DE602006015333D1 - Plasmaverarbeitungsvorrichtung - Google Patents

Plasmaverarbeitungsvorrichtung

Info

Publication number
DE602006015333D1
DE602006015333D1 DE602006015333T DE602006015333T DE602006015333D1 DE 602006015333 D1 DE602006015333 D1 DE 602006015333D1 DE 602006015333 T DE602006015333 T DE 602006015333T DE 602006015333 T DE602006015333 T DE 602006015333T DE 602006015333 D1 DE602006015333 D1 DE 602006015333D1
Authority
DE
Germany
Prior art keywords
processing device
plasma processing
plasma
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006015333T
Other languages
English (en)
Inventor
Tetsuhiro Iwai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of DE602006015333D1 publication Critical patent/DE602006015333D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
DE602006015333T 2005-09-12 2006-09-07 Plasmaverarbeitungsvorrichtung Active DE602006015333D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005263409A JP4674512B2 (ja) 2005-09-12 2005-09-12 プラズマ処理装置
PCT/JP2006/318229 WO2007032420A1 (en) 2005-09-12 2006-09-07 Plasma processing apparatus

Publications (1)

Publication Number Publication Date
DE602006015333D1 true DE602006015333D1 (de) 2010-08-19

Family

ID=37561186

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006015333T Active DE602006015333D1 (de) 2005-09-12 2006-09-07 Plasmaverarbeitungsvorrichtung

Country Status (8)

Country Link
US (1) US20090008035A1 (de)
EP (1) EP1925016B1 (de)
JP (1) JP4674512B2 (de)
KR (1) KR20080043732A (de)
CN (1) CN100533652C (de)
DE (1) DE602006015333D1 (de)
TW (1) TW200715403A (de)
WO (1) WO2007032420A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITBO20070306A1 (it) * 2007-04-26 2008-10-27 Tecnotessile Societa Naz Di Ricerca ... Elettrodo e relativo apparato per la generazione di plasma a pressione atmosferica.
JP5743895B2 (ja) * 2008-10-31 2015-07-01 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ プラズマ処理チャンバの下側電極アセンブリ
JP5262878B2 (ja) * 2009-03-17 2013-08-14 東京エレクトロン株式会社 載置台構造及びプラズマ成膜装置
JP5643528B2 (ja) * 2009-03-30 2014-12-17 東京エレクトロン株式会社 基板処理装置
US8562742B2 (en) * 2010-04-30 2013-10-22 Applied Materials, Inc. Apparatus for radial delivery of gas to a chamber and methods of use thereof
US8826857B2 (en) 2011-11-21 2014-09-09 Lam Research Corporation Plasma processing assemblies including hinge assemblies
JP6024921B2 (ja) * 2013-11-01 2016-11-16 パナソニックＩｐマネジメント株式会社 プラズマ処理装置及びプラズマ処理方法
EP3129230B1 (de) * 2014-04-11 2018-02-28 OCE-Technologies B.V. Tintenstrahldrucker umfassend eine plasmaerzeugende vorrichtung, plasmaerzeugende vorrichtung dazu, und verfahren dazu
TWI641016B (zh) * 2016-06-28 2018-11-11 周業投資股份有限公司 Upper electrode device
US10851457B2 (en) * 2017-08-31 2020-12-01 Lam Research Corporation PECVD deposition system for deposition on selective side of the substrate
CN113366145A (zh) * 2019-01-31 2021-09-07 朗姆研究公司 具有可调式气体出口的喷头
KR102505474B1 (ko) * 2019-08-16 2023-03-03 램 리써치 코포레이션 웨이퍼 내에서 차동 보우를 보상하기 위한 공간적으로 튜닝 가능한 증착
WO2021190808A1 (en) * 2020-03-24 2021-09-30 Evatec Ag Vacuum recipient apparatus with at least one treatment station
CN111725111B (zh) * 2020-06-24 2023-08-18 北京北方华创微电子装备有限公司 半导体工艺设备的反应腔室及半导体工艺设备
US11521834B2 (en) * 2020-08-26 2022-12-06 Tokyo Electron Limited Plasma processing systems and methods for chemical processing a substrate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4209357A (en) * 1979-05-18 1980-06-24 Tegal Corporation Plasma reactor apparatus
US5823416A (en) * 1995-07-28 1998-10-20 Matsushita Electric Industrial Co., Ltd. Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus
JPH11140648A (ja) * 1997-11-07 1999-05-25 Tokyo Electron Ltd プロセスチャンバ装置及び処理装置
JP2000208483A (ja) * 1999-01-08 2000-07-28 Mitsubishi Electric Corp ウェハ処理装置及びウェハ処理方法
WO2001052302A1 (en) * 2000-01-10 2001-07-19 Tokyo Electron Limited Segmented electrode assembly and method for plasma processing
MY120869A (en) 2000-01-26 2005-11-30 Matsushita Electric Ind Co Ltd Plasma treatment apparatus and method
JP2004165674A (ja) * 2000-01-26 2004-06-10 Matsushita Electric Ind Co Ltd ワークのプラズマ処理装置およびワークのプラズマ処理方法
JP4896337B2 (ja) * 2000-05-17 2012-03-14 東京エレクトロン株式会社 処理装置およびそのメンテナンス方法，処理装置部品の組立機構およびその組立方法，ロック機構およびそのロック方法
JP3969081B2 (ja) * 2001-12-14 2007-08-29 東京エレクトロン株式会社 プラズマ処理装置
JP4186536B2 (ja) * 2002-07-18 2008-11-26 松下電器産業株式会社 プラズマ処理装置
JP4173389B2 (ja) * 2003-03-19 2008-10-29 東京エレクトロン株式会社 プラズマ処理装置
JP3992018B2 (ja) * 2003-07-23 2007-10-17 松下電器産業株式会社 プラズマ処理装置
US20050066902A1 (en) * 2003-09-26 2005-03-31 Tokyo Electron Limited Method and apparatus for plasma processing

Also Published As

Publication number Publication date
CN100533652C (zh) 2009-08-26
WO2007032420A1 (en) 2007-03-22
EP1925016A1 (de) 2008-05-28
JP4674512B2 (ja) 2011-04-20
US20090008035A1 (en) 2009-01-08
EP1925016B1 (de) 2010-07-07
CN101116167A (zh) 2008-01-30
KR20080043732A (ko) 2008-05-19
JP2007080555A (ja) 2007-03-29
TW200715403A (en) 2007-04-16

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