ES395741A1 - Procedimiento para la preparacion de un electrolito acuoso acido para la deposicion de revestimientos de cobre. - Google Patents

Procedimiento para la preparacion de un electrolito acuoso acido para la deposicion de revestimientos de cobre.

Info

Publication number
ES395741A1
ES395741A1 ES71395741A ES395741A ES395741A1 ES 395741 A1 ES395741 A1 ES 395741A1 ES 71395741 A ES71395741 A ES 71395741A ES 395741 A ES395741 A ES 395741A ES 395741 A1 ES395741 A1 ES 395741A1
Authority
ES
Spain
Prior art keywords
copper bath
galvanic copper
acid galvanic
acid
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES71395741A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of ES395741A1 publication Critical patent/ES395741A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Conductive Materials (AREA)
ES71395741A 1970-10-29 1971-10-05 Procedimiento para la preparacion de un electrolito acuoso acido para la deposicion de revestimientos de cobre. Expired ES395741A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2053860A DE2053860C3 (de) 1970-10-29 1970-10-29 Saures wäßriges Bad zur galvanischen Abscheidung glänzender Kupferüberzüge

Publications (1)

Publication Number Publication Date
ES395741A1 true ES395741A1 (es) 1974-09-16

Family

ID=5786940

Family Applications (1)

Application Number Title Priority Date Filing Date
ES71395741A Expired ES395741A1 (es) 1970-10-29 1971-10-05 Procedimiento para la preparacion de un electrolito acuoso acido para la deposicion de revestimientos de cobre.

Country Status (18)

Country Link
US (1) US3767539A (ja)
JP (1) JPS5126893B1 (ja)
AT (1) AT307844B (ja)
AU (1) AU450638B2 (ja)
BE (1) BE774697A (ja)
BR (1) BR7107116D0 (ja)
CA (1) CA967110A (ja)
CH (1) CH563466A5 (ja)
DE (1) DE2053860C3 (ja)
ES (1) ES395741A1 (ja)
FR (1) FR2111926B1 (ja)
GB (1) GB1372850A (ja)
IE (1) IE35774B1 (ja)
NL (1) NL169353C (ja)
SE (1) SE364737B (ja)
SU (1) SU452107A3 (ja)
YU (1) YU34721B (ja)
ZA (1) ZA716879B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417956A (en) * 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4540473A (en) * 1983-11-22 1985-09-10 International Business Machines Corporation Copper plating bath having increased plating rate, and method
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE322956B (ja) * 1966-08-20 1970-04-20 Schering Ag
US3492135A (en) * 1967-02-01 1970-01-27 Schering Ag Stabilized bath for deposition of copper by chemical reduction
BE759316A (fr) * 1969-12-30 1971-04-30 Parker Ste Continentale Composition et procede pour former un depot de cuivre sur des surfaces de metaux ferreux

Also Published As

Publication number Publication date
CH563466A5 (ja) 1975-06-30
YU250971A (en) 1979-04-30
CA967110A (en) 1975-05-06
NL169353C (nl) 1982-07-01
IE35774L (en) 1972-04-29
IE35774B1 (en) 1976-05-12
DE2053860B2 (de) 1980-03-13
SE364737B (ja) 1974-03-04
DE2053860A1 (de) 1972-06-08
AU450638B2 (en) 1974-07-18
NL169353B (nl) 1982-02-01
GB1372850A (en) 1974-11-06
AT307844B (de) 1973-06-12
BR7107116D0 (pt) 1973-03-29
YU34721B (en) 1979-12-31
AU3473471A (en) 1973-05-03
FR2111926A1 (ja) 1972-06-09
JPS5126893B1 (ja) 1976-08-09
ZA716879B (en) 1972-06-28
US3767539A (en) 1973-10-23
BE774697A (fr) 1972-05-02
NL7114979A (ja) 1972-05-03
DE2053860C3 (de) 1980-11-06
FR2111926B1 (ja) 1974-10-11
SU452107A3 (ru) 1974-11-30

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