FI20040666A - EMI-tiiviste - Google Patents

EMI-tiiviste Download PDF

Info

Publication number
FI20040666A
FI20040666A FI20040666A FI20040666A FI20040666A FI 20040666 A FI20040666 A FI 20040666A FI 20040666 A FI20040666 A FI 20040666A FI 20040666 A FI20040666 A FI 20040666A FI 20040666 A FI20040666 A FI 20040666A
Authority
FI
Finland
Prior art keywords
emi gasket
emi
gasket
Prior art date
Application number
FI20040666A
Other languages
English (en)
Swedish (sv)
Other versions
FI20040666A0 (fi
FI119217B (fi
Inventor
Petri Kohonen
Pentti Immonen
Original Assignee
Tellabs Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tellabs Oy filed Critical Tellabs Oy
Priority to FI20040666A priority Critical patent/FI119217B/fi
Publication of FI20040666A0 publication Critical patent/FI20040666A0/fi
Priority to US11/127,023 priority patent/US7285731B2/en
Priority to EP05103942A priority patent/EP1596643B1/en
Priority to DE602005000273T priority patent/DE602005000273T2/de
Priority to CN200510068809.9A priority patent/CN1717169B/zh
Publication of FI20040666A publication Critical patent/FI20040666A/fi
Application granted granted Critical
Publication of FI119217B publication Critical patent/FI119217B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H05K9/0016—Gaskets or seals having a spring contact

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Gasket Seals (AREA)
FI20040666A 2004-05-11 2004-05-11 EMI-tiiviste FI119217B (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20040666A FI119217B (fi) 2004-05-11 2004-05-11 EMI-tiiviste
US11/127,023 US7285731B2 (en) 2004-05-11 2005-05-10 EMI gasket
EP05103942A EP1596643B1 (en) 2004-05-11 2005-05-11 EMI gasket
DE602005000273T DE602005000273T2 (de) 2004-05-11 2005-05-11 Dichtung zur Abschirmung von elektromagnetischen Interferenzen
CN200510068809.9A CN1717169B (zh) 2004-05-11 2005-05-11 电磁干扰衬垫

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20040666 2004-05-11
FI20040666A FI119217B (fi) 2004-05-11 2004-05-11 EMI-tiiviste

Publications (3)

Publication Number Publication Date
FI20040666A0 FI20040666A0 (fi) 2004-05-11
FI20040666A true FI20040666A (fi) 2005-11-12
FI119217B FI119217B (fi) 2008-08-29

Family

ID=32338376

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20040666A FI119217B (fi) 2004-05-11 2004-05-11 EMI-tiiviste

Country Status (5)

Country Link
US (1) US7285731B2 (fi)
EP (1) EP1596643B1 (fi)
CN (1) CN1717169B (fi)
DE (1) DE602005000273T2 (fi)
FI (1) FI119217B (fi)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7399931B2 (en) * 2006-03-09 2008-07-15 Laird Technologies, Inc. Gaskets for protecting fingerprint readers from electrostatic discharge surges
US8007290B1 (en) * 2010-06-01 2011-08-30 Sony Ericsson Mobile Communications Ab Mounting device for a connector
CN102740665A (zh) * 2011-04-08 2012-10-17 鸿富锦精密工业（深圳）有限公司 防电磁干扰弹片及采用该防电磁干扰弹片的电子装置
US10631419B1 (en) * 2019-02-13 2020-04-21 Diebold Nixdorf, Incorporated Mounting bracket for encrypted touch module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3594490A (en) 1970-07-17 1971-07-20 Ibm Electronic grounding system
US5001297A (en) 1989-05-23 1991-03-19 Instrument Specialties Company, Inc. Track mounted electromagnetic shielding device
US5045635A (en) * 1989-06-16 1991-09-03 Schlegel Corporation Conductive gasket with flame and abrasion resistant conductive coating
DE4102019C1 (fi) 1991-01-24 1992-07-09 Schroff Gmbh, 7541 Straubenhardt, De
US5532428A (en) * 1994-03-23 1996-07-02 Dell Usa, L.P. Snap-in resilient emi grounding clip apparatus for computer structures
US5559676A (en) * 1995-06-07 1996-09-24 Gessaman; Martin J. Self-contained drop-in component
US5959244A (en) * 1997-08-29 1999-09-28 Hewlett-Packard Company Front and rear contacting EMI gasket
US6005186A (en) * 1998-03-27 1999-12-21 International Business Machines Corporation Snap-fit electromagnetic shield
JP3112883B2 (ja) 1998-04-17 2000-11-27 静岡日本電気株式会社 電磁シールド構造および導電性プラスチックばね
US6330139B1 (en) * 1999-06-03 2001-12-11 Hon Hai Precision Ind. Co., Ltd. I/O bracket of electronic device
KR200182519Y1 (ko) * 1999-12-24 2000-05-15 익스팬전자주식회사 클립형 도전성 개스킷
US6744641B2 (en) 2002-06-10 2004-06-01 Sun Microsystems, Inc. Electromagnetic interference gasket
US6673998B1 (en) * 2003-01-02 2004-01-06 Accton Technology Corporation Electromagnetic shielding device with heat-dissipating capability

Also Published As

Publication number Publication date
FI20040666A0 (fi) 2004-05-11
CN1717169A (zh) 2006-01-04
US20050269118A1 (en) 2005-12-08
CN1717169B (zh) 2010-06-16
EP1596643A1 (en) 2005-11-16
EP1596643B1 (en) 2006-11-22
US7285731B2 (en) 2007-10-23
FI119217B (fi) 2008-08-29
DE602005000273T2 (de) 2007-06-21
DE602005000273D1 (de) 2007-01-04

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