FI20155352A7 - Monitasoinen mikromekaaninen rakenne ja sen valmistusmenetelmä - Google Patents

Monitasoinen mikromekaaninen rakenne ja sen valmistusmenetelmä

Info

Publication number
FI20155352A7
FI20155352A7 FI20155352A FI20155352A FI20155352A7 FI 20155352 A7 FI20155352 A7 FI 20155352A7 FI 20155352 A FI20155352 A FI 20155352A FI 20155352 A FI20155352 A FI 20155352A FI 20155352 A7 FI20155352 A7 FI 20155352A7
Authority
FI
Finland
Prior art keywords
fabrication method
micromechanical structure
level
level micromechanical
fabrication
Prior art date
Application number
FI20155352A
Other languages
English (en)
Swedish (sv)
Other versions
FI126508B (fi
Inventor
Altti Torkkeli
Antti Iihola
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FI20155352A priority Critical patent/FI126508B/fi
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Priority to US15/147,197 priority patent/US9764942B2/en
Priority to TW105113943A priority patent/TWI636949B/zh
Priority to TW105113941A priority patent/TWI637900B/zh
Priority to US15/147,233 priority patent/US9969615B2/en
Priority to PCT/IB2016/052630 priority patent/WO2016185313A1/en
Priority to EP16725234.5A priority patent/EP3294664B1/en
Priority to EP16725587.6A priority patent/EP3294665B1/en
Priority to JP2018511536A priority patent/JP6558495B2/ja
Priority to PCT/IB2016/052629 priority patent/WO2016185312A1/en
Priority to CN201680027941.1A priority patent/CN107667067B/zh
Publication of FI20155352A7 publication Critical patent/FI20155352A7/fi
Application granted granted Critical
Publication of FI126508B publication Critical patent/FI126508B/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00595—Control etch selectivity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/005—Bulk micromachining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00603—Aligning features and geometries on both sides of a substrate, e.g. when double side etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733—Structural details or topology
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5769—Manufacturing; Mounting; Housings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/033—Comb drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0136—Comb structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Micromachines (AREA)
FI20155352A 2015-05-15 2015-05-15 Monitasoisen mikromekaanisen rakenteen valmistusmenetelmä FI126508B (fi)

Priority Applications (11)

Application Number Priority Date Filing Date Title
FI20155352A FI126508B (fi) 2015-05-15 2015-05-15 Monitasoisen mikromekaanisen rakenteen valmistusmenetelmä
TW105113943A TWI636949B (zh) 2015-05-15 2016-05-05 多層微機械結構
TW105113941A TWI637900B (zh) 2015-05-15 2016-05-05 多層微機械結構的製造方法
US15/147,233 US9969615B2 (en) 2015-05-15 2016-05-05 Manufacturing method of a multi-level micromechanical structure on a single layer of homogenous material
US15/147,197 US9764942B2 (en) 2015-05-15 2016-05-05 Multi-level micromechanical structure
PCT/IB2016/052630 WO2016185313A1 (en) 2015-05-15 2016-05-09 A multi-level micromechanical structure
EP16725234.5A EP3294664B1 (en) 2015-05-15 2016-05-09 A multi-level micromechanical structure
EP16725587.6A EP3294665B1 (en) 2015-05-15 2016-05-09 A manufacturing method of a multi-level micromechanical structure
JP2018511536A JP6558495B2 (ja) 2015-05-15 2016-05-09 マルチレベルマイクロメカニカル構造
PCT/IB2016/052629 WO2016185312A1 (en) 2015-05-15 2016-05-09 A manufacturing method of a multi-level micromechanical structure
CN201680027941.1A CN107667067B (zh) 2015-05-15 2016-05-09 多级微机械结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20155352A FI126508B (fi) 2015-05-15 2015-05-15 Monitasoisen mikromekaanisen rakenteen valmistusmenetelmä

Publications (2)

Publication Number Publication Date
FI20155352A7 true FI20155352A7 (fi) 2016-11-16
FI126508B FI126508B (fi) 2017-01-13

Family

ID=56084190

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20155352A FI126508B (fi) 2015-05-15 2015-05-15 Monitasoisen mikromekaanisen rakenteen valmistusmenetelmä

Country Status (5)

Country Link
US (1) US9969615B2 (fi)
EP (1) EP3294665B1 (fi)
FI (1) FI126508B (fi)
TW (1) TWI637900B (fi)
WO (1) WO2016185312A1 (fi)

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EP3298414A1 (en) 2015-05-20 2018-03-28 Lumedyne Technologies Incorporated Extracting inertial information from nonlinear periodic signals
WO2017004443A2 (en) * 2015-06-30 2017-01-05 Lumedyne Technologies Incorporated Z-axis physical proximity switch
WO2017075413A1 (en) * 2015-10-28 2017-05-04 Georgia Tech Research Corporation Comb-driven substrate decoupled annulus pitch/roll baw gyroscope with slanted quadrature tuning electrode
US10234477B2 (en) 2016-07-27 2019-03-19 Google Llc Composite vibratory in-plane accelerometer
US10807863B2 (en) 2017-05-30 2020-10-20 Murata Manufacturing Co., Ltd. Method for manufacturing micromechanical structures in a device wafer
DE102018210482B4 (de) * 2018-06-27 2022-07-07 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
EP3656733A1 (en) 2018-11-23 2020-05-27 Murata Manufacturing Co., Ltd. Method for etching recessed structures
JP2020122740A (ja) * 2019-01-31 2020-08-13 セイコーエプソン株式会社 構造体形成方法およびデバイス
DE102019210026A1 (de) * 2019-07-08 2021-01-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. MEMS-Aktuator und MEMS-Aktuator-Array mit einer Mehrzahl von MEMS-Aktuatoren
US11892619B2 (en) * 2019-09-04 2024-02-06 Lumentum Operations Llc MEMS device with a three-layer comb actuator structure and a two-layer hinge
CN112093773A (zh) * 2020-09-16 2020-12-18 上海矽睿科技有限公司 一种微机械设备的制备方法
CN113086940B (zh) * 2021-03-25 2024-01-26 武汉敏声新技术有限公司 纳米光机械陀螺仪及其制备方法
EP4079679B1 (en) 2021-04-22 2025-08-27 Murata Manufacturing Co., Ltd. Method for etching gaps of unequal width
JP2023121379A (ja) 2022-02-21 2023-08-31 セイコーエプソン株式会社 物理量センサー、慣性計測装置及び製造方法

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Also Published As

Publication number Publication date
FI126508B (fi) 2017-01-13
TWI637900B (zh) 2018-10-11
WO2016185312A1 (en) 2016-11-24
US20160332872A1 (en) 2016-11-17
EP3294665B1 (en) 2023-10-18
US9969615B2 (en) 2018-05-15
EP3294665A1 (en) 2018-03-21
TW201700393A (zh) 2017-01-01

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