IT1122461B - BOILING THERMAL DISPERSER - Google Patents

BOILING THERMAL DISPERSER

Info

Publication number
IT1122461B
IT1122461B IT25031/79A IT2503179A IT1122461B IT 1122461 B IT1122461 B IT 1122461B IT 25031/79 A IT25031/79 A IT 25031/79A IT 2503179 A IT2503179 A IT 2503179A IT 1122461 B IT1122461 B IT 1122461B
Authority
IT
Italy
Prior art keywords
boiling thermal
disperser
thermal disperser
boiling
thermal
Prior art date
Application number
IT25031/79A
Other languages
Italian (it)
Other versions
IT7925031A0 (en
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of IT7925031A0 publication Critical patent/IT7925031A0/en
Application granted granted Critical
Publication of IT1122461B publication Critical patent/IT1122461B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT25031/79A 1978-08-19 1979-08-09 BOILING THERMAL DISPERSER IT1122461B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782836710 DE2836710A1 (en) 1978-08-19 1978-08-19 Semiconductor heat sink dipped in coolant - has roughened surface assisting boiling coolant bubble formation and flow

Publications (2)

Publication Number Publication Date
IT7925031A0 IT7925031A0 (en) 1979-08-09
IT1122461B true IT1122461B (en) 1986-04-23

Family

ID=6047659

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25031/79A IT1122461B (en) 1978-08-19 1979-08-09 BOILING THERMAL DISPERSER

Country Status (4)

Country Link
DE (1) DE2836710A1 (en)
DK (1) DK345079A (en)
ES (1) ES483430A1 (en)
IT (1) IT1122461B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3642723A1 (en) * 1986-12-13 1988-06-23 Grundfos Int STATIC FREQUENCY INVERTER, ESPECIALLY FREQUENCY INVERTER FOR CONTROLLING AND / OR REGULATING THE PERFORMANCE SIZE OF AN ELECTRIC MOTOR
DE3825981A1 (en) * 1988-07-27 1990-02-15 Licentia Gmbh Isothermalised heat sink
AT413163B (en) * 2001-12-18 2005-11-15 Fotec Forschungs Und Technolog COOLING DEVICE FOR A CHIP AND METHOD OF MANUFACTURE
US20150022975A1 (en) * 2013-07-19 2015-01-22 General Electric Company Method and system for an immersion boiling heat sink

Also Published As

Publication number Publication date
DK345079A (en) 1980-02-20
ES483430A1 (en) 1980-06-16
DE2836710A1 (en) 1980-02-28
IT7925031A0 (en) 1979-08-09

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