ES483430A1 - Semiconductor heat sink dipped in coolant - has roughened surface assisting boiling coolant bubble formation and flow - Google Patents

Semiconductor heat sink dipped in coolant - has roughened surface assisting boiling coolant bubble formation and flow

Info

Publication number
ES483430A1
ES483430A1 ES483430A ES483430A ES483430A1 ES 483430 A1 ES483430 A1 ES 483430A1 ES 483430 A ES483430 A ES 483430A ES 483430 A ES483430 A ES 483430A ES 483430 A1 ES483430 A1 ES 483430A1
Authority
ES
Spain
Prior art keywords
coolant
heat sink
flow
dipped
boiling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES483430A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of ES483430A1 publication Critical patent/ES483430A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The heat sink, together with the power semiconductor, is immersed in a non-conductive, low boiling point liquid coolant. It has a rough surface, obtained by sand blasting, knurling, casting etc., in order to enhance the formation of gas bubbles when the coolant is brought to boiling. The heat sink may have a cylindrical or cubical shape with a given number of vertical bores also enhancing the flow of both bubbles and coolant. Two heat sinks discs may be conected by brazed pins, or a one piece casting of identical geometry may be used. The heat sink is suitable to reduce power losses with resulting incrase of service life.
ES483430A 1978-08-19 1979-08-16 Semiconductor heat sink dipped in coolant - has roughened surface assisting boiling coolant bubble formation and flow Expired ES483430A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782836710 DE2836710A1 (en) 1978-08-19 1978-08-19 Semiconductor heat sink dipped in coolant - has roughened surface assisting boiling coolant bubble formation and flow

Publications (1)

Publication Number Publication Date
ES483430A1 true ES483430A1 (en) 1980-06-16

Family

ID=6047659

Family Applications (1)

Application Number Title Priority Date Filing Date
ES483430A Expired ES483430A1 (en) 1978-08-19 1979-08-16 Semiconductor heat sink dipped in coolant - has roughened surface assisting boiling coolant bubble formation and flow

Country Status (4)

Country Link
DE (1) DE2836710A1 (en)
DK (1) DK345079A (en)
ES (1) ES483430A1 (en)
IT (1) IT1122461B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3642723A1 (en) * 1986-12-13 1988-06-23 Grundfos Int STATIC FREQUENCY INVERTER, ESPECIALLY FREQUENCY INVERTER FOR CONTROLLING AND / OR REGULATING THE PERFORMANCE SIZE OF AN ELECTRIC MOTOR
DE3825981A1 (en) * 1988-07-27 1990-02-15 Licentia Gmbh Isothermalised heat sink
AT413163B (en) * 2001-12-18 2005-11-15 Fotec Forschungs Und Technolog COOLING DEVICE FOR A CHIP AND METHOD OF MANUFACTURE
US20150022975A1 (en) * 2013-07-19 2015-01-22 General Electric Company Method and system for an immersion boiling heat sink

Also Published As

Publication number Publication date
DK345079A (en) 1980-02-20
DE2836710A1 (en) 1980-02-28
IT7925031A0 (en) 1979-08-09
IT1122461B (en) 1986-04-23

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