DE602005000273D1 - Dichtung zur Abschirmung von elektromagnetischen Interferenzen - Google Patents

Dichtung zur Abschirmung von elektromagnetischen Interferenzen

Info

Publication number
DE602005000273D1
DE602005000273D1 DE602005000273T DE602005000273T DE602005000273D1 DE 602005000273 D1 DE602005000273 D1 DE 602005000273D1 DE 602005000273 T DE602005000273 T DE 602005000273T DE 602005000273 T DE602005000273 T DE 602005000273T DE 602005000273 D1 DE602005000273 D1 DE 602005000273D1
Authority
DE
Germany
Prior art keywords
seal
electromagnetic interference
shielding electromagnetic
shielding
interference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005000273T
Other languages
English (en)
Other versions
DE602005000273T2 (de
Inventor
Petri Kohonen
Pentti Immonen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infinera Oy
Original Assignee
Tellabs Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tellabs Oy filed Critical Tellabs Oy
Publication of DE602005000273D1 publication Critical patent/DE602005000273D1/de
Application granted granted Critical
Publication of DE602005000273T2 publication Critical patent/DE602005000273T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H05K9/0016—Gaskets or seals having a spring contact

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Gasket Seals (AREA)
DE602005000273T 2004-05-11 2005-05-11 Dichtung zur Abschirmung von elektromagnetischen Interferenzen Active DE602005000273T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20040666 2004-05-11
FI20040666A FI119217B (fi) 2004-05-11 2004-05-11 EMI-tiiviste

Publications (2)

Publication Number Publication Date
DE602005000273D1 true DE602005000273D1 (de) 2007-01-04
DE602005000273T2 DE602005000273T2 (de) 2007-06-21

Family

ID=32338376

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005000273T Active DE602005000273T2 (de) 2004-05-11 2005-05-11 Dichtung zur Abschirmung von elektromagnetischen Interferenzen

Country Status (5)

Country Link
US (1) US7285731B2 (de)
EP (1) EP1596643B1 (de)
CN (1) CN1717169B (de)
DE (1) DE602005000273T2 (de)
FI (1) FI119217B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7399931B2 (en) * 2006-03-09 2008-07-15 Laird Technologies, Inc. Gaskets for protecting fingerprint readers from electrostatic discharge surges
US8007290B1 (en) * 2010-06-01 2011-08-30 Sony Ericsson Mobile Communications Ab Mounting device for a connector
CN102740665A (zh) * 2011-04-08 2012-10-17 鸿富锦精密工业（深圳）有限公司 防电磁干扰弹片及采用该防电磁干扰弹片的电子装置
US10631419B1 (en) * 2019-02-13 2020-04-21 Diebold Nixdorf, Incorporated Mounting bracket for encrypted touch module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3594490A (en) * 1970-07-17 1971-07-20 Ibm Electronic grounding system
US5001297A (en) * 1989-05-23 1991-03-19 Instrument Specialties Company, Inc. Track mounted electromagnetic shielding device
US5045635A (en) * 1989-06-16 1991-09-03 Schlegel Corporation Conductive gasket with flame and abrasion resistant conductive coating
DE4102019C1 (de) * 1991-01-24 1992-07-09 Schroff Gmbh, 7541 Straubenhardt, De
US5532428A (en) * 1994-03-23 1996-07-02 Dell Usa, L.P. Snap-in resilient emi grounding clip apparatus for computer structures
US5559676A (en) * 1995-06-07 1996-09-24 Gessaman; Martin J. Self-contained drop-in component
US5959244A (en) * 1997-08-29 1999-09-28 Hewlett-Packard Company Front and rear contacting EMI gasket
US6005186A (en) * 1998-03-27 1999-12-21 International Business Machines Corporation Snap-fit electromagnetic shield
JP3112883B2 (ja) 1998-04-17 2000-11-27 静岡日本電気株式会社 電磁シールド構造および導電性プラスチックばね
US6330139B1 (en) * 1999-06-03 2001-12-11 Hon Hai Precision Ind. Co., Ltd. I/O bracket of electronic device
KR200182519Y1 (ko) * 1999-12-24 2000-05-15 익스팬전자주식회사 클립형 도전성 개스킷
US6744641B2 (en) * 2002-06-10 2004-06-01 Sun Microsystems, Inc. Electromagnetic interference gasket
US6673998B1 (en) * 2003-01-02 2004-01-06 Accton Technology Corporation Electromagnetic shielding device with heat-dissipating capability

Also Published As

Publication number Publication date
CN1717169A (zh) 2006-01-04
FI119217B (fi) 2008-08-29
CN1717169B (zh) 2010-06-16
DE602005000273T2 (de) 2007-06-21
EP1596643A1 (de) 2005-11-16
EP1596643B1 (de) 2006-11-22
US7285731B2 (en) 2007-10-23
FI20040666A0 (fi) 2004-05-11
FI20040666A (fi) 2005-11-12
US20050269118A1 (en) 2005-12-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition