FI20000661A0 - Menetelmä kalvoanturin valmistamiseksi - Google Patents

Menetelmä kalvoanturin valmistamiseksi

Info

Publication number
FI20000661A0
FI20000661A0 FI20000661A FI20000661A FI20000661A0 FI 20000661 A0 FI20000661 A0 FI 20000661A0 FI 20000661 A FI20000661 A FI 20000661A FI 20000661 A FI20000661 A FI 20000661A FI 20000661 A0 FI20000661 A0 FI 20000661A0
Authority
FI
Finland
Prior art keywords
manufacturing
membrane detector
membrane
detector
Prior art date
Application number
FI20000661A
Other languages
English (en)
Swedish (sv)
Other versions
FI20000661A (fi
FI115500B (fi
Inventor
Altti Kaleva Torkkeli
Original Assignee
Nokia Oyj
Vti Hamlin Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Oyj, Vti Hamlin Oy filed Critical Nokia Oyj
Priority to FI20000661A priority Critical patent/FI115500B/fi
Publication of FI20000661A0 publication Critical patent/FI20000661A0/fi
Priority to AU2001248395A priority patent/AU2001248395A1/en
Priority to US10/239,320 priority patent/US6901804B2/en
Priority to JP2001575768A priority patent/JP5123457B2/ja
Priority to EP01921399.0A priority patent/EP1273203B1/en
Priority to KR1020027012486A priority patent/KR100809674B1/ko
Priority to PCT/FI2001/000278 priority patent/WO2001078448A1/en
Publication of FI20000661A publication Critical patent/FI20000661A/fi
Application granted granted Critical
Publication of FI115500B publication Critical patent/FI115500B/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
FI20000661A 2000-03-21 2000-03-21 Menetelmä kalvoanturin valmistamiseksi FI115500B (fi)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI20000661A FI115500B (fi) 2000-03-21 2000-03-21 Menetelmä kalvoanturin valmistamiseksi
AU2001248395A AU2001248395A1 (en) 2000-03-21 2001-03-20 Method of manufacturing a membrane sensor
US10/239,320 US6901804B2 (en) 2000-03-21 2001-03-20 Method of manufacturing a membrane sensor
JP2001575768A JP5123457B2 (ja) 2000-03-21 2001-03-20 膜型センサの製造方法
EP01921399.0A EP1273203B1 (en) 2000-03-21 2001-03-20 Differential pressure sensor or microphone
KR1020027012486A KR100809674B1 (ko) 2000-03-21 2001-03-20 박막 센서를 제조하는 방법
PCT/FI2001/000278 WO2001078448A1 (en) 2000-03-21 2001-03-20 Method of manufacturing a membrane sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20000661A FI115500B (fi) 2000-03-21 2000-03-21 Menetelmä kalvoanturin valmistamiseksi
FI20000661 2000-03-21

Publications (3)

Publication Number Publication Date
FI20000661A0 true FI20000661A0 (fi) 2000-03-21
FI20000661A FI20000661A (fi) 2001-09-22
FI115500B FI115500B (fi) 2005-05-13

Family

ID=8557994

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20000661A FI115500B (fi) 2000-03-21 2000-03-21 Menetelmä kalvoanturin valmistamiseksi

Country Status (7)

Country Link
US (1) US6901804B2 (fi)
EP (1) EP1273203B1 (fi)
JP (1) JP5123457B2 (fi)
KR (1) KR100809674B1 (fi)
AU (1) AU2001248395A1 (fi)
FI (1) FI115500B (fi)
WO (1) WO2001078448A1 (fi)

Families Citing this family (40)

