FI20115869A0 - Planar sensor och dess tillverkningsförfarande - Google Patents

Planar sensor och dess tillverkningsförfarande

Info

Publication number
FI20115869A0
FI20115869A0 FI20115869A FI20115869A FI20115869A0 FI 20115869 A0 FI20115869 A0 FI 20115869A0 FI 20115869 A FI20115869 A FI 20115869A FI 20115869 A FI20115869 A FI 20115869A FI 20115869 A0 FI20115869 A0 FI 20115869A0
Authority
FI
Finland
Prior art keywords
sensor
flooring layer
elastic flooring
planar
electrically conductive
Prior art date
Application number
FI20115869A
Other languages
English (en)
Finnish (fi)
Original Assignee
Marimils Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44718779&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FI20115869(A0) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Marimils Oy filed Critical Marimils Oy
Priority to FI20115869A priority Critical patent/FI20115869A0/sv
Publication of FI20115869A0 publication Critical patent/FI20115869A0/sv
Priority to CA2844578A priority patent/CA2844578A1/en
Priority to ES12830705T priority patent/ES2702559T3/es
Priority to US14/239,453 priority patent/US9506884B2/en
Priority to JP2014529036A priority patent/JP2014531579A/ja
Priority to AU2012306230A priority patent/AU2012306230B2/en
Priority to RU2014113095/08A priority patent/RU2014113095A/ru
Priority to DK12830705.5T priority patent/DK2766885T3/en
Priority to TR2018/18937T priority patent/TR201818937T4/tr
Priority to CN201280043245.1A priority patent/CN103843041B/zh
Priority to PCT/FI2012/050854 priority patent/WO2013034802A1/en
Priority to KR1020147008705A priority patent/KR20140057378A/ko
Priority to EP12830705.5A priority patent/EP2766885B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G01D5/2405—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by varying dielectric
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • H03K17/9622—Capacitive touch switches using a plurality of detectors, e.g. keyboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2471/00—Floor coverings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/12—Measuring electrostatic fields or voltage-potential
    • G01R29/14—Measuring field distribution
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V3/00—Electric or magnetic prospecting or detecting; Measuring magnetic field characteristics of the earth, e.g. declination, deviation
    • G01V3/02—Electric or magnetic prospecting or detecting; Measuring magnetic field characteristics of the earth, e.g. declination, deviation operating with propagation of electric current
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/02—Mechanical actuation
    • G08B13/10—Mechanical actuation by pressure on floors, floor coverings, stair treads, counters, or tills
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/96015—Constructional details for touch switches
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Push-Button Switches (AREA)
  • Manufacture Of Switches (AREA)
  • Burglar Alarm Systems (AREA)
FI20115869A 2011-09-05 2011-09-05 Planar sensor och dess tillverkningsförfarande FI20115869A0 (sv)

Priority Applications (13)

Application Number Priority Date Filing Date Title
FI20115869A FI20115869A0 (sv) 2011-09-05 2011-09-05 Planar sensor och dess tillverkningsförfarande
EP12830705.5A EP2766885B1 (en) 2011-09-05 2012-09-04 Planar sensor and its manufacturing method
KR1020147008705A KR20140057378A (ko) 2011-09-05 2012-09-04 평면센서 및 그의 제조방법
AU2012306230A AU2012306230B2 (en) 2011-09-05 2012-09-04 Planar sensor and its manufacturing method
ES12830705T ES2702559T3 (es) 2011-09-05 2012-09-04 Sensor plano y su método de fabricación
US14/239,453 US9506884B2 (en) 2011-09-05 2012-09-04 Planar sensor and its manufacturing method
JP2014529036A JP2014531579A (ja) 2011-09-05 2012-09-04 平面センサー及びその製造方法
CA2844578A CA2844578A1 (en) 2011-09-05 2012-09-04 Planar sensor and its manufacturing method
RU2014113095/08A RU2014113095A (ru) 2011-09-05 2012-09-04 Плоскостной датчик и способ его изготовления
DK12830705.5T DK2766885T3 (en) 2011-09-05 2012-09-04 PLANAR SENSOR AND ITS PREPARATION PROCEDURE
TR2018/18937T TR201818937T4 (tr) 2011-09-05 2012-09-04 Düzlemsel Algılayıcı Ve Bunun Üretim Yöntemi
CN201280043245.1A CN103843041B (zh) 2011-09-05 2012-09-04 平面传感器及其制造方法
PCT/FI2012/050854 WO2013034802A1 (en) 2011-09-05 2012-09-04 Planar sensor and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20115869A FI20115869A0 (sv) 2011-09-05 2011-09-05 Planar sensor och dess tillverkningsförfarande

Publications (1)

Publication Number Publication Date
FI20115869A0 true FI20115869A0 (sv) 2011-09-05

