FI20000661A - Menetelmä kalvoanturin valmistamiseksi - Google Patents
Menetelmä kalvoanturin valmistamiseksi Download PDFInfo
- Publication number
- FI20000661A FI20000661A FI20000661A FI20000661A FI20000661A FI 20000661 A FI20000661 A FI 20000661A FI 20000661 A FI20000661 A FI 20000661A FI 20000661 A FI20000661 A FI 20000661A FI 20000661 A FI20000661 A FI 20000661A
- Authority
- FI
- Finland
- Prior art keywords
- manufacturing
- membrane detector
- membrane
- detector
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000012528 membrane Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20000661A FI115500B (fi) | 2000-03-21 | 2000-03-21 | Menetelmä kalvoanturin valmistamiseksi |
AU2001248395A AU2001248395A1 (en) | 2000-03-21 | 2001-03-20 | Method of manufacturing a membrane sensor |
US10/239,320 US6901804B2 (en) | 2000-03-21 | 2001-03-20 | Method of manufacturing a membrane sensor |
JP2001575768A JP5123457B2 (ja) | 2000-03-21 | 2001-03-20 | 膜型センサの製造方法 |
EP01921399.0A EP1273203B1 (en) | 2000-03-21 | 2001-03-20 | Differential pressure sensor or microphone |
KR1020027012486A KR100809674B1 (ko) | 2000-03-21 | 2001-03-20 | 박막 센서를 제조하는 방법 |
PCT/FI2001/000278 WO2001078448A1 (en) | 2000-03-21 | 2001-03-20 | Method of manufacturing a membrane sensor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20000661A FI115500B (fi) | 2000-03-21 | 2000-03-21 | Menetelmä kalvoanturin valmistamiseksi |
FI20000661 | 2000-03-21 |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20000661A0 FI20000661A0 (fi) | 2000-03-21 |
FI20000661A true FI20000661A (fi) | 2001-09-22 |
FI115500B FI115500B (fi) | 2005-05-13 |
Family
ID=8557994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20000661A FI115500B (fi) | 2000-03-21 | 2000-03-21 | Menetelmä kalvoanturin valmistamiseksi |
Country Status (7)
Country | Link |
---|---|
US (1) | US6901804B2 (fi) |
EP (1) | EP1273203B1 (fi) |
JP (1) | JP5123457B2 (fi) |
KR (1) | KR100809674B1 (fi) |
AU (1) | AU2001248395A1 (fi) |
FI (1) | FI115500B (fi) |
WO (1) | WO2001078448A1 (fi) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6715359B2 (en) * | 2001-06-28 | 2004-04-06 | Tactex Controls Inc. | Pressure sensitive surfaces |
US7146016B2 (en) * | 2001-11-27 | 2006-12-05 | Center For National Research Initiatives | Miniature condenser microphone and fabrication method therefor |
US7592239B2 (en) | 2003-04-30 | 2009-09-22 | Industry University Cooperation Foundation-Hanyang University | Flexible single-crystal film and method of manufacturing the same |
JP2004356707A (ja) * | 2003-05-27 | 2004-12-16 | Hosiden Corp | 音響検出機構 |
DE102004011145B4 (de) * | 2004-03-08 | 2006-01-12 | Infineon Technologies Ag | Mikrophon und Verfahren zur Herstellung eines Mikrophons |
US7412763B2 (en) * | 2005-03-28 | 2008-08-19 | Knowles Electronics, Llc. | Method of making an acoustic assembly for a transducer |
US7449356B2 (en) * | 2005-04-25 | 2008-11-11 | Analog Devices, Inc. | Process of forming a microphone using support member |
DE102006023165B4 (de) * | 2006-05-17 | 2008-02-14 | Infineon Technologies Ag | Verfahren zur Herstellung eines akustischen Spiegels aus alternierend angeordneten Schichten hoher und niedriger akustischer Impedanz |
