ES8205340A1 - Un metodo mejorado para el estanado de un panel de circuito impreso - Google Patents

Un metodo mejorado para el estanado de un panel de circuito impreso

Info

Publication number
ES8205340A1
ES8205340A1 ES504230A ES504230A ES8205340A1 ES 8205340 A1 ES8205340 A1 ES 8205340A1 ES 504230 A ES504230 A ES 504230A ES 504230 A ES504230 A ES 504230A ES 8205340 A1 ES8205340 A1 ES 8205340A1
Authority
ES
Spain
Prior art keywords
solder flux
flux compositions
flux
compositions
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES504230A
Other languages
English (en)
Other versions
ES504230A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Spain SA
Original Assignee
Alcatel Espana SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Espana SA filed Critical Alcatel Espana SA
Publication of ES504230A0 publication Critical patent/ES504230A0/es
Publication of ES8205340A1 publication Critical patent/ES8205340A1/es
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)

Abstract

METODO PARA EL ESTAÑADO DE UN PANEL DE CIRCUITO IMPRESO CON UNA COMPOSICION DE FUNDENTE. SE FORMA UNA COMPOSICION DE FUNDENTE QUE COMPRENDE UN FUNDENTE LIQUIDO O SOLIDO DISPERSADO EN LA FORMA DE UNA EMULSION O DE UNA SUSPENSION EN UN LIQUIDO EN EL CUAL EL FUNDENTE ES SUSTANCIALMENTE INSOLUBLE. SE APLICA DICHA COMPOSICION A UNA PANEL DE CIRCUITO IMPRESO COMO UNA ESPUMA NO ESTABLE, Y POSTERIORMENTE SE APLICA A DICHO PANEL UNA COMPOSICION DE SOLDADURA DERRETIDA. UNA VEZ ESTAÑADO SE LAVA EN UN LIQUIDO EN EL CUAL EL FUNDENTE ES SOLUBLE.
ES504230A 1980-07-24 1981-07-23 Un metodo mejorado para el estanado de un panel de circuito impreso Expired ES8205340A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8024321A GB2080341B (en) 1980-07-24 1980-07-24 Solder flux compositions

Publications (2)

Publication Number Publication Date
ES504230A0 ES504230A0 (es) 1982-06-01
ES8205340A1 true ES8205340A1 (es) 1982-06-01

Family

ID=10515020

Family Applications (1)

Application Number Title Priority Date Filing Date
ES504230A Expired ES8205340A1 (es) 1980-07-24 1981-07-23 Un metodo mejorado para el estanado de un panel de circuito impreso

Country Status (4)

Country Link
JP (1) JPS6044388B2 (es)
AU (1) AU549803B2 (es)
ES (1) ES8205340A1 (es)
GB (1) GB2080341B (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH653939A5 (de) * 1982-04-07 1986-01-31 Landis & Gyr Ag Verfahren zum maschinellen weichloeten von schwermetallen unter verwendung eines flussmittels.
JPH0773795B2 (ja) * 1985-07-02 1995-08-09 太陽インキ製造株式会社 はんだ付用水洗性フラツクス組成物
JPH03165999A (ja) * 1989-11-24 1991-07-17 Nippondenso Co Ltd はんだ付け用水溶性フラックス
US5452840A (en) * 1990-05-15 1995-09-26 Hughes Aircraft Company Water-soluble soldering flux
US5198038A (en) * 1990-05-15 1993-03-30 Hughes Aircraft Company Foaming flux for automatic soldering process
CA2042091C (en) * 1990-05-15 1995-02-07 Raymond L. Turner Water-soluble soldering flux
US5190208A (en) * 1990-05-15 1993-03-02 Hughes Aircraft Company Foaming flux for automatic soldering process
US5192360A (en) * 1990-05-15 1993-03-09 Hughes Aircraft Company Water-soluble flux for cored solder
EP0753989B1 (en) * 1995-07-11 2005-09-21 Delphi Technologies, Inc. Coatings and methods, especially for circuit boards

Also Published As

Publication number Publication date
ES504230A0 (es) 1982-06-01
JPS6044388B2 (ja) 1985-10-03
AU549803B2 (en) 1986-02-13
GB2080341B (en) 1985-01-09
AU7317781A (en) 1982-01-28
JPS57120662A (en) 1982-07-27
GB2080341A (en) 1982-02-03

Similar Documents

Publication Publication Date Title
DE3167195D1 (en) Flux treated solder powder composition
GB2076827B (en) Anti-corrosive coating compositions
EP0085914A3 (en) Method for the direct bonding of metal pieces to oxide-ceramic substrates
PT72950B (en) Process for the preparation of complex copper salts having phytosanitary effect and phytosanitary compositions containing them
ZA792124B (en) Novel spraying composition, method of applying the same article produced thereby
ES8205340A1 (es) Un metodo mejorado para el estanado de un panel de circuito impreso
HK127693A (en) Anti-viral compositions
IE811978L (en) Polyolefin powder compositions
JPS51144111A (en) Echo cancelling method
GB2078788B (en) Compositions for coating metal surfaces
GB1414877A (en) Soldering fluxes
SE9701981L (sv) Påförande av droppar av smält metall tillsammans med sekundärvätska på ett substrat
ES8403166A1 (es) Procedimiento para la eliminacion de revestimientos superficiales duros y de soldaduras a base de niquel por decapado selectivo de sustratos metalicos.
DE3160752D1 (en) Compositions to be ingested by ruminants, method of producing them
DE2961610D1 (en) Process for in situ modification of solder alloy compositions
JPS5589364A (en) Powdery hot-melt mixture
ZA771030B (en) Compositions and method for degreasing substrates
JPS52143764A (en) Metal connecting method
GB2019443A (en) Hypophosphite Soft Solder Flux
JPS55129211A (en) Agent for controlling blossom blight of apple
JPS541348A (en) Coating of inorganic zinc coating compound for manufacture of large-sized structures
JPS5326223A (en) Work hardening copper alloy
JPS51140565A (en) Semiconductor unit
JPS5228263A (en) Process of face bonding of flip tip
JPS51125417A (en) Varnish composition with improved wettability to oil stained surfaces