Family

ID=44718779

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20115869A FI20115869A0 (sv) 2011-09-05 2011-09-05 Planar sensor och dess tillverkningsförfarande

Country Status (13)

Country Link
US (1) US9506884B2 (sv)
EP (1) EP2766885B1 (sv)
JP (1) JP2014531579A (sv)
KR (1) KR20140057378A (sv)
CN (1) CN103843041B (sv)
AU (1) AU2012306230B2 (sv)
CA (1) CA2844578A1 (sv)
DK (1) DK2766885T3 (sv)
ES (1) ES2702559T3 (sv)
FI (1) FI20115869A0 (sv)
RU (1) RU2014113095A (sv)
TR (1) TR201818937T4 (sv)
WO (1) WO2013034802A1 (sv)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2996673B1 (fr) * 2012-10-05 2016-02-05 Bostik Sa Capteur capacitif pour la detection de presence d'un objet et/ou d'un individu.
DE202014101407U1 (de) * 2014-03-26 2015-06-29 Rehau Ag + Co Profil und elektrische Stromkreisanordnung mit wenigstens einem derartigen Profil
WO2016080917A1 (en) * 2014-11-19 2016-05-26 Singapore Health Services Pte Ltd A sensing device, system and a method of manufacture thereof
KR20170093158A (ko) * 2014-11-24 2017-08-14 타케트 지디엘 에스에이 바닥재에 압력 센서를 갖는 모니터링 시스템
DE102018103790B4 (de) * 2018-02-20 2022-03-31 Ardex Gmbh Sensormatte für eine Flächensensorik, Flächensensorik sowie Verfahren zur Herstellung einer Sensormatte
CN108508284A (zh) * 2018-03-26 2018-09-07 中国科学院电子学研究所 一种基于扭转振动的互屏蔽式电场传感器
DE102023101758A1 (de) 2023-01-25 2024-07-25 Ennovi Advanced Engineering Solutions Germany GmbH Elektrische Verbindungsstruktur

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US4429301A (en) * 1981-10-26 1984-01-31 Amp Incorporated Means for decoding a switch array
US6515586B1 (en) * 1998-12-18 2003-02-04 Intel Corporation Tactile tracking systems and methods
WO2000075417A1 (en) * 1999-06-04 2000-12-14 Interface, Inc. Floor covering with sensor
JP2002140771A (ja) * 2000-07-13 2002-05-17 Omron Corp セキュリティシステムおよびこのセキュリティシステムに用いるセンサ装置
JP2004251464A (ja) 2001-09-20 2004-09-09 Nippon Oil Corp 低温熱傷防止床暖房システム及び床暖房用床材
US20050092519A1 (en) * 2003-11-05 2005-05-05 Beauchamp John K. Partially flexible circuit board
CN1642389A (zh) * 2004-01-16 2005-07-20 义仓精机股份有限公司 将软性电路板暂时固定于工作平台上的方法
DE102004031672A1 (de) * 2004-06-30 2006-01-19 Infineon Technologies Ag Planar-Sensor-Anordnung, Sensor-Array und Verfahren zum Herstellen einer Planar-Sensor-Anordnung
US8044665B2 (en) 2004-07-06 2011-10-25 Marimils Oy Sensor product for electric field sensing
US7382267B2 (en) * 2005-01-31 2008-06-03 Artis Llc Systems and methods for area activity monitoring and personnel identification
DE102005015050A1 (de) 2005-03-31 2006-10-12 Ewald Dörken Ag Flächenheizeinrichtung
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FI124544B (sv) * 2008-04-21 2014-10-15 Elsi Technologies Oy Plan givarkonstruktion
FI121197B (sv) 2008-05-16 2010-08-13 Marimils Oy Sensor för detektering av föremãl med elektrisk ledningsförmãga
JP5181876B2 (ja) * 2008-06-30 2013-04-10 住友電気工業株式会社 フラットケーブルの製造方法
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JP5581717B2 (ja) * 2010-02-09 2014-09-03 住友ベークライト株式会社 積層フィルム

Also Published As

Publication number Publication date
EP2766885A4 (en) 2015-04-08
EP2766885B1 (en) 2018-10-10
US9506884B2 (en) 2016-11-29
TR201818937T4 (tr) 2019-01-21
ES2702559T3 (es) 2019-03-01
EP2766885A1 (en) 2014-08-20
JP2014531579A (ja) 2014-11-27
CA2844578A1 (en) 2013-03-14
CN103843041A (zh) 2014-06-04
WO2013034802A1 (en) 2013-03-14
AU2012306230A1 (en) 2014-03-13
RU2014113095A (ru) 2015-10-20
DK2766885T3 (en) 2019-01-14
KR20140057378A (ko) 2014-05-12
CN103843041B (zh) 2016-08-31
AU2012306230B2 (en) 2016-01-07
US20150077142A1 (en) 2015-03-19

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