FI125116B - Menetelmä ja laite valosähköisen moduulin kokoamiseksi - Google Patents

Menetelmä ja laite valosähköisen moduulin kokoamiseksi Download PDF

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Publication number
FI125116B
FI125116B FI20135790A FI20135790A FI125116B FI 125116 B FI125116 B FI 125116B FI 20135790 A FI20135790 A FI 20135790A FI 20135790 A FI20135790 A FI 20135790A FI 125116 B FI125116 B FI 125116B
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sheet
plate
support
virtual map
encapsulant
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FI20135790A
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English (en)
Swedish (sv)
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FI20135790A (fi
Inventor
Henrikki Pantsar
Ville Lampinen
Timo Savikko
Jarko Nieminen
Tuukka Savisalo
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Cencorp Oyj
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Priority to FI20135790A priority Critical patent/FI125116B/fi
Priority to US14/914,187 priority patent/US20160284902A1/en
Priority to PCT/FI2014/050591 priority patent/WO2015011342A1/en
Priority to EP14829400.2A priority patent/EP3025376A4/en
Publication of FI20135790A publication Critical patent/FI20135790A/fi
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Publication of FI125116B publication Critical patent/FI125116B/fi

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
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    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
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    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Energy (AREA)
  • Photovoltaic Devices (AREA)

Claims (6)

1. Menetelmä valosähköisen moduulin kokoamiseksi, jossa valosähköinen moduuli käsittää: taustalevyn (2); päällyslevyn (9); ja joukon valosähköisiä kennoja (6) taustalevyn (2) ja päällyslevyn (9) välissä, jossa valosähköiset kennot (6) on erotettu taustalevystä (2) ja päällyslevystä (9) kotelointimateriaalilevyillä (8), joka menetelmä käsittää: vähintään toisen taustalevystä (2) ja päällyslevystä (9) käyttämisen tukilevynä; vähintään osan tukilevystä lämmittämisen lämpötilaan, joka on sopiva kotelointimateriaalin tarttumiseksi tukilevyyn; tukilevyn siirtämisen kosketukseen jonkin kotelointimateriaalilevyistä (8) kanssa saaden kotelointimateriaalilevyn (8) tarttumaan tukilevyyn, tunnettu siitä, että menetelmä käsittää kotelointimateriaalilevyn (8) nostamisen työtasosta nostamalla tukilevy tai telalta (11) siirtämällä tukilevyä telaa (11) pitkin.
2. Patenttivaatimuksen 1 mukainen menetelmä, tunnettu siitä, että erotetaan kotelointimateriaalilevy (8) tukialustasta tukilevyn telalta (11) nostamisen yhteydessä saaden kotelointimateriaalilevyn (8) säilyttämään samat dimensiot kuin tukialustaan kiinnittyneenä.
3. Patenttivaatimuksen 1 mukainen menetelmä, tunnettu siitä, että se käsittää: taustalevyn (2) käyttämisen tukilevynä; virtuaalikartan muodostamisen, jossa virtuaalikartta sisältää taustalevyn (2) ja kotelointimateriaalilevyn (8), joka erottaa taustalevyn (2) ja joukon valosähköisiä kennoja (6), kokoonpanopaikat; reikien työstämisen mainittuun kotelointimateriaalilevyyn (8) virtuaalikartan mukaisesti; ja taustalevyn (2) asettamisen reiät sisältävän kotelointimateriaalilevyn (8) päälle virtuaalikartan paikkainformaation mukaisesti.
4. Järjestelmä valosähköisen moduulin kokoamiseksi, jossa valosähköinen moduuli käsittää: taustalevyn (2); päällyslevyn (9); ja joukon valosähköisiä kennoja (6) taustalevyn (2) ja päällyslevyn (9) välissä, jossa valosähköiset kennot (6) on erotettu taustalevystä (2) ja päällyslevystä (9) kotelointimateriaalilevyillä (8), joka järjestelmä käsittää: välineet vähintään osan tukilevystä lämmittämiseksi, jossa vähintään toinen taustalevystä (2) ja päällyslevystä (9) on järjestetty käytettäväksi tukilevynä, lämpötilaan, joka on sopiva kotelointimateriaalin tarttumiseksi tukilevyyn; välineet tukilevyn siirtämiseksi kosketukseen jonkin kotelointimateriaalilevyistä (8) kanssa saaden kotelointimateriaalilevyn (8) tarttumaan tukilevyyn, tunnettu siitä, että järjestelmä käsittää välineet kotelointimateriaalilevyn (8) nostamiseksi työtasosta nostamalla tukilevy tai välineet kotelointimateriaalilevyn (8) nostamiseksi telalta (11) siirtämällä tukilevyä telaa (11) pitkin.
5. Patenttivaatimuksen 4 mukainen järjestelmä, tunnettu siitä, että se käsittää välineet kotelointimateriaalilevyn (8) erottamiseksi tukialustasta tukilevyn telalta (11) nostamisen yhteydessä saaden kotelointimateriaalilevyn (8) säilyttämään samat dimensiot kuin tukialustaan kiinnittyneenä.
6. Patenttivaatimuksen 4 mukainen järjestelmä, tunnettu siitä, että käytetään taustalevyä (2) tukilevynä, joka järjestelmä käsittää: välineet virtuaalikartan muodostamiseksi, jossa virtuaalikartta käsittää taustalevyn (2) ja kotelointimateriaalilevyn (8), joka erottaa taustalevyn (2) ja joukon valosähköisiä kennoja (6), kokoonpanopaikat; välineet reikien työstämiseksi mainittuun kotelointimateriaalilevyyn (8) virtuaalikartan mukaisiin paikkoihin; ja välineet taustalevyn (2) asettamiseksi reiät sisältävän kotelointimateriaalilevyn (8) päälle virtuaalikartan paikkainformaation mukaisesti.
FI20135790A 2013-07-23 2013-07-23 Menetelmä ja laite valosähköisen moduulin kokoamiseksi FI125116B (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20135790A FI125116B (fi) 2013-07-23 2013-07-23 Menetelmä ja laite valosähköisen moduulin kokoamiseksi
US14/914,187 US20160284902A1 (en) 2013-07-23 2014-07-22 Adhering an ancapsulant sheet for a photovoltaic module
PCT/FI2014/050591 WO2015011342A1 (en) 2013-07-23 2014-07-22 Adhering an encapsulant sheet for a photovoltaic module
EP14829400.2A EP3025376A4 (en) 2013-07-23 2014-07-22 Adhering an encapsulant sheet for a photovoltaic module

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FI20135790 2013-07-23
FI20135790A FI125116B (fi) 2013-07-23 2013-07-23 Menetelmä ja laite valosähköisen moduulin kokoamiseksi

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FI125116B true FI125116B (fi) 2015-06-15

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US20220176687A1 (en) * 2020-12-09 2022-06-09 Zagg Inc Autonomous Application of Screen Protector

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FI20135790A (fi) 2015-01-24
US20160284902A1 (en) 2016-09-29

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