FI20060697A0 - Förfarande för tillverkning av ledare och halvledare - Google Patents

Förfarande för tillverkning av ledare och halvledare

Info

Publication number
FI20060697A0
FI20060697A0 FI20060697A FI20060697A FI20060697A0 FI 20060697 A0 FI20060697 A0 FI 20060697A0 FI 20060697 A FI20060697 A FI 20060697A FI 20060697 A FI20060697 A FI 20060697A FI 20060697 A0 FI20060697 A0 FI 20060697A0
Authority
FI
Finland
Prior art keywords
semiconductors
procedure
manufacturing conductors
conductors
manufacturing
Prior art date
Application number
FI20060697A
Other languages
English (en)
Finnish (fi)
Other versions
FI121562B (sv
FI20060697A (sv
Inventor
Heikki Seppae
Mark Allen
Original Assignee
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen filed Critical Valtion Teknillinen
Priority to FI20060697A priority Critical patent/FI121562B/sv
Publication of FI20060697A0 publication Critical patent/FI20060697A0/sv
Publication of FI20060697A publication Critical patent/FI20060697A/sv
Application granted granted Critical
Publication of FI121562B publication Critical patent/FI121562B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Powder Metallurgy (AREA)
FI20060697A 2006-07-21 2006-07-21 Förfarande för tillverkning av ledare och halvledare FI121562B (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FI20060697A FI121562B (sv) 2006-07-21 2006-07-21 Förfarande för tillverkning av ledare och halvledare

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20060697 2006-07-21
FI20060697A FI121562B (sv) 2006-07-21 2006-07-21 Förfarande för tillverkning av ledare och halvledare

Publications (3)

Publication Number Publication Date
FI20060697A0 true FI20060697A0 (sv) 2006-07-21
FI20060697A FI20060697A (sv) 2008-01-22
FI121562B FI121562B (sv) 2010-12-31

Family

ID=36758304

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20060697A FI121562B (sv) 2006-07-21 2006-07-21 Förfarande för tillverkning av ledare och halvledare

Country Status (1)

Country Link
FI (1) FI121562B (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI122644B (sv) 2007-06-08 2012-04-30 Teknologian Tutkimuskeskus Vtt Förfarande för att bilda elektriskt ledande eller halvledande stigar på ett substrat samt användning av förfarandet för producering av transistorer och tillverkning av givare
FI122014B (sv) 2007-06-08 2011-07-15 Teknologian Tutkimuskeskus Vtt Förfarande och anordning för funktionalisering av nanopartikelsystem
FI122011B (sv) 2007-06-08 2011-07-15 Teknologian Tutkimuskeskus Vtt Förfarande för att bilda en elektronikmodul, intermediär produkt för tillverkning av en elektronikmodul, minneselement, tryckt elektronikprodukt, givaranordning och RFID-identifikation

Also Published As

Publication number Publication date
FI121562B (sv) 2010-12-31
FI20060697A (sv) 2008-01-22

Similar Documents

Publication Publication Date Title
DE112007003796A5 (de) Poröses Silizium-Dielektrikum
FI20060233A (sv) Anordning och förfarande för mätning av eleffekt
DE602007013318D1 (de) Halbleiterbauelement
EP2050319A4 (en) METHOD FOR THE PRODUCTION OF LADDERS AND SEMICONDUCTORS
FI20060493A (sv) Förfarande och anordning för övervakning av fastighet
FI20061090A0 (sv) Förfarande för kontroll av skick
TWI340469B (en) Semiconductor devices and fabrication methods thereof
DE602007013972D1 (de) Halbleiterbauelement
DE602007002105D1 (de) Halbleiterbauelement
DE602007013325D1 (de) Halbleitervorrichtung und Herstellungsverfahren dafür
FI20085694A0 (sv) Förfarande för tillverkning av en induktiv elkomponent, en induktiv elkomponent och användning av densamma
DE102006052910A8 (de) Wafer-Herstellungs-Verfahren und -Vorrichtung
FI20085807A (sv) Förfarande för tillverkning av escitalopram
FI20060697A0 (sv) Förfarande för tillverkning av ledare och halvledare
FI20065626A0 (sv) Terminal för ventilation
FR2902632B1 (fr) Aspirateur
NO20062419L (no) Elektrisk anordning
FI20065782A0 (sv) Arrangemang och förfarande för borrning
FI20070318A0 (sv) Förfarande och arrangemang för kylning av apparathölje
FR2896681B1 (fr) Aspirateur
TWI319900B (en) Semiconductor manufacturing device
FR2896679B1 (fr) Aspirateur
FI20065221A0 (sv) Förfarande för adaptering av ledledning och adapter
FI20070339A0 (sv) Skavankskydd och förfarande för framställning av detsamma
FI20075171A (sv) Givarelement och förfarande för tillverkning av detsamma

Legal Events

Date Code Title Description
MM Patent lapsed