JP2010506532A (ja) | 2006-10-11 | 2010-02-25 | メムス テクノロジー ビーエイチディー | 極低圧力センサーおよびその製造方法 |
JP4144640B2 (ja) | 2006-10-13 | 2008-09-03 | オムロン株式会社 | 振動センサの製造方法 |
DE102006055147B4 (de) | 2006-11-03 | 2011-01-27 | Infineon Technologies Ag | Schallwandlerstruktur und Verfahren zur Herstellung einer Schallwandlerstruktur |
US8661910B2 (en) * | 2007-01-19 | 2014-03-04 | Ipg, Llc | Capacitive sensor |
DE102007010913A1 (de) * | 2007-03-05 | 2008-09-11 | Endress + Hauser Gmbh + Co. Kg | Drucksensor |
DE102008040521A1 (de) * | 2008-07-18 | 2010-01-21 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Bauelements, Verfahren zur Herstellung einer Bauelementanordnung, Bauelement und Bauelementanordnung |
US8345895B2 (en) | 2008-07-25 | 2013-01-01 | United Microelectronics Corp. | Diaphragm of MEMS electroacoustic transducer |
WO2010087816A1 (en) * | 2009-01-27 | 2010-08-05 | Hewlett-Packard Development Company, L.P. | Acoustic energy transducer |
US8334159B1 (en) * | 2009-03-30 | 2012-12-18 | Advanced Numicro Systems, Inc. | MEMS pressure sensor using capacitive technique |
CN101534466A (zh) * | 2009-04-15 | 2009-09-16 | 无锡市纳微电子有限公司 | 一种硅麦克风芯片及其制作方法 |
CN201467442U (zh) * | 2009-05-15 | 2010-05-12 | 瑞声声学科技(常州)有限公司 | 电容麦克风 |
US8617960B2 (en) * | 2009-12-31 | 2013-12-31 | Texas Instruments Incorporated | Silicon microphone transducer |
JP4947220B2 (ja) * | 2010-05-13 | 2012-06-06 | オムロン株式会社 | 音響センサ及びマイクロフォン |
US8316718B2 (en) | 2010-08-23 | 2012-11-27 | Freescale Semiconductor, Inc. | MEMS pressure sensor device and method of fabricating same |
US8794075B2 (en) * | 2011-08-11 | 2014-08-05 | Nxp, B.V. | Multilayered NONON membrane in a MEMS sensor |
EP2674392B1 (en) | 2012-06-12 | 2017-12-27 | ams international AG | Integrated circuit with pressure sensor and manufacturing method |
US10136226B2 (en) * | 2012-12-18 | 2018-11-20 | Tdk Corporation | Top-port MEMS microphone and method of manufacturing the same |
KR101346583B1 (ko) * | 2013-05-23 | 2014-01-03 | (주)에스엠인스트루먼트 | Mems 마이크로폰을 이용한 유연 기판 부착형 음향 측정 장치 및 그 제조 방법 |
TWI523808B (zh) * | 2014-01-29 | 2016-03-01 | 先技股份有限公司 | 微機電氣體感測裝置 |
CN105142092A (zh) * | 2015-07-21 | 2015-12-09 | 合肥鑫晟光电科技有限公司 | 基板及制作方法、显示装置 |
US11234762B2 (en) * | 2015-12-15 | 2022-02-01 | Agency For Science, Technology And Research | Method and deployable multi-spine apparatus for catheter-based renal denervation |
CN107690115B (zh) * | 2016-08-04 | 2023-03-17 | 山东共达电声股份有限公司 | 微机电麦克风及其制造方法 |
GB2557364B (en) * | 2016-11-29 | 2020-04-01 | Cirrus Logic Int Semiconductor Ltd | MEMS devices and processes |
US11765533B2 (en) * | 2016-12-29 | 2023-09-19 | Gmems Tech Shenzhen Limited | Capacitive microphone with two signal outputs that are additive inverse of each other |
US10798508B2 (en) * | 2016-12-29 | 2020-10-06 | Gmems Tech Shenzhen Limited | Process of fabricating lateral mode capacitive microphone |
US20210337333A1 (en) * | 2016-12-29 | 2021-10-28 | Gmems Tech Shenzhen Limited | Process of fabricating capacitive microphone comprising moveable single conductor and stationary composite conductor |
