ES484040A1 - Un procedimiento para fabricar un conjunto de diodos y con- densadores - Google Patents

Un procedimiento para fabricar un conjunto de diodos y con- densadores

Info

Publication number
ES484040A1
ES484040A1 ES484040A ES484040A ES484040A1 ES 484040 A1 ES484040 A1 ES 484040A1 ES 484040 A ES484040 A ES 484040A ES 484040 A ES484040 A ES 484040A ES 484040 A1 ES484040 A1 ES 484040A1
Authority
ES
Spain
Prior art keywords
processing
constructing
capacitor assembly
diode capacitor
diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES484040A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varo Semiconductor Inc
Original Assignee
Varo Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varo Semiconductor Inc filed Critical Varo Semiconductor Inc
Publication of ES484040A1 publication Critical patent/ES484040A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/926—Elongated lead extending axially through another elongated lead
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

Un procedimiento para fabricar un conjunto de diodos y condensadores, cuyo procedimiento comprende las operaciones de: proporcionar una pluralidad de diodos semiconductores, cada uno de los cuales tiene un extremo de ánodo y un extremo de cátodo, unir eléctrica y mecánicamente extremos de ánodo seleccionados y extremos de cátodo seleccionados de dicha pluralidad de diodos formando una estructura de condensador de placas múltiples con el fin de definir una configuración de circuito eléctrico de diodos y condensadores, y atacar químicamente y pasivar los diodos y condensadores ensamblados conjuntamente como un grupo.
ES484040A 1978-09-11 1979-09-10 Un procedimiento para fabricar un conjunto de diodos y con- densadores Expired ES484040A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/941,005 US4288912A (en) 1978-09-11 1978-09-11 Method of constructing and processing a diode capacitor assembly

Publications (1)

Publication Number Publication Date
ES484040A1 true ES484040A1 (es) 1980-04-01

Family

ID=25475773

Family Applications (2)

Application Number Title Priority Date Filing Date
ES484040A Expired ES484040A1 (es) 1978-09-11 1979-09-10 Un procedimiento para fabricar un conjunto de diodos y con- densadores
ES486265A Expired ES486265A1 (es) 1978-09-11 1979-11-23 Un conjunto perfeccionado de diodos y condensadores

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES486265A Expired ES486265A1 (es) 1978-09-11 1979-11-23 Un conjunto perfeccionado de diodos y condensadores

Country Status (10)

Country Link
US (1) US4288912A (es)
JP (1) JPS5550651A (es)
CA (1) CA1125436A (es)
DE (1) DE2935378A1 (es)
ES (2) ES484040A1 (es)
FR (1) FR2435820A1 (es)
GB (1) GB2031650B (es)
IL (1) IL58222A (es)
IT (1) IT1162419B (es)
NL (1) NL7906729A (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844855U (ja) * 1981-09-21 1983-03-25 三菱電機株式会社 整流素子
JPS5996760A (ja) * 1982-11-26 1984-06-04 Matsushita Electric Ind Co Ltd 回路構成部品
US4979017A (en) * 1989-02-23 1990-12-18 Adam Mii Semiconductor element string structure
US4999311A (en) * 1989-08-16 1991-03-12 Unisys Corporation Method of fabricating interconnections to I/O leads on layered electronic assemblies
US5103289A (en) * 1990-02-06 1992-04-07 Square D Company Dual sip package structures
DE4103673A1 (de) * 1991-02-07 1992-08-20 Telefunken Electronic Gmbh Schaltung zur spannungsueberhoehung
US5484097A (en) * 1994-07-12 1996-01-16 General Instrument Corp. Fabrication of hybrid semiconductor devices

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2911572A (en) * 1958-05-20 1959-11-03 Sippican Corp High density electronic packaging
US3270399A (en) * 1962-04-24 1966-09-06 Burroughs Corp Method of fabricating semiconductor devices
US3423821A (en) * 1965-03-18 1969-01-28 Hitachi Ltd Method of producing thin film integrated circuits
US3348105A (en) * 1965-09-20 1967-10-17 Motorola Inc Plastic package full wave rectifier
FR1587785A (es) * 1968-10-02 1970-03-27
US3593107A (en) * 1969-08-19 1971-07-13 Computer Diode Corp High voltage multiplier circuit employing tapered monolithic capacitor sections
GB1368226A (en) * 1973-02-26 1974-09-25 Philips Electronic Associated Capacitor-diode voltage multipliers
GB1404739A (en) * 1974-03-27 1975-09-03 Philips Electronic Associated Capacitor-diode voltage multipliers
JPS5139160U (es) * 1974-09-19 1976-03-24
DE2533720C3 (de) * 1975-07-28 1978-06-01 Siemens Ag Elektrische Spannungsvervielfacher-Kaskade
JPS5251879A (en) * 1975-10-24 1977-04-26 Hitachi Ltd Semiconductor integrated circuit

Also Published As

Publication number Publication date
GB2031650A (en) 1980-04-23
IL58222A0 (en) 1979-12-30
JPS5550651A (en) 1980-04-12
NL7906729A (nl) 1980-03-13
IL58222A (en) 1982-01-31
ES486265A1 (es) 1980-06-16
FR2435820B1 (es) 1984-10-12
CA1125436A (en) 1982-06-08
GB2031650B (en) 1983-03-09
FR2435820A1 (fr) 1980-04-04
IT1162419B (it) 1987-04-01
IT7950225A0 (it) 1979-09-10
US4288912A (en) 1981-09-15
DE2935378A1 (de) 1980-03-20

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