FI20095124A - Reaktiokammio - Google Patents
Reaktiokammio Download PDFInfo
- Publication number
- FI20095124A FI20095124A FI20095124A FI20095124A FI20095124A FI 20095124 A FI20095124 A FI 20095124A FI 20095124 A FI20095124 A FI 20095124A FI 20095124 A FI20095124 A FI 20095124A FI 20095124 A FI20095124 A FI 20095124A
- Authority
- FI
- Finland
- Prior art keywords
- reactor chamber
- reactor
- chamber
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20095124A FI122940B (fi) | 2009-02-09 | 2009-02-09 | Reaktiokammio |
TW099103758A TW201040309A (en) | 2009-02-09 | 2010-02-08 | Reaction chamber |
PCT/FI2010/050077 WO2010089459A1 (en) | 2009-02-09 | 2010-02-08 | Reaction chamber |
US13/143,314 US20110265719A1 (en) | 2009-02-09 | 2010-02-08 | Reaction chamber |
CN2010800068061A CN102308022A (zh) | 2009-02-09 | 2010-02-08 | 反应室 |
EP10738248A EP2393960A4 (en) | 2009-02-09 | 2010-02-08 | REACTION CHAMBER |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20095124A FI122940B (fi) | 2009-02-09 | 2009-02-09 | Reaktiokammio |
FI20095124 | 2009-02-09 |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20095124A0 FI20095124A0 (fi) | 2009-02-09 |
FI20095124A true FI20095124A (fi) | 2010-08-10 |
FI122940B FI122940B (fi) | 2012-09-14 |
Family
ID=40404627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20095124A FI122940B (fi) | 2009-02-09 | 2009-02-09 | Reaktiokammio |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110265719A1 (fi) |
EP (1) | EP2393960A4 (fi) |
CN (1) | CN102308022A (fi) |
FI (1) | FI122940B (fi) |
TW (1) | TW201040309A (fi) |
WO (1) | WO2010089459A1 (fi) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI20115073A0 (fi) | 2011-01-26 | 2011-01-26 | Beneq Oy | Laitteisto, menetelmä ja reaktiokammio |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59928A (ja) * | 1982-06-25 | 1984-01-06 | Ushio Inc | 光加熱装置 |
US5194401A (en) * | 1989-04-18 | 1993-03-16 | Applied Materials, Inc. | Thermally processing semiconductor wafers at non-ambient pressures |
US5783492A (en) * | 1994-03-04 | 1998-07-21 | Tokyo Electron Limited | Plasma processing method, plasma processing apparatus, and plasma generating apparatus |
US5676757A (en) * | 1994-03-28 | 1997-10-14 | Tokyo Electron Limited | Decompression container |
DE4437050A1 (de) * | 1994-10-17 | 1996-04-18 | Leybold Ag | Vorrichtung zum Behandeln von Oberflächen von Hohlkörpern, insbesondere von Innenflächen von Kraftstofftanks |
US6159300A (en) * | 1996-12-17 | 2000-12-12 | Canon Kabushiki Kaisha | Apparatus for forming non-single-crystal semiconductor thin film, method for forming non-single-crystal semiconductor thin film, and method for producing photovoltaic device |
US6217972B1 (en) * | 1997-10-17 | 2001-04-17 | Tessera, Inc. | Enhancements in framed sheet processing |
TW364054B (en) * | 1998-12-31 | 1999-07-11 | United Microelectronics Corp | Measurement tool for distance between shower head and heater platform |
DE50002987D1 (de) * | 2000-02-01 | 2003-08-28 | Emil Baechli | Einrichtung zur Oberflächenbehandlung und/oder Beschichtung bzw. zur Fertigung von Bauelementen, insbesondere flacher Bauelemente aus Glas, Glaslegierungen oder Metall, im Durchlaufverfahren |
