FI20050970A0 - Vähän laajenevat eristävät koostumukset - Google Patents

Vähän laajenevat eristävät koostumukset

Info

Publication number
FI20050970A0
FI20050970A0 FI20050970A FI20050970A FI20050970A0 FI 20050970 A0 FI20050970 A0 FI 20050970A0 FI 20050970 A FI20050970 A FI 20050970A FI 20050970 A FI20050970 A FI 20050970A FI 20050970 A0 FI20050970 A0 FI 20050970A0
Authority
FI
Finland
Prior art keywords
insulating composition
low expanding
expanding insulating
low
composition
Prior art date
Application number
FI20050970A
Other languages
English (en)
Swedish (sv)
Other versions
FI20050970A (fi
Inventor
Guoren He
William D Varnell
Thomas J Williams
Original Assignee
Polyclad Laminates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyclad Laminates Inc filed Critical Polyclad Laminates Inc
Publication of FI20050970A0 publication Critical patent/FI20050970A0/fi
Publication of FI20050970A publication Critical patent/FI20050970A/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
FI20050970A 2004-09-28 2005-09-28 Vähän laajenevat eristävät koostumukset FI20050970A (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/952,102 US20060074151A1 (en) 2004-09-28 2004-09-28 Low expansion dielectric compositions

Publications (2)

Publication Number Publication Date
FI20050970A0 true FI20050970A0 (fi) 2005-09-28
FI20050970A FI20050970A (fi) 2006-03-29

Family

ID=35151423

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20050970A FI20050970A (fi) 2004-09-28 2005-09-28 Vähän laajenevat eristävät koostumukset

Country Status (5)

Country Link
US (1) US20060074151A1 (fi)
CN (1) CN1769346A (fi)
DE (1) DE102005046136A1 (fi)
FI (1) FI20050970A (fi)
TW (1) TW200624499A (fi)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8932705B2 (en) * 2008-12-24 2015-01-13 Samsung Electro-Mechanics Co., Ltd. Thermosetting resin composition and board using the same
WO2010144792A1 (en) * 2009-06-11 2010-12-16 Rogers Corporation Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
JP5684804B2 (ja) * 2009-06-22 2015-03-18 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂のためのハードナー組成物
US10227469B1 (en) 2015-09-04 2019-03-12 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration Polyamide aerogels
CN109790358B (zh) * 2016-07-25 2022-06-17 伊索拉美国有限公司 改进的sma树脂制剂
JP6680405B1 (ja) * 2018-06-01 2020-04-15 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143320A (en) * 1981-02-28 1982-09-04 Mitsubishi Gas Chem Co Inc Novel curable resin composition
US4479983A (en) * 1983-01-07 1984-10-30 International Business Machines Corporation Method and composition for applying coatings on printed circuit boards
JPS6424825A (en) * 1987-07-20 1989-01-26 Mitsubishi Gas Chemical Co Epoxy resin composition
US5043367A (en) * 1988-12-22 1991-08-27 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production
CN1036402C (zh) * 1991-01-11 1997-11-12 旭化成工业株式会社 可固化的聚苯氧树脂组合物及由它制成的薄膜
US5262491A (en) * 1991-03-29 1993-11-16 General Electric Company High performance curable PPO/monomeric epoxy compositions with tin metal salt compatibilizing agent
JPH0665500A (ja) * 1992-08-21 1994-03-08 Mitsubishi Gas Chem Co Inc ポリアミド樹脂組成物
TW521548B (en) * 2000-10-13 2003-02-21 Zeon Corp Curable composition, molded article, multi-layer wiring substrate, particle and its manufacturing process, varnish and its manufacturing process, laminate, and flame retardant slurry
US7022777B2 (en) * 2001-06-28 2006-04-04 General Electric Moldable poly(arylene ether) thermosetting compositions, methods, and articles
US7687556B2 (en) * 2004-09-28 2010-03-30 Isola Usa Corp. Flame retardant compositions
US8129456B2 (en) * 2004-09-28 2012-03-06 Isola Usa Corp. Flame retardant compositions with a phosphorated compound

Also Published As

Publication number Publication date
CN1769346A (zh) 2006-05-10
FI20050970A (fi) 2006-03-29
TW200624499A (en) 2006-07-16
US20060074151A1 (en) 2006-04-06
DE102005046136A1 (de) 2006-05-11

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Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: ISOLA USA CORP.

Free format text: ISOLA USA CORP.

FD Application lapsed