US20210345054A1 (en) * | 2016-12-29 | 2021-11-04 | Gmems Tech Shenzhen Limited | Process of fabricating capacitive microphone comprising movable composite conductor and stationary single conductor |
US11765534B2 (en) * | 2016-12-29 | 2023-09-19 | Gmems Tech Shenzhen Limited | Capacitive microphone with two signal outputs that are additive inverse of each other |
US11601763B2 (en) * | 2016-12-29 | 2023-03-07 | Gmems Tech Shenzhen Limited | Lateral mode capacitive microphone including a capacitor plate with sandwich structure for ultra high performance |
US20210314718A1 (en) * | 2016-12-29 | 2021-10-07 | Gmems Tech Shenzhen Limited | Process of fabricating lateral mode capacitive microphone including a capacitor plate with sandwich structure |
FR3061558B1 (fr) | 2017-01-04 | 2019-08-16 | Rubix | Microphone comprenant des moyens de mesure de gaz et procede de mesure de gaz a l’aide d’un tel microphone |
GB2563091A (en) * | 2017-05-31 | 2018-12-05 | Cirrus Logic Int Semiconductor Ltd | MEMS devices and processes |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT392182B (de) | 1989-07-31 | 1991-02-11 | Akg Akustische Kino Geraete | Elektrisch leitender traeger fuer eine gegenelektrode eines kondensatormikrophons |
AT399230B (de) * | 1992-04-02 | 1995-04-25 | Avl Verbrennungskraft Messtech | Einrichtung zur wahlweisen beschickung eines analysengerätes |
FR2695787B1 (fr) | 1992-09-11 | 1994-11-10 | Suisse Electro Microtech Centr | Transducteur capacitif intégré. |
US5369544A (en) * | 1993-04-05 | 1994-11-29 | Ford Motor Company | Silicon-on-insulator capacitive surface micromachined absolute pressure sensor |
US5949118A (en) | 1994-03-14 | 1999-09-07 | Nippondenso Co., Ltd. | Etching method for silicon substrates and semiconductor sensor |
FI100918B (fi) | 1995-02-17 | 1998-03-13 | Vaisala Oy | Pintamikromekaaninen, symmetrinen paine-eroanturi |
DE19648424C1 (de) | 1996-11-22 | 1998-06-25 | Siemens Ag | Mikromechanischer Sensor |
US5944970A (en) | 1997-04-29 | 1999-08-31 | Honeywell Inc. | Solid state electrochemical sensors |
DE19741046C1 (de) * | 1997-09-18 | 1999-05-06 | Sennheiser Electronic | Verfahren zur Herstellung eines Ein-Chip-Mikrophons |
-
2000
- 2000-03-21 FI FI20000661A patent/FI115500B/fi not_active IP Right Cessation
-
2001
- 2001-03-20 KR KR1020027012486A patent/KR100809674B1/ko active IP Right Grant
- 2001-03-20 AU AU2001248395A patent/AU2001248395A1/en not_active Abandoned
- 2001-03-20 WO PCT/FI2001/000278 patent/WO2001078448A1/en active Application Filing
- 2001-03-20 EP EP01921399.0A patent/EP1273203B1/en not_active Expired - Lifetime
- 2001-03-20 US US10/239,320 patent/US6901804B2/en not_active Expired - Fee Related
- 2001-03-20 JP JP2001575768A patent/JP5123457B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1273203A1 (en) | 2003-01-08 |
EP1273203B1 (en) | 2013-07-10 |
AU2001248395A1 (en) | 2001-10-23 |
US6901804B2 (en) | 2005-06-07 |
JP2003530717A (ja) | 2003-10-14 |
KR100809674B1 (ko) | 2008-03-05 |
US20030094047A1 (en) | 2003-05-22 |
WO2001078448A1 (en) | 2001-10-18 |
JP5123457B2 (ja) | 2013-01-23 |
FI20000661A0 (fi) | 2000-03-21 |
KR20030053467A (ko) | 2003-06-28 |
FI115500B (fi) | 2005-05-13 |
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