SK5872002A3 (en) * | 2000-02-18 | 2003-06-03 | Equipment Technologies Inc | Method and apparatus for chemical vapor deposition of polysilicon |
KR100458982B1 (ko) * | 2000-08-09 | 2004-12-03 | 주성엔지니어링(주) | 회전형 가스분사기를 가지는 반도체소자 제조장치 및 이를이용한 박막증착방법 |
AU2001277755A1 (en) * | 2000-08-11 | 2002-02-25 | Tokyo Electron Limited | Device and method for processing substrate |
US6541353B1 (en) * | 2000-08-31 | 2003-04-01 | Micron Technology, Inc. | Atomic layer doping apparatus and method |
TW533503B (en) * | 2000-09-14 | 2003-05-21 | Nec Electronics Corp | Processing apparatus having particle counter and cleaning device, cleaning method, cleanliness diagnosis method and semiconductor fabricating apparatus using the same |
US6800173B2 (en) * | 2000-12-15 | 2004-10-05 | Novellus Systems, Inc. | Variable gas conductance control for a process chamber |
US9708707B2 (en) * | 2001-09-10 | 2017-07-18 | Asm International N.V. | Nanolayer deposition using bias power treatment |
JP2004014543A (ja) * | 2002-06-03 | 2004-01-15 | Hitachi Kokusai Electric Inc | 半導体製造装置および半導体装置の製造方法 |
JP2004311640A (ja) * | 2003-04-04 | 2004-11-04 | Tokyo Electron Ltd | 処理容器 |
US7108753B2 (en) * | 2003-10-29 | 2006-09-19 | Asm America, Inc. | Staggered ribs on process chamber to reduce thermal effects |
US7169233B2 (en) * | 2003-11-21 | 2007-01-30 | Asm America, Inc. | Reactor chamber |
US20060032736A1 (en) * | 2004-02-02 | 2006-02-16 | Lam Research Corporation | Deformation reduction at the main chamber |
DE102004009772A1 (de) * | 2004-02-28 | 2005-09-15 | Aixtron Ag | CVD-Reaktor mit Prozesskammerhöhenstabilisierung |
US7641762B2 (en) * | 2005-09-02 | 2010-01-05 | Applied Materials, Inc. | Gas sealing skirt for suspended showerhead in process chamber |
JP4791110B2 (ja) * | 2005-09-02 | 2011-10-12 | 東京エレクトロン株式会社 | 真空チャンバおよび真空処理装置 |
FI121750B (fi) * | 2005-11-17 | 2011-03-31 | Beneq Oy | ALD-reaktori |
US7845891B2 (en) * | 2006-01-13 | 2010-12-07 | Applied Materials, Inc. | Decoupled chamber body |
US7891366B2 (en) * | 2006-06-16 | 2011-02-22 | Tokyo Electron Limited | Liquid processing apparatus |
JP2008169437A (ja) * | 2007-01-11 | 2008-07-24 | Mitsubishi Heavy Ind Ltd | 製膜装置 |
DE102007057644A1 (de) * | 2007-11-28 | 2009-06-04 | Oerlikon Trading Ag, Trübbach | Vakuumkammer auf Rahmenbasis für Beschichtungsanlagen |
WO2010011397A2 (en) * | 2008-05-13 | 2010-01-28 | Northwestern University | Scanning probe epitaxy |
-
2009
- 2009-02-09 FI FI20095124A patent/FI122940B/fi active IP Right Grant
-
2010
- 2010-02-08 US US13/143,314 patent/US20110265719A1/en not_active Abandoned
- 2010-02-08 TW TW099103758A patent/TW201040309A/zh unknown
- 2010-02-08 CN CN2010800068061A patent/CN102308022A/zh active Pending
- 2010-02-08 EP EP10738248A patent/EP2393960A4/en not_active Withdrawn
- 2010-02-08 WO PCT/FI2010/050077 patent/WO2010089459A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FI122940B (fi) | 2012-09-14 |
EP2393960A1 (en) | 2011-12-14 |
US20110265719A1 (en) | 2011-11-03 |
CN102308022A (zh) | 2012-01-04 |
EP2393960A4 (en) | 2012-10-10 |
TW201040309A (en) | 2010-11-16 |
FI20095124A0 (fi) | 2009-02-09 |
WO2010089459A1 (en) | 2010-08-12 |
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