ES525704A0 - Procedimiento para la reticulacion de resinas epoxidicas - Google Patents

Procedimiento para la reticulacion de resinas epoxidicas

Info

Publication number
ES525704A0
ES525704A0 ES525704A ES525704A ES525704A0 ES 525704 A0 ES525704 A0 ES 525704A0 ES 525704 A ES525704 A ES 525704A ES 525704 A ES525704 A ES 525704A ES 525704 A0 ES525704 A0 ES 525704A0
Authority
ES
Spain
Prior art keywords
reticulation
procedure
epoxidic resins
epoxidic
resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES525704A
Other languages
English (en)
Other versions
ES8503016A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Publication of ES525704A0 publication Critical patent/ES525704A0/es
Publication of ES8503016A1 publication Critical patent/ES8503016A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Paints Or Removers (AREA)
ES525704A 1982-09-18 1983-09-17 Procedimiento para la reticulacion de resinas epoxidicas Expired ES8503016A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8226705 1982-09-18

Publications (2)

Publication Number Publication Date
ES525704A0 true ES525704A0 (es) 1985-02-01
ES8503016A1 ES8503016A1 (es) 1985-02-01

Family

ID=10533028

Family Applications (1)

Application Number Title Priority Date Filing Date
ES525704A Expired ES8503016A1 (es) 1982-09-18 1983-09-17 Procedimiento para la reticulacion de resinas epoxidicas

Country Status (6)

Country Link
US (1) US4482679A (es)
EP (1) EP0104144B1 (es)
JP (1) JPS60110720A (es)
CA (1) CA1209296A (es)
DE (1) DE3377418D1 (es)
ES (1) ES8503016A1 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8332073D0 (en) * 1983-12-01 1984-01-11 Ciba Geigy Ag Polymerisable compositions
DE3565013D1 (en) * 1984-02-10 1988-10-20 Ciba Geigy Ag Process for the preparation of a protection layer or a relief pattern
JP2829412B2 (ja) * 1988-04-01 1998-11-25 日東電工株式会社 粘着部材の製造方法
US5015675A (en) * 1989-07-31 1991-05-14 General Electric Company Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators
US5426222A (en) * 1994-08-17 1995-06-20 Dow Corning Corporation Method for the preparation of iodonium salts
DE19629750A1 (de) * 1996-07-23 1998-01-29 Siemens Ag Thermisch härtbares einkomponentiges Low Viskosity Adhesive-Klebstoffsystem mit verbesserten Lagerungseigenschaften
DE69942571D1 (de) * 1998-04-23 2010-08-26 Dentsply Detrey Gmbh Lagerungsbeständige polymerisierbare Zusammensetzung
NO20061768L (no) * 2006-04-21 2007-10-22 Nor X Industry As Blanding av tilsetningsmidler til bruk ved fremstilling termoplaster
JP2021529859A (ja) 2018-06-28 2021-11-04 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 低硬化温度を示す潜在的な還元剤を含む、カチオン硬化性組成物
CN114874417B (zh) * 2022-04-29 2023-05-26 万华化学集团股份有限公司 一种环氧树脂稀释剂及其制备方法与应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU497960B2 (en) * 1974-04-11 1979-01-25 Minnesota Mining And Manufacturing Company Photopolymerizable compositions
GB1516352A (en) * 1974-05-02 1978-07-05 Gen Electric Halonium salts
GB1539192A (en) * 1975-01-27 1979-01-31 Ici Ltd Photopolymerisable compositions
US4192924A (en) * 1977-12-16 1980-03-11 General Electric Company Method of foaming curable organic resin compositions
US4216288A (en) * 1978-09-08 1980-08-05 General Electric Company Heat curable cationically polymerizable compositions and method of curing same with onium salts and reducing agents
NL7904171A (nl) * 1978-11-22 1980-05-27 Gen Electric Hardbare, hars bevattende materialen en werkwijze voor het opschuimen hiervan.
US4225691A (en) * 1979-07-17 1980-09-30 General Electric Company Low temperature curable organic resin compositions
GB2042550B (en) * 1978-12-07 1983-08-17 Gen Electric Cationically heat polymerisable materials
US4259454A (en) * 1979-02-12 1981-03-31 General Electric Company Curable organic resin compositions and foaming method
US4308118A (en) * 1979-06-29 1981-12-29 General Electric Company Deep section curable epoxy resin putty
US4374751A (en) * 1980-08-08 1983-02-22 General Electric Company Polymerization initiator compositions
US4404355A (en) * 1980-10-08 1983-09-13 Ciba-Geigy Corporation Heat curable epoxy resin compositions
US4373040A (en) * 1981-06-05 1983-02-08 General Electric Company Epoxy molding compound

Also Published As

Publication number Publication date
EP0104144B1 (de) 1988-07-20
JPS60110720A (ja) 1985-06-17
DE3377418D1 (en) 1988-08-25
EP0104144A2 (de) 1984-03-28
EP0104144A3 (en) 1985-04-17
CA1209296A (en) 1986-08-05
ES8503016A1 (es) 1985-02-01
US4482679A (en) 1984-11-13

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