ES410341A1 - Procedimiento para la fabricacion de un elemento semicon- ductor de construccion. - Google Patents
Procedimiento para la fabricacion de un elemento semicon- ductor de construccion.Info
- Publication number
- ES410341A1 ES410341A1 ES410341A ES410341A ES410341A1 ES 410341 A1 ES410341 A1 ES 410341A1 ES 410341 A ES410341 A ES 410341A ES 410341 A ES410341 A ES 410341A ES 410341 A1 ES410341 A1 ES 410341A1
- Authority
- ES
- Spain
- Prior art keywords
- insulating material
- rings
- semiconductor element
- joining
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000011810 insulating material Substances 0.000 abstract 5
- 239000003292 glue Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 239000012212 insulator Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722221673 DE2221673C3 (de) | 1972-05-03 | Verfahren zum Herstellen eines Halbleiterbauelementes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES410341A1 true ES410341A1 (es) | 1976-01-01 |
Family
ID=5843952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES410341A Expired ES410341A1 (es) | 1972-05-03 | 1973-01-04 | Procedimiento para la fabricacion de un elemento semicon- ductor de construccion. |
Country Status (10)
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8928492D0 (en) * | 1989-12-18 | 1990-02-21 | Westinghouse Brake & Signal | Housings for semiconductor devices |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL123901C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1960-04-29 | |||
| JPS5128505B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-02-03 | 1976-08-19 | ||
| JPS5128505A (ja) * | 1974-09-04 | 1976-03-10 | Nippon Steel Corp | Yokoro |
-
1972
- 1972-12-04 FR FR7243020A patent/FR2182791B1/fr not_active Expired
- 1972-12-12 CH CH1808372A patent/CH548669A/xx not_active IP Right Cessation
- 1972-12-13 AT AT1062072A patent/AT339374B/de active
-
1973
- 1973-01-04 ES ES410341A patent/ES410341A1/es not_active Expired
- 1973-01-29 GB GB435973A patent/GB1362942A/en not_active Expired
- 1973-04-27 IT IT2347873A patent/IT984159B/it active
- 1973-05-02 CA CA170,224A patent/CA989523A/en not_active Expired
- 1973-05-02 JP JP4862273A patent/JPS4956587A/ja active Pending
- 1973-05-03 BE BE130692A patent/BE799037A/xx unknown
- 1973-05-03 NL NL7306175A patent/NL7306175A/xx unknown
-
1981
- 1981-09-16 JP JP13750481U patent/JPS5778648U/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2182791B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1977-12-30 |
| BE799037A (fr) | 1973-11-05 |
| DE2221673B2 (de) | 1977-04-14 |
| DE2221673A1 (de) | 1973-11-15 |
| ATA1062072A (de) | 1977-02-15 |
| AT339374B (de) | 1977-10-10 |
| NL7306175A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-11-06 |
| JPS4956587A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1974-06-01 |
| GB1362942A (en) | 1974-08-07 |
| JPS5778648U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1982-05-15 |
| IT984159B (it) | 1974-11-20 |
| FR2182791A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-12-14 |
| CA989523A (en) | 1976-05-18 |
| CH548669A (de) | 1974-04-30 |
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