023-08-15 布莱特利特结构公司 包括具有sp2碳材料的树脂层的高强度低热释放部件
CN110408342B (zh) * 2019-06-10 2020-12-08 江西蓝海芯科技集团有限公司 一种碳纳米球填充的双固化导电胶带的制备方法及其在电磁屏蔽胶带中的应用
US11573102B2 (en) 2020-11-17 2023-02-07 Ford Global Technologies, Llc Method of manufacturing multi-layer electrode for a capacitive pressure sensor and multi-layer electrodes formed therefrom
CN115008591A (zh) * 2022-02-11 2022-09-06 江苏江能新材料科技有限公司 一种高冰镍回转窑用耐火浇注料的生产设备及其生产工艺
CN114679030B (zh) * 2022-04-20 2023-09-29 电子科技大学 一种基于磁弹效应的柔性微型发电机及其制备方法

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US4231901A (en) * 1978-06-23 1980-11-04 Charleswater Products, Inc. Electrically conductive foam and method of preparation and use
US7408263B2 (en) * 2005-05-03 2008-08-05 E.I. Du Pont De Nemours And Company Anisotropic conductive coatings and electronic devices
US20110088931A1 (en) * 2009-04-06 2011-04-21 Vorbeck Materials Corp. Multilayer Coatings and Coated Articles
US8604332B2 (en) * 2010-03-04 2013-12-10 Guardian Industries Corp. Electronic devices including transparent conductive coatings including carbon nanotubes and nanowire composites, and methods of making the same
EP2562766A1 (de) * 2011-08-22 2013-02-27 Bayer MaterialScience AG Kohlenstoffnanoröhren und Graphenplättchen umfassende Dispersionen
WO2016012315A1 (de) * 2014-07-25 2016-01-28 Basf Se Beschichtungsformulierung

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Publication number Priority date Publication date Assignee Title
CN115008779A (zh) * 2022-06-01 2022-09-06 深圳市久信达科技有限公司 一种生物降解收缩膜专用生产装置
CN115008779B (zh) * 2022-06-01 2023-11-10 深圳市久信达科技有限公司 一种生物降解收缩膜专用生产装置

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WO2018050827A2 (en) 2018-03-22
EP3513412A2 (en) 2019-07-24
FI127417B (fi) 2018-05-31
WO2018050827A3 (en) 2018-04-26

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