FI20060719A0 - Ionisuihkuetsausmenetelmä ja ionisuihkuetsauslaite - Google Patents

Ionisuihkuetsausmenetelmä ja ionisuihkuetsauslaite

Info

Publication number
FI20060719A0
FI20060719A0 FI20060719A FI20060719A FI20060719A0 FI 20060719 A0 FI20060719 A0 FI 20060719A0 FI 20060719 A FI20060719 A FI 20060719A FI 20060719 A FI20060719 A FI 20060719A FI 20060719 A0 FI20060719 A0 FI 20060719A0
Authority
FI
Finland
Prior art keywords
ion
etching
ion beam
etching method
beam etching
Prior art date
Application number
FI20060719A
Other languages
English (en)
Swedish (sv)
Other versions
FI20060719A (fi
FI122010B (fi
Inventor
Vladimir Touboltsev
Marko Kaarre
Konstantin Arutyunov
Original Assignee
Jyvaeskylaen Yliopisto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jyvaeskylaen Yliopisto filed Critical Jyvaeskylaen Yliopisto
Priority to FI20060719A priority Critical patent/FI122010B/fi
Publication of FI20060719A0 publication Critical patent/FI20060719A0/fi
Priority to PCT/FI2007/050440 priority patent/WO2008017733A1/en
Publication of FI20060719A publication Critical patent/FI20060719A/fi
Application granted granted Critical
Publication of FI122010B publication Critical patent/FI122010B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523—Etching material
    • B81C1/00531—Dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
    • H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching for microworking, e.g. etching of gratings, trimming of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/2633—Bombardment with radiation with high-energy radiation for etching, e.g. sputteretching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20214—Rotation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
    • H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
    • H01J2237/24528—Direction of beam or parts thereof in view of the optical axis, e.g. beam angle, angular distribution, beam divergence, beam convergence or beam landing angle on sample or workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3174—Etching microareas
FI20060719A 2006-08-09 2006-08-09 Ionisuihkuetsausmenetelmä ja -laitteisto FI122010B (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20060719A FI122010B (fi) 2006-08-09 2006-08-09 Ionisuihkuetsausmenetelmä ja -laitteisto
PCT/FI2007/050440 WO2008017733A1 (en) 2006-08-09 2007-08-09 Ion beam etching method and ion beam etching apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20060719 2006-08-09
FI20060719A FI122010B (fi) 2006-08-09 2006-08-09 Ionisuihkuetsausmenetelmä ja -laitteisto

Publications (3)

Publication Number Publication Date
FI20060719A0 true FI20060719A0 (fi) 2006-08-09
FI20060719A FI20060719A (fi) 2008-02-10
FI122010B FI122010B (fi) 2011-07-15

Family

ID=36950625

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20060719A FI122010B (fi) 2006-08-09 2006-08-09 Ionisuihkuetsausmenetelmä ja -laitteisto

Country Status (2)

Country Link
FI (1) FI122010B (fi)
WO (1) WO2008017733A1 (fi)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2585010C1 (ru) * 2014-12-12 2016-05-27 Антон Борисович Архипов Установка для двусторонней финишной обработки поверхности интраокулярных линз
EP3809447A1 (en) * 2019-10-18 2021-04-21 FEI Company Method for large-area 3d analysis of samples using glancing incidence fib milling

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856332A (ja) * 1981-09-30 1983-04-04 Hitachi Ltd マスクの欠陥修正方法
US5599749A (en) * 1994-10-21 1997-02-04 Yamaha Corporation Manufacture of micro electron emitter
RU2173003C2 (ru) * 1999-11-25 2001-08-27 Септре Электроникс Лимитед Способ образования кремниевой наноструктуры, решетки кремниевых квантовых проводков и основанных на них устройств

Also Published As

Publication number Publication date
FI20060719A (fi) 2008-02-10
FI122010B (fi) 2011-07-15
WO2008017733A1 (en) 2008-02-14

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