ES533252A0 - Un procedimiento para electrodepositar un deposito de cobre brillante y nivelado sobre un substrato conversor. - Google Patents

Un procedimiento para electrodepositar un deposito de cobre brillante y nivelado sobre un substrato conversor.

Info

Publication number
ES533252A0
ES533252A0 ES533252A ES533252A ES533252A0 ES 533252 A0 ES533252 A0 ES 533252A0 ES 533252 A ES533252 A ES 533252A ES 533252 A ES533252 A ES 533252A ES 533252 A0 ES533252 A0 ES 533252A0
Authority
ES
Spain
Prior art keywords
electroposing
bright
procedure
converter substrate
level copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES533252A
Other languages
English (en)
Spanish (es)
Other versions
ES8601336A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of ES8601336A1 publication Critical patent/ES8601336A1/es
Publication of ES533252A0 publication Critical patent/ES533252A0/es
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Chemically Coating (AREA)
ES533252A 1983-06-10 1984-06-08 Un procedimiento para electrodepositar un deposito de cobre brillante y nivelado sobre un substrato conversor. Granted ES533252A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50121183A 1983-06-10 1983-06-10

Publications (2)

Publication Number Publication Date
ES8601336A1 ES8601336A1 (es) 1985-10-16
ES533252A0 true ES533252A0 (es) 1985-10-16

Family

ID=23992559

Family Applications (1)

Application Number Title Priority Date Filing Date
ES533252A Granted ES533252A0 (es) 1983-06-10 1984-06-08 Un procedimiento para electrodepositar un deposito de cobre brillante y nivelado sobre un substrato conversor.

Country Status (10)

Country Link
JP (1) JPS6013090A (enrdf_load_stackoverflow)
AU (1) AU554236B2 (enrdf_load_stackoverflow)
BR (1) BR8402811A (enrdf_load_stackoverflow)
CA (1) CA1255621A (enrdf_load_stackoverflow)
DE (1) DE3420999A1 (enrdf_load_stackoverflow)
ES (1) ES533252A0 (enrdf_load_stackoverflow)
FR (1) FR2547318B1 (enrdf_load_stackoverflow)
GB (1) GB2141140B (enrdf_load_stackoverflow)
IT (1) IT1177785B (enrdf_load_stackoverflow)
NL (1) NL8401841A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4126502C1 (enrdf_load_stackoverflow) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
JPH10330983A (ja) 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
RU2215829C1 (ru) * 2002-02-21 2003-11-10 Калининградский государственный университет Электролит блестящего меднения
DE10261852B3 (de) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
JP4644447B2 (ja) * 2004-06-25 2011-03-02 株式会社日立製作所 プリント配線板の製造方法
GB0520793D0 (en) * 2005-10-13 2005-11-23 Avecia Inkjet Ltd Phthalocyanine inks and their use in ink-jet printing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL83873C (enrdf_load_stackoverflow) * 1952-05-26
BE520210A (enrdf_load_stackoverflow) * 1952-05-26
US2738318A (en) * 1954-12-28 1956-03-13 Udylite Res Corp Electrodeposition of copper from an acid bath
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (enrdf_load_stackoverflow) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
NL7510771A (nl) * 1975-03-11 1976-09-14 Oxy Metal Industries Corp Werkwijze voor het elektrolytisch neerslaan van koper uit waterige zure galvaniseerbaden.
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
GB2141140B (en) 1986-12-10
AU554236B2 (en) 1986-08-14
CA1255621A (en) 1989-06-13
IT8448351A0 (it) 1984-06-08
IT1177785B (it) 1987-08-26
FR2547318A1 (fr) 1984-12-14
NL8401841A (nl) 1985-01-02
GB8414862D0 (en) 1984-07-18
DE3420999C2 (enrdf_load_stackoverflow) 1987-10-15
BR8402811A (pt) 1985-05-21
JPS6013090A (ja) 1985-01-23
AU2903384A (en) 1984-12-13
FR2547318B1 (fr) 1990-05-04
ES8601336A1 (es) 1985-10-16
DE3420999A1 (de) 1984-12-13
GB2141140A (en) 1984-12-12
JPS6112036B2 (enrdf_load_stackoverflow) 1986-04-05

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