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US6715359B2 (en) * 2001-06-28 2004-04-06 Tactex Controls Inc. Pressure sensitive surfaces
US7146016B2 (en) * 2001-11-27 2006-12-05 Center For National Research Initiatives Miniature condenser microphone and fabrication method therefor
US7592239B2 (en) 2003-04-30 2009-09-22 Industry University Cooperation Foundation-Hanyang University Flexible single-crystal film and method of manufacturing the same
JP2004356707A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構
DE102004011145B4 (de) * 2004-03-08 2006-01-12 Infineon Technologies Ag Mikrophon und Verfahren zur Herstellung eines Mikrophons
US7412763B2 (en) * 2005-03-28 2008-08-19 Knowles Electronics, Llc. Method of making an acoustic assembly for a transducer
US7449356B2 (en) * 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
DE102006023165B4 (de) * 2006-05-17 2008-02-14 Infineon Technologies Ag Verfahren zur Herstellung eines akustischen Spiegels aus alternierend angeordneten Schichten hoher und niedriger akustischer Impedanz
JP2010506532A (ja) 2006-10-11 2010-02-25 メムス テクノロジー ビーエイチディー 極低圧力センサーおよびその製造方法
JP4144640B2 (ja) 2006-10-13 2008-09-03 オムロン株式会社 振動センサの製造方法
DE102006055147B4 (de) 2006-11-03 2011-01-27 Infineon Technologies Ag Schallwandlerstruktur und Verfahren zur Herstellung einer Schallwandlerstruktur
US8661910B2 (en) * 2007-01-19 2014-03-04 Ipg, Llc Capacitive sensor
DE102007010913A1 (de) * 2007-03-05 2008-09-11 Endress + Hauser Gmbh + Co. Kg Drucksensor
DE102008040521A1 (de) * 2008-07-18 2010-01-21 Robert Bosch Gmbh Verfahren zur Herstellung eines Bauelements, Verfahren zur Herstellung einer Bauelementanordnung, Bauelement und Bauelementanordnung
US8345895B2 (en) 2008-07-25 2013-01-01 United Microelectronics Corp. Diaphragm of MEMS electroacoustic transducer
WO2010087816A1 (en) * 2009-01-27 2010-08-05 Hewlett-Packard Development Company, L.P. Acoustic energy transducer
US8334159B1 (en) * 2009-03-30 2012-12-18 Advanced Numicro Systems, Inc. MEMS pressure sensor using capacitive technique
CN101534466A (zh) * 2009-04-15 2009-09-16 无锡市纳微电子有限公司 一种硅麦克风芯片及其制作方法
CN201467442U (zh) * 2009-05-15 2010-05-12 瑞声声学科技(常州)有限公司 电容麦克风
US8617960B2 (en) * 2009-12-31 2013-12-31 Texas Instruments Incorporated Silicon microphone transducer
JP4947220B2 (ja) * 2010-05-13 2012-06-06 オムロン株式会社 音響センサ及びマイクロフォン
US8316718B2 (en) 2010-08-23 2012-11-27 Freescale Semiconductor, Inc. MEMS pressure sensor device and method of fabricating same
US8794075B2 (en) * 2011-08-11 2014-08-05 Nxp, B.V. Multilayered NONON membrane in a MEMS sensor
EP2674392B1 (en) 2012-06-12 2017-12-27 ams international AG Integrated circuit with pressure sensor and manufacturing method
US10136226B2 (en) * 2012-12-18 2018-11-20 Tdk Corporation Top-port MEMS microphone and method of manufacturing the same
KR101346583B1 (ko) * 2013-05-23 2014-01-03 (주)에스엠인스트루먼트 Ｍｅｍｓ 마이크로폰을 이용한 유연 기판 부착형 음향 측정 장치 및 그 제조 방법
TWI523808B (zh) * 2014-01-29 2016-03-01 先技股份有限公司 微機電氣體感測裝置
CN105142092A (zh) * 2015-07-21 2015-12-09 合肥鑫晟光电科技有限公司 基板及制作方法、显示装置
US11234762B2 (en) * 2015-12-15 2022-02-01 Agency For Science, Technology And Research Method and deployable multi-spine apparatus for catheter-based renal denervation
CN107690115B (zh) * 2016-08-04 2023-03-17 山东共达电声股份有限公司 微机电麦克风及其制造方法
GB2557364B (en) * 2016-11-29 2020-04-01 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes
US11765533B2 (en) * 2016-12-29 2023-09-19 Gmems Tech Shenzhen Limited Capacitive microphone with two signal outputs that are additive inverse of each other
US10798508B2 (en) * 2016-12-29 2020-10-06 Gmems Tech Shenzhen Limited Process of fabricating lateral mode capacitive microphone
US20210337333A1 (en) * 2016-12-29 2021-10-28 Gmems Tech Shenzhen Limited Process of fabricating capacitive microphone comprising moveable single conductor and stationary composite conductor
US20210345054A1 (en) * 2016-12-29 2021-11-04 Gmems Tech Shenzhen Limited Process of fabricating capacitive microphone comprising movable composite conductor and stationary single conductor
US11765534B2 (en) * 2016-12-29 2023-09-19 Gmems Tech Shenzhen Limited Capacitive microphone with two signal outputs that are additive inverse of each other
US11601763B2 (en) * 2016-12-29 2023-03-07 Gmems Tech Shenzhen Limited Lateral mode capacitive microphone including a capacitor plate with sandwich structure for ultra high performance
US20210314718A1 (en) * 2016-12-29 2021-10-07 Gmems Tech Shenzhen Limited Process of fabricating lateral mode capacitive microphone including a capacitor plate with sandwich structure
FR3061558B1 (fr) 2017-01-04 2019-08-16 Rubix Microphone comprenant des moyens de mesure de gaz et procede de mesure de gaz a l’aide d’un tel microphone
GB2563091A (en) * 2017-05-31 2018-12-05 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes

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AT392182B (de) 1989-07-31 1991-02-11 Akg Akustische Kino Geraete Elektrisch leitender traeger fuer eine gegenelektrode eines kondensatormikrophons
AT399230B (de) * 1992-04-02 1995-04-25 Avl Verbrennungskraft Messtech Einrichtung zur wahlweisen beschickung eines analysengerätes
FR2695787B1 (fr) 1992-09-11 1994-11-10 Suisse Electro Microtech Centr Transducteur capacitif intégré.
US5369544A (en) * 1993-04-05 1994-11-29 Ford Motor Company Silicon-on-insulator capacitive surface micromachined absolute pressure sensor
US5949118A (en) 1994-03-14 1999-09-07 Nippondenso Co., Ltd. Etching method for silicon substrates and semiconductor sensor
FI100918B (fi) 1995-02-17 1998-03-13 Vaisala Oy Pintamikromekaaninen, symmetrinen paine-eroanturi
DE19648424C1 (de) 1996-11-22 1998-06-25 Siemens Ag Mikromechanischer Sensor
US5944970A (en) 1997-04-29 1999-08-31 Honeywell Inc. Solid state electrochemical sensors
DE19741046C1 (de) * 1997-09-18 1999-05-06 Sennheiser Electronic Verfahren zur Herstellung eines Ein-Chip-Mikrophons

Also Published As

Publication number Publication date
EP1273203A1 (en) 2003-01-08
EP1273203B1 (en) 2013-07-10
AU2001248395A1 (en) 2001-10-23
US6901804B2 (en) 2005-06-07
JP2003530717A (ja) 2003-10-14
KR100809674B1 (ko) 2008-03-05
US20030094047A1 (en) 2003-05-22
WO2001078448A1 (en) 2001-10-18
FI20000661A (fi) 2001-09-22
JP5123457B2 (ja) 2013-01-23
KR20030053467A (ko) 2003-06-28
FI115500B (fi) 2005-05-13

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